Thermal Process Engineer

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    "description": "<p><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Company Overview</span></p>\n<p><span style=\"font-size: 10pt\">We are a high-growth startup building next-generation high‑performance switching systems for hyperscale and AI data centers. Our platforms power large-scale cloud infrastructure, GPU clusters, and high-density compute environments where performance, reliability, and thermal efficiency are critical to customer operations.</span></p>\n<p><br><br></p>\n<p><span style=\"font-size: 10pt\"><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Position Summary</span></span></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">The Liquid Cooling Process Engineer owns the manufacturing process definition, validation, and scaling of liquid-cooled network products in conjunction with NH engineering. This role bridges thermal design, mechanical design, manufacturing engineering, reliability, and supply chain to ensure liquid-cooling solutions—cold plates, manifolds, hoses, quick-disconnects, and TIMs—are repeatable, leak-free, thermally efficient, and production-scalable.</span></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">The role is critical to enabling &gt;50–100 kW per rack architectures, supporting next-generation AI fabrics and ultra-high-bandwidth network switches without compromising reliability or serviceability.</span></p>\n<p><br><br></p>\n<p><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Key Responsibilities</span></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\">Process Definition &amp; Development</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Define end-to-end manufacturing processes in close collaboration with engineering for:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Direct-to-chip cold plates</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Manifolds and distribution plates</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Tubing, hoses, and quick-disconnects (QDs)</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">TIM application (grease, PCM, gap fillers)</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Develop process flow diagrams, control plans, and work instructions</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Ensure processes are DFM/DFA/DFS compliant and serviceable in field environments</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\">NPI Execution (EVT → DVT → PVT → MP)</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Enable fast prototyping and rapid iterative development cycles</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Drive development of DFMEA (Design Failure Mode Effects and Analysis) with engineering</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Support thermal hardware from early EVT through HVM ramp</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Identify and mitigate process risks:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Leak paths</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Torque variation</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Flatness and coplanarity</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Particulate contamination</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Lead process validation builds and golden line definition</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Partner with ODMs to ensure manufacturability at scale</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\">Assembly, Tooling &amp; Automation</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Specify and qualify:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Torque tools and sequencing strategies</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Dispensing systems for TIMs and sealants</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Pressure and leak-test equipment (air, helium, liquid)</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Drive semi-automated and automated solutions for:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Cold-plate installation</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Hose routing and retention</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">QD (Quick Disconnect) engagement verification</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Define poka-yoke mechanisms to prevent mis-builds</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\">Quality, Reliability &amp; Validation</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Own PFMEA (Process Failure Mode Effects and Analysis) and control plans for liquid-cooling processes</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Define acceptance criteria for:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Leak rate</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Pressure decay</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Flow resistance</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Thermal performance</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Support HALT/HASS, thermal cycling, vibration, and shock testing</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Lead root-cause analysis for field and factory issues (leaks, clogging, corrosion)</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\">Data, Monitoring &amp; Continuous Improvement</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Establish process KPIs:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Leak ppm</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Torque Cp/Cpk</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">TIM thickness uniformity</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Yield and rework rates</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Integrate test data into MES and quality dashboards</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Drive yield improvement and cost reduction through data-driven analysis</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\">Supplier &amp; Partner Management</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Work closely with:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Cold-plate suppliers</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Hose and QD vendors</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">TIM and sealant suppliers</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">ODM/OEM manufacturing teams</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Qualify suppliers and define incoming quality requirements</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Support dual-sourcing and cost-down initiatives</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\"><br></span><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\"><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Required Qualifications</span></span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Master’s degree in Mechanical Engineering, Manufacturing Engineering, or related field</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">7+ years experience in manufacturing and process engineering with 2+ years of liquid cooling experience</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Hands-on experience with <span style=\"font-weight: bold\">thermal or fluid-handling hardware</span></span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Strong understanding of:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Mechanical tolerances and torque control</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Assembly processes and tooling</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Manufacturing quality systems</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Thermodynamics</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Heat transfer </span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Experience with <span style=\"font-weight: bold\">liquid-cooled servers, network switches, or HPC systems</span></span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Experience working in or with startups</span></li>\n</ul>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\"><br></span><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\"><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Preferred Qualifications</span></span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Familiarity with:</span>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Cold-plate design and materials (Cu, Al, Ni plating)</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">TIM characterization and dispensing</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Leak detection methods (helium mass spec, pressure decay)</span></li>\n</ul>\n</li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Experience working <span style=\"font-weight: bold\">with hyperscalers or large ODMs</span></span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Knowledge of data-center cooling architectures (DLC, CDU, facility interfaces)</span><br><br></li>\n</ul>\n<p><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Key Competencies</span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Strong hands-on manufacturing mindset</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Ability to translate thermal design into robust production processes</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Structured problem-solving and root-cause analysis</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Cross-functional communication and influence</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Comfortable operating in fast-paced NPI and ramp environments</span><br></li>\n</ul>\n<p><br><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\"><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Success Metrics</span></span></p>\n<ul>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Leak rate at factory and in field</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Thermal performance consistency</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">First-pass yield through PVT and MP</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">NPI schedule adherence</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Cost and cycle-time targets achieved</span></li>\n<li><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Use of automation to reduce variability and increase throughput + yield</span></li>\n</ul>\n<p><br><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt; font-weight: bold\"><span style=\"color: rgb(79, 129, 189); font-size: 12pt; font-weight: bold\">Why This Role Matters</span></span></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 10pt\">Liquid cooling is no longer optional for hyperscale networking. This role ensures liquid-cooled platforms can be manufactured safely, reliably, and at massive scale, enabling next-generation bandwidth and AI infrastructure without compromising uptime or quality.</span></p>",
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