Home / Roles / Titles / Microelectronics Packaging Engineer / NH / FY2022
Microelectronics Packaging Engineer H-1B roles in NH, FY2022
Exact-title LCA role declarations for Microelectronics Packaging Engineer in NH during FY2022. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 2 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Microelectronics Packaging Engineer I-200-22146-216911 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified / H-1B FY2022 | 2022-06-03 2022-10-01 to 2025-09-30 | Manchester, NH, 3103 | $87,975 year | $85,634 | sr_dol_oflc_lca_2022_q3_row_162596 |
| Microelectronics Packaging Engineer I-200-21314-697891 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified / H-1B FY2022 | 2021-11-18 2022-01-04 to 2024-09-30 | Manchester, NH, 3103 | $95,000 year | $67,538 | sr_dol_oflc_lca_2022_q1_row_064563 |
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=microelectronics+packaging+engineer&title_match=exact&state=NH&fiscal_year=2022JSON