Semiconductor Process Engineer/Technician – 2nd Shift

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  "Title": "Semiconductor Process Engineer/Technician – 2nd Shift",
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  "PostedDate": "2025-02-06T20:20:01.845Z",
  "JobCategoryName": "Miscellaneous",
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  "BriefDescription": "The Packaging and Assembly Engineer will develop and manage all related assembly processes, such as die attaching, wire bonding, stack die packaging, and flip-chip assembly processing.",
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  "RequisitionNumber": "SHIFT001038"
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