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HomeCompaniesRenesaselectronicsDirector of Advanced IC Packaging Development

Director of Advanced IC Packaging Development

Renesaselectronics · San Jose, CALIFORNIA, United States · Hybrid · Deleted · $200,000–$250,000 / day · SmartRecruiters

Job facts

FieldValue
CompanyRenesaselectronics
TitleDirector of Advanced IC Packaging Development
Normalized title-
Department / teamEngineering
LocationSan Jose, CA, United States
Work modelHybrid / Hybrid
Employment typeFull Time
Salary$200,000–$250,000 / day
Statusdeleted
ATS providerSmartRecruiters
Posted / first seen2026-05-13 / 2026-05-31
Changed / last seen2026-06-06 / 2026-06-04

Related slices

PageWhat it containsOpen
Company jobsActive postings from Renesaselectronics.Open
Company breakdownsRole, location, ATS, and work model facets for this company.Open
ATS provider jobsActive postings observed through SmartRecruiters.Open
Provider filtered searchThe same provider as a filtered job collection.Open
City jobsActive postings in San Jose.Open
Department jobsActive postings in Engineering.Open
Work model jobsActive Hybrid postings.Open
Lifecycle eventsOpen, update, close, and reopen events for this posting.Open
Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyRenesaselectronics
Source39f58afe-87d4-4c84-b37a-4d3a26e8dbfe
ATS providerSmartRecruiters

Description

Renesas is seeking a  Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency. Responsibilities: 1. Technology Roadmap & R&D Strategy Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) . Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand. Establish and maintain corporate package design rules to ensure manufacturability and reliability 2. Global OSAT & Supply Chain Management Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies. Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications. Monitor production early in the ramp phase to resolve integration issues and ensure superior quality. 3. NPI, Qualification & Quality Control Lead the transition of new products from R&D to High Volume Manufacturing (HVM). Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes. Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps. Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions. 4. Cross-Functional Leadership Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions. Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.). Education: Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering. Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging. Deep knowledge of Power SiP/Modules , Flip-Chip , and Wafer Level assembly. Familiarity with Smart Power Stages and Vertical Power architectures. Expertise in SPC , statistical analysis software, and qualification methods. Exceptional interpersonal, presentation, analytical and communication skills The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.   Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.  Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.     Are you ready to own your success and make your mark? Join Renesas. Shape Your Future with Us . Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our  Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Full job record

Job IDe55118f7d82a644e0fb2005c370c0660de282d7d
Org IDcaaaa154-0f71-41a6-90a3-8a7b127a0740
Source ID39f58afe-87d4-4c84-b37a-4d3a26e8dbfe
Board ID39f58afe-87d4-4c84-b37a-4d3a26e8dbfe
Providersmartrecruiters
Provider Job Key744000126300669
TitleDirector of Advanced IC Packaging Development
Normalized Title
Statusdeleted
Activeno
Location TextSan Jose, CALIFORNIA, United States
DepartmentEngineering
Team
Employment Typefull_time
Workplace Typehybrid
Remote Policyhybrid
CountryUnited States
RegionCA
CitySan Jose
Salary RawRenesas is seeking a  Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency. Responsibilities: 1. Technology Roadmap & R&D Strategy Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) . Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand. Establish and maintain corporate package design rules to ensure manufacturability and reliability 2. Global OSAT & Supply Chain Management Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies. Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications. Monitor production early in the ramp phase to resolve integration issues and ensure superior quality. 3. NPI, Qualification & Quality Control Lead the transition of new products from R&D to High Volume Manufacturing (HVM). Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes. Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps. Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions. 4. Cross-Functional Leadership Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions. Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.). Education: Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering. Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging. Deep knowledge of Power SiP/Modules , Flip-Chip , and Wafer Level assembly. Familiarity with Smart Power Stages and Vertical Power architectures. Expertise in SPC , statistical analysis software, and qualification methods. Exceptional interpersonal, presentation, analytical and communication skills The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.   Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.  Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.     Are you ready to own your success and make your mark? Join Renesas. Shape Your Future with Us . Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our  Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Salary Min200,000
Salary Max250,000
Salary CurrencyUSD
Salary Periodday
Source URLhttps://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development
Apply URLhttps://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development?oga=true
First Seen At2026-05-31 17:36:37Z
Last Seen At2026-06-04 11:56:42Z
Last Checked At2026-06-06 19:57:08Z
Last Changed At2026-06-06 19:57:08Z
Inactive At2026-06-06 19:57:08Z
Source Posted At2026-05-13 12:25:59Z
Source Updated At
Raw Payload Uris3://bluework-jobs-prod-raw-590183727216/raw/provider=smartrecruiters/board=renesaselectronics/date=2026-06-04/2026-06-04T11-56-22-525Z-7e383f6f95bc9ff791406994e9441732292fb968759a822e7b586876e6481095.json
Event Fields
{
  "content_hash": "e991eb4afaf807e21653326e3fd9d10c844fc328ebcc03e84633078ddc32e082",
  "source_hash": "4deb4a1ffc506cc7b0f058ad3013bda290a045c3e4061b19d69f9d066c493f37",
  "last_changed_at": "2026-06-06T19:57:08.386Z",
  "active_status": "deleted"
}
Parsed Structured
{
  "language": "en",
  "location": {
    "raw": "San Jose, CALIFORNIA, United States",
    "city": "San Jose",
    "region": "CA",
    "country": "United States",
    "is_remote": false,
    "confidence": 0.8
  },
  "salary_max": 250000,
  "salary_min": 200000,
  "inferred_at": "2026-06-04T11:56:42.367Z",
  "launch_scope": {
    "reason": "english_us_canada",
    "included": true,
    "language": "en",
    "location": {
      "raw": "San Jose, CALIFORNIA, United States",
      "city": "San Jose",
      "region": "CA",
      "country": "United States",
      "is_remote": false,
      "confidence": 0.8
    },
    "countries": [
      "United States"
    ]
  },
  "remote_policy": "hybrid",
  "salary_period": "day",
  "workplace_type": "hybrid",
  "salary_currency": "USD"
}
Extensions
{}
Native Structured
{
  "id": "744000126300669",
  "ref": "https://api.smartrecruiters.com/v1/companies/renesaselectronics/postings/744000126300669",
  "name": "Director of Advanced IC Packaging Development",
  "uuid": "5e9b9f1d-0dc0-4c08-9e3c-02480f29d04f",
  "detail": {
    "id": "744000126300669",
    "name": "Director of Advanced IC Packaging Development",
    "uuid": "5e9b9f1d-0dc0-4c08-9e3c-02480f29d04f",
    "jobAd": {
      "sections": {
        "videos": {
          "urls": [
            "https://www.youtube.com/watch?v=k-zs4tB6nNc"
          ],
          "title": "Videos To Watch"
        },
        "jobDescription": {
          "text": "<p>Renesas is seeking a&#xa0;<strong>Director of Advanced IC Packaging Development</strong> to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&amp;D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency.</p><p><strong>Responsibilities:&#xa0;</strong></p><p><strong>1. Technology Roadmap &amp; R&amp;D Strategy</strong></p><ul><li>Define and execute the global packaging roadmap, focusing on <strong>Power SiP/Modules</strong>, <strong>Wafer Level Packaging</strong>, and <strong>Flip-Chip</strong> technologies.</li><li>Lead R&amp;D initiatives for <strong>Wide Bandgap (SiC &amp; GaN)</strong> power devices, utilizing advanced substrates like <strong>DBC (Direct Bonded Copper)</strong> and <strong>AMB (Active Metal Brazing)</strong>.</li><li>Manage the annual R&amp;D budget and oversee customer adoption programs to align technical capabilities with market demand.</li><li>Establish and maintain corporate package design rules to ensure manufacturability and reliability</li></ul><p><strong>2. Global OSAT &amp; Supply Chain Management</strong></p><ul><li>Benchmark, select, and qualify global <strong>OSATs</strong> and Contract Manufacturers (CM) for new package technologies.</li><li>Drive <strong>DOE (Design of Experiments)</strong> with partners to optimize assembly processes and establish rigorous process specifications.</li><li>Monitor production early in the ramp phase to resolve integration issues and ensure superior quality.</li></ul><p><strong>3. NPI, Qualification &amp; Quality Control</strong></p><ul><li>Lead the transition of new products from R&amp;D to High Volume Manufacturing (HVM).</li><li>Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes.</li><li>Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps.</li><li>Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions.</li></ul><p><strong>4. Cross-Functional Leadership</strong></p><ul><li>Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions.</li><li>Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.).</li></ul>",
          "title": "Job Description"
        },
        "qualifications": {
          "text": "<ul><li><strong>Education:</strong> Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.</li><li><strong>Experience:</strong> 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and&#xa0;wafer level &amp; flip-chip packaging.</li><li>Deep knowledge of <strong>Power SiP/Modules</strong>, <strong>Flip-Chip</strong>, and <strong>Wafer Level</strong> assembly.</li><li>Familiarity with <strong>Smart Power Stages</strong> and <strong>Vertical Power</strong> architectures.</li><li>Expertise in <strong>SPC</strong>, statistical analysis software, and qualification methods.</li><li>Exceptional interpersonal, presentation, analytical and communication skills</li></ul>",
          "title": "Qualifications"
        },
        "companyDescription": {
          "text": "",
          "title": "Company Description"
        },
        "additionalInformation": {
          "text": "<p>The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.</p><p>Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&amp;D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&amp;D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.</p><div sr-tagline=\"\"></div><p>Renesas is an embedded semiconductor solution provider driven by its Purpose ‘<strong>To Make Our Lives Easier</strong>.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog &amp; Connectivity, and Power.<br>\n&#xa0;<br>\nWith a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘<strong>To Make Our Lives Easier</strong>.’&#xa0;&#xa0;&#xa0; &#xa0;<br>\n&#xa0;<br>\nAt Renesas, you can:&#xa0;</p><ul><li><strong>Launch and advance your career </strong>in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.&#xa0;&#xa0;</li></ul><ul><li><strong>Make a real impact </strong>by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.&#xa0;</li></ul><ul><li><strong>Maximize your performance and wellbeing</strong> in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.&#xa0;&#xa0; &#xa0;</li></ul><p>Are you ready to own your success and make your mark? &#xa0;</p><p>Join Renesas. <strong>Shape Your Future with Us</strong>.&#xa0;&#xa0;</p><p>Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law.&#xa0;For more information, please read our&#xa0;<a href=\"https://jobs.renesas.com/diversity-and-inclusion\" rel=\"noopener noreferrer\">Diversity &amp; Inclusion Statement</a>.</p><p>Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.</p>",
          "title": "Additional Information"
        }
      }
    },
    "jobId": "22516f83-6ae8-4311-838e-1425786742af",
    "active": true,
    "company": {
      "name": "Renesas Electronics",
      "identifier": "RenesasElectronics"
    },
    "creator": {
      "name": "",
      "avatarUrl": ""
    },
    "jobAdId": "acccce64-ea05-4162-848d-17752239e479",
    "applyUrl": "https://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development?oga=true",
    "function": {
      "id": "engineering",
      "label": "Engineering"
    },
    "industry": {
      "id": "semiconductors",
      "label": "Semiconductors"
    },
    "language": {
      "code": "en",
      "label": "English",
      "labelNative": "English (US)"
    },
    "location": {
      "city": "San Jose",
      "hybrid": true,
      "region": "CALIFORNIA",
      "remote": false,
      "country": "us",
      "fullLocation": "San Jose, CALIFORNIA, United States",
      "hybridDescription": "3 days in the office, 2 days from home"
    },
    "refNumber": "20028615_2026-05-04",
    "postingUrl": "https://jobs.smartrecruiters.com/RenesasElectronics/744000126300669-director-of-advanced-ic-packaging-development",
    "visibility": "PUBLIC",
    "customField": [
      {
        "fieldId": "65ba7b5e4e21ad549033e157",
        "valueId": "PERM",
        "fieldLabel": "Employment Type",
        "valueLabel": "Regular (PERM)"
      },
      {
        "fieldId": "65ba7b8574ae4a00e827fcbd",
        "valueId": "No",
        "fieldLabel": "New Graduate Flag",
        "valueLabel": "No"
      },
      {
        "fieldId": "65ba9b0829ce2b47429d5a18",
        "valueId": "No",
        "fieldLabel": "Remote Work Available",
        "valueLabel": "No"
      },
      {
        "fieldId": "COUNTRY",
        "valueId": "us",
        "fieldLabel": "Country/Region",
        "valueLabel": "United States"
      },
      {
        "fieldId": "65ba763f29ce2b47429d5a17",
        "valueId": "411S",
        "fieldLabel": "Location",
        "valueLabel": "REA(San Jose) (411S)"
      },
      {
        "fieldId": "645ce25515bfc83b6e142801",
        "valueId": "default",
        "fieldLabel": "Brands",
        "valueLabel": "Renesas Electronics"
      },
      {
        "fieldId": "65ba7446e790046e9d0eacba",
        "valueId": "4110",
        "fieldLabel": "Company",
        "valueLabel": "Renesas Electronics America Inc. (4110)"
      }
    ],
    "referralUrl": "https://jobs.smartrecruiters.com/external-referrals/company/RenesasElectronics/publication/5e9b9f1d-0dc0-4c08-9e3c-02480f29d04f?dcr_ci=RenesasElectronics",
    "defaultJobAd": true,
    "releasedDate": "2026-05-13T12:25:59.161Z",
    "experienceLevel": {
      "id": "director",
      "label": "Director"
    },
    "typeOfEmployment": {
      "id": "permanent",
      "label": "Full-time"
    }
  },
  "company": {
    "name": "Renesas Electronics",
    "identifier": "RenesasElectronics"
  },
  "jobAdId": "acccce64-ea05-4162-848d-17752239e479",
  "function": {
    "id": "engineering",
    "label": "Engineering"
  },
  "industry": {
    "id": "semiconductors",
    "label": "Semiconductors"
  },
  "language": {
    "code": "en",
    "label": "English",
    "labelNative": "English (US)"
  },
  "location": {
    "city": "San Jose",
    "hybrid": true,
    "region": "CALIFORNIA",
    "remote": false,
    "country": "us",
    "fullLocation": "San Jose, CALIFORNIA, United States",
    "hybridDescription": "3 days in the office, 2 days from home"
  },
  "refNumber": "20028615_2026-05-04",
  "department": {},
  "visibility": "PUBLIC",
  "customField": [
    {
      "fieldId": "65ba7b8574ae4a00e827fcbd",
      "valueId": "No",
      "fieldLabel": "New Graduate Flag",
      "valueLabel": "No"
    },
    {
      "fieldId": "65ba9b0829ce2b47429d5a18",
      "valueId": "No",
      "fieldLabel": "Remote Work Available",
      "valueLabel": "No"
    },
    {
      "fieldId": "65ba7446e790046e9d0eacba",
      "valueId": "4110",
      "fieldLabel": "Company",
      "valueLabel": "Renesas Electronics America Inc. (4110)"
    },
    {
      "fieldId": "65ba7b5e4e21ad549033e157",
      "valueId": "PERM",
      "fieldLabel": "Employment Type",
      "valueLabel": "Regular (PERM)"
    },
    {
      "fieldId": "COUNTRY",
      "valueId": "us",
      "fieldLabel": "Country/Region",
      "valueLabel": "United States"
    },
    {
      "fieldId": "65ba763f29ce2b47429d5a17",
      "valueId": "411S",
      "fieldLabel": "Location",
      "valueLabel": "REA(San Jose) (411S)"
    },
    {
      "fieldId": "645ce25515bfc83b6e142801",
      "valueId": "default",
      "fieldLabel": "Brands",
      "valueLabel": "Renesas Electronics"
    }
  ],
  "defaultJobAd": true,
  "releasedDate": "2026-05-13T12:25:59.161Z",
  "detail_errors": [],
  "experienceLevel": {
    "id": "director",
    "label": "Director"
  },
  "typeOfEmployment": {
    "id": "permanent",
    "label": "Full-time"
  }
}
Get this page with API

Rendered from the bluedoor Job Postings API. Reproduce it:

GET https://api.bluedoor.sh/job-postings/v1/jobs/e55118f7d82a644e0fb2005c370c0660de282d7d?include=descriptionJSON
GET https://api.bluedoor.sh/job-postings/v1/orgs/caaaa154-0f71-41a6-90a3-8a7b127a0740JSON
GET https://api.bluedoor.sh/job-postings/v1/sources/39f58afe-87d4-4c84-b37a-4d3a26e8dbfeJSON
GET https://api.bluedoor.sh/job-postings/v1/jobs/e55118f7d82a644e0fb2005c370c0660de282d7d/eventsJSON