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Firmware Engineer Ii H-1B roles in WI, FY2026

Exact-title LCA role declarations for Firmware Engineer Ii in WI during FY2026. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 2 returned rows using keyset pagination.

Summary

This view lists 2 H-1B LCA role records.

Offered wages among the returned rows range from $96,000 to $117,832.

Employers in the returned rows include Milwaukee Electric Tool Corporation.

LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.

RoleEmployerSOCStatus / visaDecisionWorksiteOffered wagePrevailing wageSource
Firmware Engineer II
I-200-26024-587814
Milwaukee Electric Tool Corporation17-2071.00
Electrical Engineers
Certified / H-1B
FY2026
2026-01-30
2026-05-25 to 2029-05-24
Brookfield, WI, 53005$117,832
year
$89,939sr_dol_oflc_lca_2026_q2_row_086571
Firmware Engineer II
I-200-26020-572354
Milwaukee Electric Tool Corporation17-2071.00
Electrical Engineers
Certified / H-1B
FY2026
2026-01-27
2026-07-08 to 2029-07-07
Brookfield, WI, 53005$96,000
year
$89,939sr_dol_oflc_lca_2026_q2_row_093965
End of returned pageReset

Frequently asked questions

What are the offered H-1B wages for Firmware Engineer Ii H-1B roles in WI, FY2026?
Offered wages among the returned Firmware Engineer Ii H-1B roles in WI, FY2026 rows range from $96,000 to $117,832 in DOL LCA filings. LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
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GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=firmware+engineer+ii&title_match=exact&state=WI&fiscal_year=2026JSON