Home / Roles / Titles / Microelectronics Packaging Engineer / NH / FY2021
Microelectronics Packaging Engineer H-1B roles in NH, FY2021
Exact-title LCA role declarations for Microelectronics Packaging Engineer in NH during FY2021. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 2 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Microelectronics Packaging Engineer I-200-21215-499896 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified / H-1B FY2021 | 2021-08-10 2021-09-04 to 2024-09-03 | Manchester, NH, 3103 | $100,000 year | $67,538 | sr_dol_oflc_lca_2021_q4_row_052337 |
| Microelectronics Packaging Engineer I-200-21130-299120 | Allegro MicroSystems, LLC | 17-2131.00 Materials Engineers | Certified / H-1B FY2021 | 2021-05-17 2021-10-01 to 2024-09-30 | Manchester, NH, 3103 | $95,000 year | $63,606 | sr_dol_oflc_lca_2021_q3_row_308013 |
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=microelectronics+packaging+engineer&title_match=exact&state=NH&fiscal_year=2021JSON