Home / Roles / Titles / Packaging Development Engineering Manager / NY / FY2023
Packaging Development Engineering Manager H-1B roles in NY, FY2023
Exact-title LCA role declarations for Packaging Development Engineering Manager in NY during FY2023. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 1 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Packaging Development Engineering Manager I-200-23065-825402 | IBM Corporation | 17-2199.06 Microsystems Engineers | Certified / H-1B FY2023 | 2023-03-13 2023-03-24 to 2026-03-23 | Hopewell Junction, NY, 12533 | $161,498 year | $94,619 | sr_dol_oflc_lca_2023_q2_row_034826 |
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=packaging+development+engineering+manager&title_match=exact&state=NY&fiscal_year=2023JSON