Home / Roles / Titles / Microelectronics Packaging Engineer / NH / FY2024
Microelectronics Packaging Engineer H-1B roles in NH, FY2024
Exact-title LCA role declarations for Microelectronics Packaging Engineer in NH during FY2024. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 2 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Microelectronics Packaging Engineer I-200-21314-697891 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified - Withdrawn / H-1B FY2024 | 2024-06-03 2022-01-04 to 2024-09-30 | Manchester, NH, 03103 | $95,000 year | $67,538 | sr_dol_oflc_lca_2024_q3_row_071862 |
| Microelectronics Packaging Engineer I-200-24120-936761 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified / H-1B FY2024 | 2024-05-06 2024-09-03 to 2027-09-02 | Manchester, NH, 03103 | $116,325 year | $103,875 | sr_dol_oflc_lca_2024_q3_row_144354 |
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=microelectronics+packaging+engineer&title_match=exact&state=NH&fiscal_year=2024JSON