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Semiconductor Process Engineer H-1B roles in ID, FY2024

Exact-title LCA role declarations for Semiconductor Process Engineer in ID during FY2024. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 21 returned rows using keyset pagination.

RoleEmployerSOCStatus / visaDecisionWorksiteOffered wagePrevailing wageSource
Semiconductor Process Engineer
I-200-24254-327854
Micron Technology, Inc.17-2071.00
Electrical Engineers
Certified / H-1B
FY2024
2024-09-17
2024-10-01 to 2027-09-30
Boise, ID, 83716$95,000
year
$93,210sr_dol_oflc_lca_2024_q4_row_018793
Semiconductor Process Engineer
I-200-24226-263351
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-08-20
2024-10-01 to 2027-09-30
Boise, ID, 83707$115,140
year
$90,251sr_dol_oflc_lca_2024_q4_row_053922
Semiconductor Process Engineer
I-200-24207-222444
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-08-01
2024-08-02 to 2027-08-01
Boise, ID, 83716$118,000
year
$90,251sr_dol_oflc_lca_2024_q4_row_077689
Semiconductor Process Engineer
I-200-24205-215363
Micron Technology, Inc.17-2112.00
Industrial Engineers
Certified / H-1B
FY2024
2024-07-30
2024-08-26 to 2027-08-25
Boise, ID, 83716$105,000
year
$93,974sr_dol_oflc_lca_2024_q4_row_081397
Semiconductor Process Engineer
I-200-24201-209467
Micron Idaho Semiconductor Manufacturing (Triton) LLC17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-07-26
2024-08-12 to 2027-08-11
Boise, ID, 83716$120,000
year
$90,251sr_dol_oflc_lca_2024_q4_row_085318
Semiconductor Process Engineer
I-200-24162-089708
Micron Technology, Inc.17-2041.00
Chemical Engineers
Certified / H-1B
FY2024
2024-06-17
2024-10-01 to 2027-09-30
Boise, ID, 83716$90,000
year
$76,066sr_dol_oflc_lca_2024_q3_row_034029
Semiconductor Process Engineer
I-200-24152-057584
Micron Technology, Inc.17-2071.00
Electrical Engineers
Certified / H-1B
FY2024
2024-06-07
2024-10-01 to 2027-09-30
Boise, ID, 83716$95,000
year
$93,835sr_dol_oflc_lca_2024_q3_row_058443
Semiconductor Process Engineer
I-200-24151-051898
Micron Technology, Inc.17-2072.00
Electronics Engineers, Except Computer
Certified / H-1B
FY2024
2024-06-06
2024-10-01 to 2027-09-30
Boise, ID, 83716$119,025
year
$96,554sr_dol_oflc_lca_2024_q3_row_061828
Semiconductor Process Engineer
I-200-24150-046854
Micron Technology, Inc.17-2112.03
Manufacturing Engineers
Certified / H-1B
FY2024
2024-06-05
2024-10-01 to 2027-09-30
Boise, ID, 83716$92,250
year
$79,872sr_dol_oflc_lca_2024_q3_row_066102
Semiconductor Process Engineer
I-200-24149-042727
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-06-04
2024-10-01 to 2027-09-30
Boise, ID, 83716$109,200
year
$86,445sr_dol_oflc_lca_2024_q3_row_070647
Semiconductor Process Engineer
I-200-24145-034590
Micron Idaho Semiconductor Manufacturing (Triton) LLC17-2141.00
Mechanical Engineers
Certified / H-1B
FY2024
2024-06-03
2024-10-01 to 2027-09-30
Boise, ID, 83716$90,000
year
$66,997sr_dol_oflc_lca_2024_q3_row_072153
Semiconductor Process Engineer
I-200-24142-018483
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-29
2024-10-01 to 2027-09-30
Boise, ID, 83716$115,140
year
$110,760sr_dol_oflc_lca_2024_q3_row_084204
Semiconductor Process Engineer
I-200-24142-021147
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-29
2024-10-01 to 2027-09-30
Boise, ID, 83716$117,473
year
$110,760sr_dol_oflc_lca_2024_q3_row_085056
Semiconductor Process Engineer
I-200-24137-002245
Micron Technology, Inc.17-2071.00
Electrical Engineers
Certified / H-1B
FY2024
2024-05-23
2024-10-01 to 2027-09-30
Boise, ID, 83716$118,000
year
$115,544sr_dol_oflc_lca_2024_q3_row_095460
Semiconductor Process Engineer
I-200-24137-006148
Micron Idaho Semiconductor Manufacturing (Triton) LLC17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-23
2024-10-01 to 2027-09-30
Boise, ID, 83716$95,500
year
$86,445sr_dol_oflc_lca_2024_q3_row_096153
Semiconductor Process Engineer
I-200-24136-999679
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-22
2024-10-01 to 2027-09-30
Boise, ID, 83716$113,680
year
$110,760sr_dol_oflc_lca_2024_q3_row_099525
Semiconductor Process Engineer
I-200-24136-999563
Micron Technology, Inc.17-2071.00
Electrical Engineers
Certified / H-1B
FY2024
2024-05-22
2024-10-01 to 2027-09-30
Boise, ID, 83716$115,360
year
$95,555sr_dol_oflc_lca_2024_q3_row_099853
Semiconductor Process Engineer
I-200-24136-995976
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-21
2024-10-01 to 2027-09-30
Boise, ID, 83716$90,000
year
$86,445sr_dol_oflc_lca_2024_q3_row_102772
Semiconductor Process Engineer
I-200-24136-996037
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-21
2024-10-01 to 2027-09-30
Boise, ID, 83716$112,420
year
$110,760sr_dol_oflc_lca_2024_q3_row_102933
Semiconductor Process Engineer
I-200-24135-993029
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-21
2024-10-01 to 2027-09-30
Boise, ID, 83716$94,760
year
$86,445sr_dol_oflc_lca_2024_q3_row_103027
Semiconductor Process Engineer
I-200-24136-996050
Micron Technology, Inc.17-2131.00
Materials Engineers
Certified / H-1B
FY2024
2024-05-21
2024-10-01 to 2027-09-30
Boise, ID, 83716$90,000
year
$86,445sr_dol_oflc_lca_2024_q3_row_105556
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