Home › Companies › Renesaselectronics › Director of Advanced IC Packaging Development
Director of Advanced IC Packaging Development
Renesaselectronics · San Jose, CALIFORNIA, United States · Hybrid · Deleted · $200,000–$250,000 / day · SmartRecruiters
Job facts
| Field | Value |
|---|---|
| Company | Renesaselectronics |
| Title | Director of Advanced IC Packaging Development |
| Normalized title | - |
| Department / team | Engineering |
| Location | San Jose, CA, United States |
| Work model | Hybrid / Hybrid |
| Employment type | Full Time |
| Salary | $200,000–$250,000 / day |
| Status | deleted |
| ATS provider | SmartRecruiters |
| Posted / first seen | 2026-05-13 / 2026-05-31 |
| Changed / last seen | 2026-06-06 / 2026-06-04 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from Renesaselectronics. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through SmartRecruiters. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in San Jose. | Open |
| Department jobs | Active postings in Engineering. | Open |
| Work model jobs | Active Hybrid postings. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | Renesaselectronics |
| Source | 39f58afe-87d4-4c84-b37a-4d3a26e8dbfe |
| ATS provider | SmartRecruiters |
Description
Renesas is seeking a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency.
Responsibilities:
1. Technology Roadmap & R&D Strategy
Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) . Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand. Establish and maintain corporate package design rules to ensure manufacturability and reliability 2. Global OSAT & Supply Chain Management
Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies. Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications. Monitor production early in the ramp phase to resolve integration issues and ensure superior quality. 3. NPI, Qualification & Quality Control
Lead the transition of new products from R&D to High Volume Manufacturing (HVM). Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes. Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps. Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions. 4. Cross-Functional Leadership
Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions. Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.).
Education: Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering. Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging. Deep knowledge of Power SiP/Modules , Flip-Chip , and Wafer Level assembly. Familiarity with Smart Power Stages and Vertical Power architectures. Expertise in SPC , statistical analysis software, and qualification methods. Exceptional interpersonal, presentation, analytical and communication skills
The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.
Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’
At Renesas, you can:
Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us .
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement .
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Full job record
| Job ID | e55118f7d82a644e0fb2005c370c0660de282d7d |
| Org ID | caaaa154-0f71-41a6-90a3-8a7b127a0740 |
| Source ID | 39f58afe-87d4-4c84-b37a-4d3a26e8dbfe |
| Board ID | 39f58afe-87d4-4c84-b37a-4d3a26e8dbfe |
| Provider | smartrecruiters |
| Provider Job Key | 744000126300669 |
| Title | Director of Advanced IC Packaging Development |
| Normalized Title | — |
| Status | deleted |
| Active | no |
| Location Text | San Jose, CALIFORNIA, United States |
| Department | Engineering |
| Team | — |
| Employment Type | full_time |
| Workplace Type | hybrid |
| Remote Policy | hybrid |
| Country | United States |
| Region | CA |
| City | San Jose |
| Salary Raw | Renesas is seeking a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency. Responsibilities: 1. Technology Roadmap & R&D Strategy Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) . Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand. Establish and maintain corporate package design rules to ensure manufacturability and reliability 2. Global OSAT & Supply Chain Management Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies. Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications. Monitor production early in the ramp phase to resolve integration issues and ensure superior quality. 3. NPI, Qualification & Quality Control Lead the transition of new products from R&D to High Volume Manufacturing (HVM). Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes. Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps. Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions. 4. Cross-Functional Leadership Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions. Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.). Education: Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering. Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging. Deep knowledge of Power SiP/Modules , Flip-Chip , and Wafer Level assembly. Familiarity with Smart Power Stages and Vertical Power architectures. Expertise in SPC , statistical analysis software, and qualification methods. Exceptional interpersonal, presentation, analytical and communication skills The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Shape Your Future with Us . Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas. |
| Salary Min | 200,000 |
| Salary Max | 250,000 |
| Salary Currency | USD |
| Salary Period | day |
| Source URL | https://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development |
| Apply URL | https://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development?oga=true |
| First Seen At | 2026-05-31 17:36:37Z |
| Last Seen At | 2026-06-04 11:56:42Z |
| Last Checked At | 2026-06-06 19:57:08Z |
| Last Changed At | 2026-06-06 19:57:08Z |
| Inactive At | 2026-06-06 19:57:08Z |
| Source Posted At | 2026-05-13 12:25:59Z |
| Source Updated At | — |
| Raw Payload Uri | s3://bluework-jobs-prod-raw-590183727216/raw/provider=smartrecruiters/board=renesaselectronics/date=2026-06-04/2026-06-04T11-56-22-525Z-7e383f6f95bc9ff791406994e9441732292fb968759a822e7b586876e6481095.json |
Event Fields
{
"content_hash": "e991eb4afaf807e21653326e3fd9d10c844fc328ebcc03e84633078ddc32e082",
"source_hash": "4deb4a1ffc506cc7b0f058ad3013bda290a045c3e4061b19d69f9d066c493f37",
"last_changed_at": "2026-06-06T19:57:08.386Z",
"active_status": "deleted"
}Parsed Structured
{
"language": "en",
"location": {
"raw": "San Jose, CALIFORNIA, United States",
"city": "San Jose",
"region": "CA",
"country": "United States",
"is_remote": false,
"confidence": 0.8
},
"salary_max": 250000,
"salary_min": 200000,
"inferred_at": "2026-06-04T11:56:42.367Z",
"launch_scope": {
"reason": "english_us_canada",
"included": true,
"language": "en",
"location": {
"raw": "San Jose, CALIFORNIA, United States",
"city": "San Jose",
"region": "CA",
"country": "United States",
"is_remote": false,
"confidence": 0.8
},
"countries": [
"United States"
]
},
"remote_policy": "hybrid",
"salary_period": "day",
"workplace_type": "hybrid",
"salary_currency": "USD"
}Extensions
{}Native Structured
{
"id": "744000126300669",
"ref": "https://api.smartrecruiters.com/v1/companies/renesaselectronics/postings/744000126300669",
"name": "Director of Advanced IC Packaging Development",
"uuid": "5e9b9f1d-0dc0-4c08-9e3c-02480f29d04f",
"detail": {
"id": "744000126300669",
"name": "Director of Advanced IC Packaging Development",
"uuid": "5e9b9f1d-0dc0-4c08-9e3c-02480f29d04f",
"jobAd": {
"sections": {
"videos": {
"urls": [
"https://www.youtube.com/watch?v=k-zs4tB6nNc"
],
"title": "Videos To Watch"
},
"jobDescription": {
"text": "<p>Renesas is seeking a <strong>Director of Advanced IC Packaging Development</strong> to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency.</p><p><strong>Responsibilities: </strong></p><p><strong>1. Technology Roadmap & R&D Strategy</strong></p><ul><li>Define and execute the global packaging roadmap, focusing on <strong>Power SiP/Modules</strong>, <strong>Wafer Level Packaging</strong>, and <strong>Flip-Chip</strong> technologies.</li><li>Lead R&D initiatives for <strong>Wide Bandgap (SiC & GaN)</strong> power devices, utilizing advanced substrates like <strong>DBC (Direct Bonded Copper)</strong> and <strong>AMB (Active Metal Brazing)</strong>.</li><li>Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand.</li><li>Establish and maintain corporate package design rules to ensure manufacturability and reliability</li></ul><p><strong>2. Global OSAT & Supply Chain Management</strong></p><ul><li>Benchmark, select, and qualify global <strong>OSATs</strong> and Contract Manufacturers (CM) for new package technologies.</li><li>Drive <strong>DOE (Design of Experiments)</strong> with partners to optimize assembly processes and establish rigorous process specifications.</li><li>Monitor production early in the ramp phase to resolve integration issues and ensure superior quality.</li></ul><p><strong>3. NPI, Qualification & Quality Control</strong></p><ul><li>Lead the transition of new products from R&D to High Volume Manufacturing (HVM).</li><li>Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes.</li><li>Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps.</li><li>Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions.</li></ul><p><strong>4. Cross-Functional Leadership</strong></p><ul><li>Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions.</li><li>Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.).</li></ul>",
"title": "Job Description"
},
"qualifications": {
"text": "<ul><li><strong>Education:</strong> Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.</li><li><strong>Experience:</strong> 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging.</li><li>Deep knowledge of <strong>Power SiP/Modules</strong>, <strong>Flip-Chip</strong>, and <strong>Wafer Level</strong> assembly.</li><li>Familiarity with <strong>Smart Power Stages</strong> and <strong>Vertical Power</strong> architectures.</li><li>Expertise in <strong>SPC</strong>, statistical analysis software, and qualification methods.</li><li>Exceptional interpersonal, presentation, analytical and communication skills</li></ul>",
"title": "Qualifications"
},
"companyDescription": {
"text": "",
"title": "Company Description"
},
"additionalInformation": {
"text": "<p>The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.</p><p>Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.</p><div sr-tagline=\"\"></div><p>Renesas is an embedded semiconductor solution provider driven by its Purpose ‘<strong>To Make Our Lives Easier</strong>.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.<br>\n <br>\nWith a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘<strong>To Make Our Lives Easier</strong>.’     <br>\n <br>\nAt Renesas, you can: </p><ul><li><strong>Launch and advance your career </strong>in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  </li></ul><ul><li><strong>Make a real impact </strong>by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. </li></ul><ul><li><strong>Maximize your performance and wellbeing</strong> in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.    </li></ul><p>Are you ready to own your success and make your mark?  </p><p>Join Renesas. <strong>Shape Your Future with Us</strong>.  </p><p>Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our <a href=\"https://jobs.renesas.com/diversity-and-inclusion\" rel=\"noopener noreferrer\">Diversity & Inclusion Statement</a>.</p><p>Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.</p>",
"title": "Additional Information"
}
}
},
"jobId": "22516f83-6ae8-4311-838e-1425786742af",
"active": true,
"company": {
"name": "Renesas Electronics",
"identifier": "RenesasElectronics"
},
"creator": {
"name": "",
"avatarUrl": ""
},
"jobAdId": "acccce64-ea05-4162-848d-17752239e479",
"applyUrl": "https://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development?oga=true",
"function": {
"id": "engineering",
"label": "Engineering"
},
"industry": {
"id": "semiconductors",
"label": "Semiconductors"
},
"language": {
"code": "en",
"label": "English",
"labelNative": "English (US)"
},
"location": {
"city": "San Jose",
"hybrid": true,
"region": "CALIFORNIA",
"remote": false,
"country": "us",
"fullLocation": "San Jose, CALIFORNIA, United States",
"hybridDescription": "3 days in the office, 2 days from home"
},
"refNumber": "20028615_2026-05-04",
"postingUrl": "https://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development",
"visibility": "PUBLIC",
"customField": [
{
"fieldId": "65ba7b5e4e21ad549033e157",
"valueId": "PERM",
"fieldLabel": "Employment Type",
"valueLabel": "Regular (PERM)"
},
{
"fieldId": "65ba7b8574ae4a00e827fcbd",
"valueId": "No",
"fieldLabel": "New Graduate Flag",
"valueLabel": "No"
},
{
"fieldId": "65ba9b0829ce2b47429d5a18",
"valueId": "No",
"fieldLabel": "Remote Work Available",
"valueLabel": "No"
},
{
"fieldId": "COUNTRY",
"valueId": "us",
"fieldLabel": "Country/Region",
"valueLabel": "United States"
},
{
"fieldId": "65ba763f29ce2b47429d5a17",
"valueId": "411S",
"fieldLabel": "Location",
"valueLabel": "REA(San Jose) (411S)"
},
{
"fieldId": "645ce25515bfc83b6e142801",
"valueId": "default",
"fieldLabel": "Brands",
"valueLabel": "Renesas Electronics"
},
{
"fieldId": "65ba7446e790046e9d0eacba",
"valueId": "4110",
"fieldLabel": "Company",
"valueLabel": "Renesas Electronics America Inc. (4110)"
}
],
"referralUrl": "https://jobs.smartrecruiters.com/external-referrals/company/RenesasElectronics/publication/5e9b9f1d-0dc0-4c08-9e3c-02480f29d04f?dcr_ci=RenesasElectronics",
"defaultJobAd": true,
"releasedDate": "2026-05-13T12:25:59.161Z",
"experienceLevel": {
"id": "director",
"label": "Director"
},
"typeOfEmployment": {
"id": "permanent",
"label": "Full-time"
}
},
"company": {
"name": "Renesas Electronics",
"identifier": "RenesasElectronics"
},
"jobAdId": "acccce64-ea05-4162-848d-17752239e479",
"function": {
"id": "engineering",
"label": "Engineering"
},
"industry": {
"id": "semiconductors",
"label": "Semiconductors"
},
"language": {
"code": "en",
"label": "English",
"labelNative": "English (US)"
},
"location": {
"city": "San Jose",
"hybrid": true,
"region": "CALIFORNIA",
"remote": false,
"country": "us",
"fullLocation": "San Jose, CALIFORNIA, United States",
"hybridDescription": "3 days in the office, 2 days from home"
},
"refNumber": "20028615_2026-05-04",
"department": {},
"visibility": "PUBLIC",
"customField": [
{
"fieldId": "65ba7b8574ae4a00e827fcbd",
"valueId": "No",
"fieldLabel": "New Graduate Flag",
"valueLabel": "No"
},
{
"fieldId": "65ba9b0829ce2b47429d5a18",
"valueId": "No",
"fieldLabel": "Remote Work Available",
"valueLabel": "No"
},
{
"fieldId": "65ba7446e790046e9d0eacba",
"valueId": "4110",
"fieldLabel": "Company",
"valueLabel": "Renesas Electronics America Inc. (4110)"
},
{
"fieldId": "65ba7b5e4e21ad549033e157",
"valueId": "PERM",
"fieldLabel": "Employment Type",
"valueLabel": "Regular (PERM)"
},
{
"fieldId": "COUNTRY",
"valueId": "us",
"fieldLabel": "Country/Region",
"valueLabel": "United States"
},
{
"fieldId": "65ba763f29ce2b47429d5a17",
"valueId": "411S",
"fieldLabel": "Location",
"valueLabel": "REA(San Jose) (411S)"
},
{
"fieldId": "645ce25515bfc83b6e142801",
"valueId": "default",
"fieldLabel": "Brands",
"valueLabel": "Renesas Electronics"
}
],
"defaultJobAd": true,
"releasedDate": "2026-05-13T12:25:59.161Z",
"detail_errors": [],
"experienceLevel": {
"id": "director",
"label": "Director"
},
"typeOfEmployment": {
"id": "permanent",
"label": "Full-time"
}
}Get this page with API
Rendered from the bluedoor Job Postings API. Reproduce it:
GET https://api.bluedoor.sh/job-postings/v1/jobs/e55118f7d82a644e0fb2005c370c0660de282d7d?include=descriptionJSONGET https://api.bluedoor.sh/job-postings/v1/orgs/caaaa154-0f71-41a6-90a3-8a7b127a0740JSONGET https://api.bluedoor.sh/job-postings/v1/sources/39f58afe-87d4-4c84-b37a-4d3a26e8dbfeJSONGET https://api.bluedoor.sh/job-postings/v1/jobs/e55118f7d82a644e0fb2005c370c0660de282d7d/eventsJSON