Home / Roles / Titles / Device Application Engineer / OH / FY2025
Device Application Engineer H-1B roles in OH, FY2025
Exact-title LCA role declarations for Device Application Engineer in OH during FY2025. Rows include employer, SOC, worksite, status, decision date, offered wage, prevailing wage, and source evidence. Showing 1 returned rows using keyset pagination.
Summary
This view lists 1 H-1B LCA role records.
Offered wages among the returned rows range from $87,153 to $87,153.
Employers in the returned rows include Avery Dennison Corporation.
LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
| Role | Employer | SOC | Status / visa | Decision | Worksite | Offered wage | Prevailing wage | Source |
|---|---|---|---|---|---|---|---|---|
| Device Application Engineer I-200-25066-753980 | Avery Dennison Corporation | 15-1252.00 Software Developers | Certified / H-1B FY2025 | 2025-03-13 2025-09-05 to 2028-09-04 | Miamisburg, OH, 45342 | $87,153 year | $72,987 | sr_dol_oflc_lca_2025_q2_row_029148 |
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Frequently asked questions
- What are the offered H-1B wages for Device Application Engineer H-1B roles in OH, FY2025?
- Offered wages among the returned Device Application Engineer H-1B roles in OH, FY2025 rows range from $87,153 to $87,153 in DOL LCA filings. LCA filings are labor-condition applications certified by the U.S. Department of Labor, not active job postings or approved USCIS H-1B petitions.
Get this page with API
Rendered from the bluedoor H-1B Jobs API. Reproduce it:
GET https://api.bluedoor.sh/h1b-jobs/v1/roles?limit=50&title=device+application+engineer&title_match=exact&state=OH&fiscal_year=2025JSON