Microwave Technician II

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      "Value": "<span style=\"font-size:11pt\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b><span style=\"font-size:12.0pt\"><span style=\"line-height:107%\">Please Note this position supports our 2<sup>nd</sup> Shift. You will be paid a 10% Pay Premium while working the 2<sup>nd</sup> Shift from 3:30PM to 2:00AM -- 4/10 work week -- Working Monday to Thursday every Friday off.</span></span></b><br><br>See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely.</span></span></span><br><span style=\"font-size:11pt\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Role Summary</b></span></span></span><br><span style=\"font-size:11pt\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\">The MRSI Die Bonding Assembly Technician is responsible for the high-precision attachment of semiconductor dies to substrates, specifically within the production of RF and microwave components. This role requires extreme attention to detail, mastery of micro-assembly techniques, and the ability to work under high-magnification optics to ensure the electrical and mechanical integrity of mission-critical components.</span></span></span><br><span style=\"font-size:11pt\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Key Responsibilities</b></span></span></span><ul style=\"margin-bottom:11px; list-style-type:circle\"><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Die Attach Operations:</b>&nbsp;Perform precision die bonding using various methods, including epoxy bonding and eutectic bonding, ensuring accurate placement and orientation of dies on substrates.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Equipment Operation:</b>&nbsp;Operate and maintain automated and semi-automated die bonders and curing ovens.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Microscope Proficiency:</b>&nbsp;Utilize high-power microscopes for alignment, inspection, and verification of bond quality and die placement.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Quality Control:</b>&nbsp;Conduct visual inspections and perform in-process quality checks to ensure components meet strict RF microwave specifications and tolerances.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Technical Documentation:</b>&nbsp;Maintain accurate production logs, route sheets, and quality reports. Document any deviations or non-conformances in accordance with factory standards.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Collaboration:</b>&nbsp;Work closely with Process Engineers to optimize bonding parameters and troubleshooting assembly failures.</span></span></span></span></li></ul><span style=\"font-size:11pt\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\"><b>Physical Requirements</b></span></span></span><ul style=\"margin-bottom:11px; list-style-type:circle\"><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\">Ability to sit or stand for long periods while performing precision work.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\">Manual dexterity required for handling fragile components and small tools.</span></span></span></span></li><li style=\"margin-bottom:11px\"><span style=\"font-size:11pt\"><span style=\"tab-stops:list .5in\"><span style=\"line-height:107%\"><span style=\"font-family:Calibri,sans-serif\">Ability to work in a controlled cleanroom environment.</span></span></span></span></li></ul><div style=\"margin-bottom:11px\"><br><br>&nbsp;</div>",
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