Home / Roles / Titles / Microelectronics Packaging Thermal Engineer / NY / FY2025
Microelectronics Packaging Thermal Engineer H-1B roles in NY, FY2025
Exact-title LCA role declarations for Microelectronics Packaging Thermal Engineer in NY during FY2025. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 1 returned rows using keyset pagination.
Summary
This view lists 1 H-1B LCA role records.
Offered wages among the returned rows range from $166,060 to $166,060.
Employers in the returned rows include IBM Corporation.
LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Microelectronics Packaging Thermal Engineer I-200-25132-966685 | IBM Corporation | 17-2061.00 Computer Hardware Engineers | Certified / H-1B FY2025 | 2025-05-19 2025-10-01 to 2028-09-30 | Hopewell Junction, NY, 12533 | $166,060 year | $165,942 | sr_dol_oflc_lca_2025_q3_row_120383 |
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Frequently asked questions
- What are the offered H-1B wages for Microelectronics Packaging Thermal Engineer H-1B roles in NY, FY2025?
- Offered wages among the returned Microelectronics Packaging Thermal Engineer H-1B roles in NY, FY2025 rows range from $166,060 to $166,060 in DOL LCA filings. LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
Get this page with API
Rendered from the bluedoor H-1B Jobs API. Reproduce it:
GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=microelectronics+packaging+thermal+engineer&title_match=exact&state=NY&fiscal_year=2025JSON