Home / Roles / Titles / Packaging Development Engineering Manager / NY / FY2023
Packaging Development Engineering Manager H-1B roles in NY, FY2023
Exact-title LCA role declarations for Packaging Development Engineering Manager in NY during FY2023. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 1 returned rows using keyset pagination.
Summary
This view lists 1 H-1B LCA role records.
Offered wages among the returned rows range from $161,498 to $161,498.
Employers in the returned rows include IBM Corporation.
LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Packaging Development Engineering Manager I-200-23065-825402 | IBM Corporation | 17-2199.06 Microsystems Engineers | Certified / H-1B FY2023 | 2023-03-13 2023-03-24 to 2026-03-23 | Hopewell Junction, NY, 12533 | $161,498 year | $94,619 | sr_dol_oflc_lca_2023_q2_row_034826 |
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Frequently asked questions
- What are the offered H-1B wages for Packaging Development Engineering Manager H-1B roles in NY, FY2023?
- Offered wages among the returned Packaging Development Engineering Manager H-1B roles in NY, FY2023 rows range from $161,498 to $161,498 in DOL LCA filings. LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
Get this page with API
Rendered from the bluedoor H-1B Jobs API. Reproduce it:
GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=packaging+development+engineering+manager&title_match=exact&state=NY&fiscal_year=2023JSON