Home / Roles / Titles / Packaging Engineer / OR / FY2023
Packaging Engineer H-1B roles in OR, FY2023
Exact-title LCA role declarations for Packaging Engineer in OR during FY2023. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 50 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Packaging Engineer I-200-23263-361220 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-09-27 2023-11-14 to 2026-11-13 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_010131 |
| Packaging Engineer I-200-23262-357058 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-09-26 2023-09-22 to 2026-09-21 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_011474 |
| Packaging Engineer I-200-23242-306454 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-09-07 2023-10-01 to 2026-09-30 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_040566 |
| Packaging Engineer I-200-23242-306457 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-09-07 2023-10-01 to 2026-09-30 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_040639 |
| Packaging Engineer I-200-23242-306480 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-09-07 2023-10-01 to 2026-09-30 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_041394 |
| Packaging Engineer I-200-23233-279723 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-08-28 2024-01-05 to 2027-01-04 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_054806 |
| Packaging Engineer I-200-23228-269570 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-08-23 2023-10-01 to 2026-09-30 | Aloha, OR, 97078 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_061514 |
| Packaging Engineer I-200-23212-225121 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-08-07 2023-08-02 to 2026-08-01 | Hillsboro, OR, 97124 | $103,147 to $187,350 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_087224 |
| Packaging Engineer I-200-23194-185471 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-07-20 2023-07-18 to 2026-07-17 | Hillsboro, OR, 97124 | $103,147 to $160,990 year | $103,147 | sr_dol_oflc_lca_2023_q4_row_106433 |
| Packaging Engineer I-200-23180-154155 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-07-07 2023-07-03 to 2026-07-02 | Hillsboro, OR, 97124 | $95,763 to $187,350 year | $95,763 | sr_dol_oflc_lca_2023_q4_row_122289 |
| Packaging Engineer I-200-23164-103133 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-06-20 2023-12-10 to 2026-12-09 | Hillsboro, OR, 97124 | $78,166 to $136,400 year | $78,166 | sr_dol_oflc_lca_2023_q3_row_023819 |
| Packaging Engineer I-200-23088-885146 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-04-05 2023-09-12 to 2026-09-11 | Aloha, OR, 97007 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q3_row_181531 |
| Packaging Engineer I-200-23083-874799 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-31 2023-08-10 to 2026-08-09 | Aloha, OR, 97078 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_000753 |
| Packaging Engineer I-200-23083-875175 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-31 2023-09-14 to 2026-09-13 | Aloha, OR, 97007 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_001487 |
| Packaging Engineer I-200-23082-871205 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-30 2023-09-13 to 2026-09-12 | Aloha, OR, 97007 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_004731 |
| Packaging Engineer I-200-23076-856522 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-24 2023-09-07 to 2026-09-06 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_013666 |
| Packaging Engineer I-200-23076-856505 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-24 2023-09-06 to 2026-09-05 | Hillsboro, OR, 97124 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_013795 |
| Packaging Engineer I-200-23076-856333 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-24 2023-09-07 to 2026-09-06 | Hillsboro, OR, 97124 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_014373 |
| Packaging Engineer I-200-23073-845916 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-21 2023-09-06 to 2026-09-05 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_020898 |
| Packaging Engineer I-200-23073-845250 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-21 2023-09-05 to 2026-09-04 | Aloha, OR, 97007 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_020974 |
| Packaging Engineer I-200-23073-846743 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-21 2023-09-05 to 2026-09-04 | Aloha, OR, 97007 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_021593 |
| Packaging Engineer I-200-23069-838210 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-17 2023-08-24 to 2026-08-23 | Hillsboro, OR, 97124 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_025698 |
| Packaging Engineer I-200-23068-834625 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-16 2023-09-06 to 2026-09-05 | Hillsboro, OR, 97124 | $78,166 to $136,400 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_027500 |
| Packaging Engineer I-200-23068-834754 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-16 2023-08-25 to 2026-08-24 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_028273 |
| Packaging Engineer I-200-23062-820155 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-10 2023-08-27 to 2026-08-26 | Aloha, OR, 97007 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_038424 |
| Packaging Engineer I-200-23062-820567 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-10 2023-08-24 to 2026-08-23 | Aloha, OR, 97078 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_038446 |
| Packaging Engineer I-200-23062-819964 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-10 2023-08-24 to 2026-08-23 | Aloha, OR, 97078 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_038642 |
| Packaging Engineer I-200-23058-805029 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-06 2023-07-06 to 2026-07-05 | Oregon, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_048929 |
| Packaging Engineer I-200-23055-800619 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-03 2023-08-15 to 2026-08-14 | Hillsboro, OR, 97124 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_052494 |
| Packaging Engineer I-200-23054-796473 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-02 2023-02-27 to 2026-02-26 | Aloha, OR, 97078 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_053848 |
| Packaging Engineer I-200-23053-792373 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-03-01 2023-02-22 to 2026-02-21 | Aloha, OR, 97078 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_056383 |
| Packaging Engineer I-200-23048-782701 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-24 2023-08-11 to 2026-08-10 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_064627 |
| Packaging Engineer I-200-23048-782693 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-24 2023-08-13 to 2026-08-12 | Hillsboro, OR, 97124 | $95,763 to $187,350 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_065099 |
| Packaging Engineer I-200-23041-764436 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-17 2023-08-07 to 2026-08-06 | Aloha, OR, 97078 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_076293 |
| Packaging Engineer I-200-23035-750787 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-10 2023-07-30 to 2026-07-29 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_084871 |
| Packaging Engineer I-200-23035-750789 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-10 2023-07-30 to 2026-07-29 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_084902 |
| Packaging Engineer I-200-23035-750776 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-10 2023-08-02 to 2026-08-01 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_084909 |
| Packaging Engineer I-200-23032-741306 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-08 2023-07-31 to 2026-07-30 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_089135 |
| Packaging Engineer I-200-23032-741234 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-08 2023-07-25 to 2026-07-24 | Hillsboro, OR, 97124 | $78,166 to $114,340 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_090007 |
| Packaging Engineer I-200-23030-735189 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-06 2023-07-17 to 2026-07-16 | Hillsboro, OR, 97124 | $113,339 to $221,610 year | $113,339 | sr_dol_oflc_lca_2023_q2_row_093532 |
| Packaging Engineer I-200-23025-725069 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-01-31 2023-07-03 to 2026-07-02 | Hillsboro, OR, 97124 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_100728 |
| Packaging Engineer I-200-23024-722548 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-01-31 2023-07-05 to 2026-07-04 | Hillsboro, OR, 97124 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_101862 |
| Packaging Engineer I-200-23020-715811 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-27 2023-07-03 to 2026-07-02 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_105710 |
| Packaging Engineer I-200-23019-712819 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-26 2023-07-05 to 2026-07-04 | Aloha, OR, 97078 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_107709 |
| Packaging Engineer I-200-23016-704887 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-23 2023-07-10 to 2026-07-09 | Hillsboro, OR, 97124 | $78,166 to $136,400 year | $78,166 | sr_dol_oflc_lca_2023_q2_row_112339 |
| Packaging Engineer I-200-23013-700189 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-20 2023-07-06 to 2026-07-05 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_113343 |
| Packaging Engineer I-200-23011-694519 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-01-18 2023-07-05 to 2026-07-04 | Hillsboro, OR, 97124 | $115,482 to $160,990 year | $115,482 | sr_dol_oflc_lca_2023_q2_row_117731 |
| Packaging Engineer I-200-23006-685307 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-13 2023-06-22 to 2026-06-21 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_122027 |
| Packaging Engineer I-200-22360-660182 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-02 2023-06-18 to 2026-06-17 | Hillsboro, OR, 97124 | $95,763 to $160,990 year | $95,763 | sr_dol_oflc_lca_2023_q2_row_132605 |
| Packaging Engineer I-200-22360-660148 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-01-02 2023-06-19 to 2026-06-18 | Aloha, OR, 97007 | $96,013 to $114,340 year | $96,013 | sr_dol_oflc_lca_2023_q2_row_132608 |
Get this page with API
Rendered from the bluedoor H-1B Jobs API. Reproduce it:
GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=packaging+engineer&title_match=exact&state=OR&fiscal_year=2023JSON