Home › Companies › Hctz Fa Us2 Oraclecloud Com Cx 1001 › Semiconductor Packaging Modeling and Simulation Engineer
Semiconductor Packaging Modeling and Simulation Engineer
Hctz Fa Us2 Oraclecloud Com Cx 1001 · Scottsdale, AZ, United States; USAZ01 151 ON HDQTRS US8, Scottsdale, AZ, US; USCA70 ROSE ORCHARD SAN JOSE, San Jose, CA, US · Active · $146,970–$249,780 / year · Oracle Recruiting Cloud / Fusion HCM
Job facts
| Field | Value |
|---|---|
| Company | Hctz Fa Us2 Oraclecloud Com Cx 1001 |
| Title | Semiconductor Packaging Modeling and Simulation Engineer |
| Normalized title | - |
| Department / team | Engineering, Package & Assembly |
| Location | Scottsdale, AZ, United States |
| Work model | - |
| Employment type | Full Time |
| Salary | $146,970–$249,780 / year |
| Status | active |
| ATS provider | Oracle Recruiting Cloud / Fusion HCM |
| Posted / first seen | 2026-05-12 / 2026-05-31 |
| Changed / last seen | 2026-05-31 / 2026-06-06 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from Hctz Fa Us2 Oraclecloud Com Cx 1001. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through Oracle Recruiting Cloud / Fusion HCM. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in Scottsdale. | Open |
| Department jobs | Active postings in Engineering, Package & Assembly. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | Hctz Fa Us2 Oraclecloud Com Cx 1001 |
| Source | 785c81aa-1b1b-46b0-bafd-ca226d542e7a |
| ATS provider | Oracle Recruiting Cloud / Fusion HCM |
Description
Description
onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in (Phoenix AZ or San Jose, CA). As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Responsibilities
The successful candidate will have the opportunity to:
• Do thermal-mech simulation for microelectronic packaging and system, assembly process
such as Ag sintering and Cu sintering
• Analyze existing packages of reliability issues that are induced by thermal problems.
• Do analysis and correlation of thermal mech modeling results to measured data
• Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for thermal modeling
• Provide support to other thermal mech modeling users in the company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models
Qualifications
• Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging
• Familiar with material thermal mech properties
• Strong knowledge of problem analysis and diagnosis technique
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench
• Strong English communication capability
• Strong learning capability
• Good team player
onsemi (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
onsemi is excited to share the base salary range for this position is $146,970 to $249,780 Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
Organization
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.
If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [email protected] for assistance.
Company
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Full job record
| Job ID | f6f6679faff5d4f01b22dec390863811970292b2 |
| Org ID | 10c648c2-de4b-4b9b-9767-fb19e9d49cc9 |
| Source ID | 785c81aa-1b1b-46b0-bafd-ca226d542e7a |
| Board ID | 785c81aa-1b1b-46b0-bafd-ca226d542e7a |
| Provider | oracle_hcm |
| Provider Job Key | 2505384 |
| Title | Semiconductor Packaging Modeling and Simulation Engineer |
| Normalized Title | — |
| Status | active |
| Active | yes |
| Location Text | Scottsdale, AZ, United States; USAZ01 151 ON HDQTRS US8, Scottsdale, AZ, US; USCA70 ROSE ORCHARD SAN JOSE, San Jose, CA, US |
| Department | Engineering, Package & Assembly |
| Team | — |
| Employment Type | full_time |
| Workplace Type | — |
| Remote Policy | — |
| Country | United States |
| Region | AZ |
| City | Scottsdale |
| Salary Raw | salary range for this position is $146,970 to $249,780 Range exclusive of fringe benefits or potential bonuses |
| Salary Min | 146,970 |
| Salary Max | 249,780 |
| Salary Currency | USD |
| Salary Period | year |
| Source URL | https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/cx_1001/job/2505384 |
| Apply URL | https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/cx_1001/job/2505384 |
| First Seen At | 2026-05-31 18:04:51Z |
| Last Seen At | 2026-06-06 11:27:55Z |
| Last Checked At | 2026-06-06 11:27:55Z |
| Last Changed At | 2026-05-31 18:04:51Z |
| Inactive At | — |
| Source Posted At | 2026-05-12 13:58:55Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=oracle_hcm/board=hctz.fa.us2.oraclecloud.com|cx_1001/date=2026-06-06/2026-06-06T11-27-21-008Z-9f838748694785e71a6bc319d2d110763f58c73306dffdd58f4666c0361c109f.json |
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