Home / Roles / Titles / Microelectronics Packaging Engineer / NH / FY2025
Microelectronics Packaging Engineer H-1B roles in NH, FY2025
Exact-title LCA role declarations for Microelectronics Packaging Engineer in NH during FY2025. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 1 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Microelectronics Packaging Engineer I-200-25112-892152 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified / H-1B FY2025 | 2025-04-29 2025-09-30 to 2028-09-29 | Manchester, NH, 03103 | $100,402 year | $100,402 | sr_dol_oflc_lca_2025_q3_row_175134 |
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=microelectronics+packaging+engineer&title_match=exact&state=NH&fiscal_year=2025JSON