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Semiconductor Packaging Modeling and Simulation Engineer

Hctz Fa Us2 Oraclecloud Com Cx 1001 · Scottsdale, AZ, United States; USAZ01 151 ON HDQTRS US8, Scottsdale, AZ, US; USCA70 ROSE ORCHARD SAN JOSE, San Jose, CA, US · Active · $146,970–$249,780 / year · Oracle Recruiting Cloud / Fusion HCM

Job facts

FieldValue
CompanyHctz Fa Us2 Oraclecloud Com Cx 1001
TitleSemiconductor Packaging Modeling and Simulation Engineer
Normalized title-
Department / teamEngineering, Package & Assembly
LocationScottsdale, AZ, United States
Work model-
Employment typeFull Time
Salary$146,970–$249,780 / year
Statusactive
ATS providerOracle Recruiting Cloud / Fusion HCM
Posted / first seen2026-05-12 / 2026-05-31
Changed / last seen2026-05-31 / 2026-06-06

Related slices

PageWhat it containsOpen
Company jobsActive postings from Hctz Fa Us2 Oraclecloud Com Cx 1001.Open
Company breakdownsRole, location, ATS, and work model facets for this company.Open
ATS provider jobsActive postings observed through Oracle Recruiting Cloud / Fusion HCM.Open
Provider filtered searchThe same provider as a filtered job collection.Open
City jobsActive postings in Scottsdale.Open
Department jobsActive postings in Engineering, Package & Assembly.Open
Lifecycle eventsOpen, update, close, and reopen events for this posting.Open
Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyHctz Fa Us2 Oraclecloud Com Cx 1001
Source785c81aa-1b1b-46b0-bafd-ca226d542e7a
ATS providerOracle Recruiting Cloud / Fusion HCM

Description

Description onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in (Phoenix AZ or San Jose, CA). As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide. Responsibilities The successful candidate will have the opportunity to: •    Do thermal-mech simulation for microelectronic packaging and system, assembly process such as Ag sintering and Cu sintering •    Analyze existing packages of reliability issues that are induced by thermal problems. •    Do analysis and correlation of thermal mech modeling results to measured data •    Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy •    Setup and maintain the HW/SW environment for thermal modeling •    Provide support to other thermal mech modeling users in the company •    Innovation of new technology through simulation •    Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models Qualifications •    Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials •    Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process •    Knowledge and experience of CAD concepts and Solidworks •    Familiar with semiconductor packaging •    Familiar with material thermal mech properties •    Strong knowledge of problem analysis and diagnosis technique •    Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination •    Familiar with package test and analysis, quality assurance, and reliability methods •    Ability to perform model correlation to empirical measurement •    Familiar with the Unix/Linux operating system •    Familiar with FEA software ANSYS Mechanical APDL/Work Bench •    Strong English communication capability •    Strong learning capability •    Good team player onsemi (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions. onsemi is excited to share the base salary range for this position is $146,970 to $249,780 Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf Organization We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [email protected] for assistance. Company onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

Full job record

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Source ID785c81aa-1b1b-46b0-bafd-ca226d542e7a
Board ID785c81aa-1b1b-46b0-bafd-ca226d542e7a
Provideroracle_hcm
Provider Job Key2505384
TitleSemiconductor Packaging Modeling and Simulation Engineer
Normalized Title
Statusactive
Activeyes
Location TextScottsdale, AZ, United States; USAZ01 151 ON HDQTRS US8, Scottsdale, AZ, US; USCA70 ROSE ORCHARD SAN JOSE, San Jose, CA, US
DepartmentEngineering, Package & Assembly
Team
Employment Typefull_time
Workplace Type
Remote Policy
CountryUnited States
RegionAZ
CityScottsdale
Salary Rawsalary range for this position is $146,970 to $249,780 Range exclusive of fringe benefits or potential bonuses
Salary Min146,970
Salary Max249,780
Salary CurrencyUSD
Salary Periodyear
Source URLhttps://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/cx_1001/job/2505384
Apply URLhttps://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/cx_1001/job/2505384
First Seen At2026-05-31 18:04:51Z
Last Seen At2026-06-06 11:27:55Z
Last Checked At2026-06-06 11:27:55Z
Last Changed At2026-05-31 18:04:51Z
Inactive At
Source Posted At2026-05-12 13:58:55Z
Source Updated At
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