Home / Roles / Titles / Packaging Engineer / CA / FY2023
Packaging Engineer H-1B roles in CA, FY2023
Exact-title LCA role declarations for Packaging Engineer in CA during FY2023. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 12 returned rows using keyset pagination.
Summary
This view lists 12 H-1B LCA role records.
Offered wages among the returned rows range from $100,000 to $216,000.
Employers in the returned rows include Qualcomm Technologies, Inc., Tesla, Inc., Texas Instruments Incorporated, Celestial AI Inc., Intel Corporation.
LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Packaging Engineer I-200-23160-094163 | Qualcomm Technologies, Inc. | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-06-16 2023-10-01 to 2026-09-30 | San Diego, CA, 92121 | $144,000 to $216,000 year | $104,562 | sr_dol_oflc_lca_2023_q3_row_030377 |
| Packaging Engineer I-200-23159-089962 | Qualcomm Technologies, Inc. | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-06-15 2023-10-01 to 2026-09-30 | San Diego, CA, 92128 | $144,000 to $216,000 year | $104,562 | sr_dol_oflc_lca_2023_q3_row_034332 |
| PACKAGING ENGINEER I-200-23076-858875 | Tesla, Inc. | 17-2112.00 Industrial Engineers | Certified / H-1B FY2023 | 2023-03-24 2023-04-03 to 2026-04-02 | Fremont, CA, 94538 | $100,000 year | $97,282 | sr_dol_oflc_lca_2023_q2_row_014294 |
| Packaging Engineer I-200-22202-367874 | Texas Instruments Incorporated | 17-2131.00 Materials Engineers | Certified - Withdrawn / H-1B FY2023 | 2023-03-23 2022-08-24 to 2025-08-23 | Santa Clara, CA, 95051 | $170,000 year | $155,314 | sr_dol_oflc_lca_2023_q2_row_017098 |
| Packaging Engineer I-200-23068-836212 | Celestial AI Inc. | 17-2141.00 Mechanical Engineers | Certified / H-1B FY2023 | 2023-03-16 2023-03-20 to 2026-03-19 | Santa Clara, CA, 95054 | $120,000 year | $112,819 | sr_dol_oflc_lca_2023_q2_row_028531 |
| Packaging Engineer I-200-23061-816359 | Intel Corporation | 17-2131.00 Materials Engineers | Certified / H-1B FY2023 | 2023-03-09 2023-08-16 to 2026-08-15 | Santa Clara, CA, 95054 | $134,514 to $186,240 year | $134,514 | sr_dol_oflc_lca_2023_q2_row_041203 |
| Packaging Engineer I-200-23045-771236 | Qualcomm Technologies, Inc. | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-02-21 2023-06-27 to 2026-06-26 | San Diego, CA, 92126 | $104,562 to $147,500 year | $104,562 | sr_dol_oflc_lca_2023_q2_row_071267 |
| Packaging Engineer I-200-23013-700443 | Qualcomm Technologies, Inc. | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2023-01-20 2023-06-27 to 2026-06-26 | San Diego, CA, 92121 | $104,562 to $147,500 year | $104,562 | sr_dol_oflc_lca_2023_q2_row_114510 |
| Packaging Engineer I-200-22327-603378 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2022-12-01 2022-11-28 to 2025-11-27 | San Diego, CA, 92127 | $104,562 to $143,200 year | $104,562 | sr_dol_oflc_lca_2023_q1_row_028142 |
| Packaging Engineer I-200-22327-603378 | Intel Corporation | 17-2072.00 Electronics Engineers, Except Computer | Certified / H-1B FY2023 | 2022-12-01 2022-11-28 to 2025-11-27 | San Diego, CA, 92127 | $104,562 to $143,200 year | $104,562 | sr_dol_oflc_lca_2023_q2_row_163922 |
| Packaging Engineer I-200-22320-589342 | Genentech, Inc. | 17-2112.00 Industrial Engineers | Certified / H-1B FY2023 | 2022-11-22 2023-03-22 to 2026-03-21 | South San Francisco, CA, 94080 | $132,163 to $211,500 year | $132,163 | sr_dol_oflc_lca_2023_q1_row_036794 |
| Packaging Engineer I-200-22320-589342 | Genentech, Inc. | 17-2112.00 Industrial Engineers | Certified / H-1B FY2023 | 2022-11-22 2023-03-22 to 2026-03-21 | South San Francisco, CA, 94080 | $132,163 to $211,500 year | $132,163 | sr_dol_oflc_lca_2023_q2_row_174292 |
End of returned pageReset
Frequently asked questions
- What are the offered H-1B wages for Packaging Engineer H-1B roles in CA, FY2023?
- Offered wages among the returned Packaging Engineer H-1B roles in CA, FY2023 rows range from $100,000 to $216,000 in DOL LCA filings. LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
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