Mechanical Packaging Engineer

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The mechanical engineer will collaborate closely with cross-functional engineering teams to capture product concepts, doc</span><span style=\"color:black;font-size:12pt;white-space:pre-wrap;\">ument co</span><span style=\"color:black;background-color:rgb(255,255,255);font-size:12pt;white-space:pre-wrap;\">mponent, and process flows, and perform analytical studies on material and packaging</span><span style=\"white-space:pre-wrap;\">&nbsp;</span><span style=\"color:rgb(36,36,36);background-color:rgb(255,255,255);font-size:12pt;white-space:pre-wrap;\">design that meets final product requirements</span><span style=\"color:black;background-color:rgb(255,255,255);font-size:12pt;white-space:pre-wrap;\">.</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:18pt;white-space:pre-wrap;\">Responsibilities:</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Design and develop advanced packaging solutions using CAD tools (primarily SolidWorks), including detailed 3D models and 2D engineering drawings that meet industry standards and internal guidelines.</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Collaborate closely with manufacturing and operations teams to ensure successful implementation of packaging designs, providing hands-on engineering support during production ramp and issue resolution.</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Document component flow across assembly, test, and packaging processes to support design decisions and manufacturing readiness.</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Support material and package selection, including epoxies, mechanical housings, and other structural components, with consideration for performance, reliability, and manufacturability.</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Perform mechanical analyses such as thermal, structural, strain, and root-sum-square (RSS) tolerance analysis to ensure robustness and reliability of package designs.</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Create clear visualizations and renderings for design reviews, technical discussions, and stakeholder presentations.</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Contribute to continuous improvement of engineering documentation, design standards, and development workflows.</span></li></ul><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:18pt;white-space:pre-wrap;\">Qualifications:</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Bachelor’s degree in Mechanical Engineering, Materials Engineering, or a related field, with </span><b><strong style=\"white-space:pre-wrap;\">3+ years of experience in semiconductor advanced packaging and design</strong></b><span style=\"white-space:pre-wrap;\">.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Strong proficiency in SolidWorks for 3D modeling and 2D drafting; experience with SolidWorks Visualize or similar rendering tools preferred.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Solid understanding of mechanical design principles, materials behavior, and design for assembly and manufacturability (DFM/DFA).</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience performing thermal and structural analyses; familiarity with Ansys or equivalent multiphysics simulation tools is a plus.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Working knowledge of JEDEC and other relevant packaging standards.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Strong understanding of packaging materials, manufacturing processes, and quality/regulatory requirements.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Proficient in Microsoft Office tools for documentation, reporting, and presentations.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Excellent communication, documentation, and cross-functional collaboration skills.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Proven ability to manage multiple projects, work independently, and meet deadlines in a fast-paced environment.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Strong analytical thinking and problem-solving skills.</span></li></ul>",
      "company": "<meta><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:11pt;white-space:pre-wrap;\">Avicena</strong></b><span style=\"font-size:11pt;white-space:pre-wrap;\">&nbsp;is a privately held company developing&nbsp;microLED&nbsp;based ultra-low power high bandwidth interconnects for chip-to-chip communications.  This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace.&nbsp;Avicena&nbsp;is headquartered in&nbsp;Sunnyvale, California with a development center in&nbsp;Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with&nbsp;a track record&nbsp;of delivering breakthrough products.  (</span><a href=\"http://www.avicena.tech/\" target=\"_blank\" class=\"css-173makr-linkStyle\" style=\"color:rgb(30,74,169);cursor:pointer;\"><span style=\"white-space:pre-wrap;\">www.avicena.tech</span></a><span style=\"font-size:11pt;white-space:pre-wrap;\">) &nbsp;</span><span style=\"white-space:pre-wrap;\">&nbsp;</span></p>"
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