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3 active postings matched department "Engineering, Package & Assembly". Showing the first 3 jobs.
Job matches
| Title | Company | Location | Role group | ATS | Work | Salary | Dates |
|---|---|---|---|---|---|---|---|
| Semiconductor Packaging Modeling and Simulation Engineer | Hctz Fa Us2 Oraclecloud Com Cx 1001 | Scottsdale, AZ, United States | Engineering, Package & Assembly | Oracle Recruiting Cloud / Fusion HCM | active Full Time | $146,970–$249,780 / year | Posted 2026-05-12 First seen 2026-05-31 Changed 2026-05-31 |
| Sr Director of Module Development | Hctz Fa Us2 Oraclecloud Com Cx 1001 | Scottsdale, AZ, United States | Engineering, Package & Assembly | Oracle Recruiting Cloud / Fusion HCM | active Full Time | — | Posted 2026-06-01 First seen 2026-05-31 Changed 2026-06-06 |
| Staff, Semiconductor System Level Simulation Engineer | Hctz Fa Us2 Oraclecloud Com Cx 1001 | Scottsdale, AZ, United States | Engineering, Package & Assembly | Oracle Recruiting Cloud / Fusion HCM | active Full Time | — | Posted 2026-06-04 First seen 2026-06-06 Changed 2026-06-06 |
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