Home / Roles / Titles / Lead Embedded Software Engineer / OH / FY2021
Lead Embedded Software Engineer H-1B roles in OH, FY2021
Exact-title LCA role declarations for Lead Embedded Software Engineer in OH during FY2021. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 2 returned rows using keyset pagination.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Lead Embedded Software Engineer I-200-21019-019345 | Bridgestone Americas, Inc. | 15-1133.00 Software Developers, Systems Software | Certified / H-1B FY2021 | 2021-01-25 2021-07-08 to 2024-07-07 | Akron, OH, 44301 | $111,240 year | $102,128 | sr_dol_oflc_lca_2021_q3_row_101194 |
| Lead Embedded Software Engineer I-200-21019-019345 | Bridgestone Americas, Inc. | 15-1133.00 Software Developers, Systems Software | Certified / H-1B FY2021 | 2021-01-25 2021-07-08 to 2024-07-07 | Akron, OH, 44301 | $111,240 year | $102,128 | sr_dol_oflc_lca_2021_q2_row_106736 |
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=lead+embedded+software+engineer&title_match=exact&state=OH&fiscal_year=2021JSON