bluedoor data·Job Postings API·bluedoor.sh ↗

HomeCompaniesFa Evmr Saasfaprod1 Fa Ocs Oraclecloud Com CX 1Senior Principal Engineer – High-speed PIC Development

Senior Principal Engineer – High-speed PIC Development

Fa Evmr Saasfaprod1 Fa Ocs Oraclecloud Com CX 1 · United States; Infinera Bordeaux Dr, Sunnyvale, California, US · Hybrid · Deleted · Oracle Recruiting Cloud / Fusion HCM

Job facts

FieldValue
CompanyFa Evmr Saasfaprod1 Fa Ocs Oraclecloud Com CX 1
TitleSenior Principal Engineer – High-speed PIC Development
Normalized title-
Department / teamApplied R&D
LocationUnited States
Work modelHybrid / Hybrid
Employment typeFull Time
Salary-
Statusdeleted
ATS providerOracle Recruiting Cloud / Fusion HCM
Posted / first seen2026-04-02 / 2026-05-31
Changed / last seen2026-06-21 / 2026-06-19

Related slices

PageWhat it containsOpen
Company jobsActive postings from Fa Evmr Saasfaprod1 Fa Ocs Oraclecloud Com CX 1.Open
Company breakdownsRole, location, ATS, and work model facets for this company.Open
ATS provider jobsActive postings observed through Oracle Recruiting Cloud / Fusion HCM.Open
Provider filtered searchThe same provider as a filtered job collection.Open
Department jobsActive postings in Applied R&D.Open
Work model jobsActive Hybrid postings.Open
Lifecycle eventsOpen, update, close, and reopen events for this posting.Open
Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyFa Evmr Saasfaprod1 Fa Ocs Oraclecloud Com CX 1
Sourcedbfc4c22-73ba-4fc5-9705-234e3e914c7c
ATS providerOracle Recruiting Cloud / Fusion HCM

Description

Description Technical leadership role focused on the architecture, design, and execution of next-generation optical engines. This individual contributor position combines deep technical expertise in RF and high speed device design with the strategic oversight of PIC development processes and product roadmaps. The candidate will work within the PIC design and engineering team, alongside a group of strong individual contributors, on simulation, data analysis and product development leveraging reliable design concepts. Responsibilities will include guiding the performance verification and optimization of the devices and contributing towards the transfer to manufacturing of PIC products NION2026 Responsibilities Technical Lead: Drive the design and test strategy for high-performance InP based 200Gbaud+ modulators and photodetectors within Nokia’s optical engine portfolio. RF Design & Signal Integrity: Lead RF design for Coherent and IMDD PICs, collaborating closely with assembly teams to optimize signal integrity and mitigate crosstalk. Device Physics and Epi Design: Apply semiconductor physics expertise to optimize device structures, focusing performance metrics (e.g., Vpi, extinction ratio, leakage, and responsivity) to ensure robust fundamental operation. Design Methodology: Establish and execute rigorous PIC design methodologies and fabrication, test processes to ensure scalable, high-quality hardware delivery. Test Strategy & Execution: Partner with test engineering to develop and implement comprehensive test strategies for both R&D development and production environments. Fabrication Interface: Partner with internal teams to define, troubleshoot, and optimize the PIC fabrication process, ensuring alignment between design requirements and process capabilities. Technical Problem Solving: Independently resolve complex organizational and technical bottlenecks to keep development cycles on track. Mentorship: Provide technical guidance and leadership to scale the team’s collective capabilities in support of optical engine development. Qualifications MS/PhD in engineering, 10+ years’ experience in telecommunications, optoelectronics, or microelectronics development with significant time in management role Significant experience with optical component design for performance, especially for InP devices Familiarity with InP opto-electronic fabrication, material characterization and epitaxy knowledge experience with product development is highly desired. The Job will require frequent collaborative interaction with fab, epitaxy, test and reliability engineering, packaging, product engineering, and system engineering groups Strong leadership and communication and engineering and project management skills Experienced in leading a diverse team of strong Individual contributors Technical depth to understand concerns and communicate status and resolution to executive leadership team Ability to evaluate candidates, mentor and develop the team NION2026 Organization Some of our benefits in US : Corporate Retirement Savings Plan Health and dental benefits Short-term disability, and long-term disability Life insurance, and AD&D – Company paid 2x base pay Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child) Paid time off for holidays and Vacation Employee Stock Purchase Plan Tuition Assistance Plan Adoption assistance Employee Assistance Program/Work Life Resource Program The above benefits exclude students. Disclaimer for US/Canada Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role. All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified. Company Advancing connectivity to secure a brighter world. Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. Learn more about life at Nokia . Our recruitment process We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia .

Full job record

Job IDcf68c63045337a73198b4edbb71cb6c26f77d84d
Org ID0229f528-a584-4e4f-9943-249cfaac294e
Source IDdbfc4c22-73ba-4fc5-9705-234e3e914c7c
Board IDdbfc4c22-73ba-4fc5-9705-234e3e914c7c
Provideroracle_hcm
Provider Job Key33907
TitleSenior Principal Engineer – High-speed PIC Development
Normalized Title
Statusdeleted
Activeno
Location TextUnited States; Infinera Bordeaux Dr, Sunnyvale, California, US
DepartmentApplied R&D
Team
Employment Typefull_time
Workplace Typehybrid
Remote Policyhybrid
CountryUnited States
Region
City
Salary RawDescription Technical leadership role focused on the architecture, design, and execution of next-generation optical engines. This individual contributor position combines deep technical expertise in RF and high speed device design with the strategic oversight of PIC development processes and product roadmaps. The candidate will work within the PIC design and engineering team, alongside a group of strong individual contributors, on simulation, data analysis and product development leveraging reliable design concepts. Responsibilities will include guiding the performance verification and optimization of the devices and contributing towards the transfer to manufacturing of PIC products NION2026 Responsibilities Technical Lead: Drive the design and test strategy for high-performance InP based 200Gbaud+ modulators and photodetectors within Nokia’s optical engine portfolio. RF Design & Signal Integrity: Lead RF design for Coherent and IMDD PICs, collaborating closely with assembly teams to optimize signal integrity and mitigate crosstalk. Device Physics and Epi Design: Apply semiconductor physics expertise to optimize device structures, focusing performance metrics (e.g., Vpi, extinction ratio, leakage, and responsivity) to ensure robust fundamental operation. Design Methodology: Establish and execute rigorous PIC design methodologies and fabrication, test processes to ensure scalable, high-quality hardware delivery. Test Strategy & Execution: Partner with test engineering to develop and implement comprehensive test strategies for both R&D development and production environments. Fabrication Interface: Partner with internal teams to define, troubleshoot, and optimize the PIC fabrication process, ensuring alignment between design requirements and process capabilities. Technical Problem Solving: Independently resolve complex organizational and technical bottlenecks to keep development cycles on track. Mentorship: Provide technical guidance and leadership to scale the team’s collective capabilities in support of optical engine development. Qualifications MS/PhD in engineering, 10+ years’ experience in telecommunications, optoelectronics, or microelectronics development with significant time in management role Significant experience with optical component design for performance, especially for InP devices Familiarity with InP opto-electronic fabrication, material characterization and epitaxy knowledge experience with product development is highly desired. The Job will require frequent collaborative interaction with fab, epitaxy, test and reliability engineering, packaging, product engineering, and system engineering groups Strong leadership and communication and engineering and project management skills Experienced in leading a diverse team of strong Individual contributors Technical depth to understand concerns and communicate status and resolution to executive leadership team Ability to evaluate candidates, mentor and develop the team NION2026 Organization Some of our benefits in US : Corporate Retirement Savings Plan Health and dental benefits Short-term disability, and long-term disability Life insurance, and AD&D – Company paid 2x base pay Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child) Paid time off for holidays and Vacation Employee Stock Purchase Plan Tuition Assistance Plan Adoption assistance Employee Assistance Program/Work Life Resource Program The above benefits exclude students. Disclaimer for US/Canada Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role. All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified. Company Advancing connectivity to secure a brighter world. Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. Learn more about life at Nokia . Our recruitment process We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia .
Salary Min
Salary Max
Salary Currency
Salary Period
Source URLhttps://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1/job/33907
Apply URLhttps://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1/job/33907
First Seen At2026-05-31 18:14:26Z
Last Seen At2026-06-19 12:00:21Z
Last Checked At2026-06-21 12:39:37Z
Last Changed At2026-06-21 12:39:37Z
Inactive At2026-06-21 12:39:37Z
Source Posted At2026-04-02 18:21:09Z
Source Updated At
Raw Payload Uris3://job-postings-prod-raw-590183727216/raw/provider=oracle_hcm/board=fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com|CX_1/date=2026-06-19/2026-06-19T11-51-53-846Z-9645d140329178decc8d372dc5358bf91eea031b0a4560f4bc747d71bfcd8ba1.json
Event Fields
{
  "content_hash": "9caf1ddc3dd0d613b716d95e720b795933de5d08c81b8ed415a8064c0c348c96",
  "source_hash": "d5698aa0910d99099dca6334c8eba14f8e139f2cdb94ef7dfa27fc4a5a8c624e",
  "last_changed_at": "2026-06-21T12:39:37.621Z",
  "active_status": "deleted"
}
Parsed Structured
{
  "language": "en",
  "location": {
    "raw": "United States",
    "city": null,
    "region": null,
    "country": "United States",
    "is_remote": false,
    "confidence": 0.8
  },
  "salary_max": null,
  "salary_min": null,
  "inferred_at": "2026-06-19T12:00:21.554Z",
  "launch_scope": {
    "reason": "english_us_canada",
    "included": true,
    "language": "en",
    "location": {
      "raw": "United States",
      "city": null,
      "region": null,
      "country": "United States",
      "is_remote": false,
      "confidence": 0.8
    },
    "countries": [
      "United States"
    ]
  },
  "remote_policy": "hybrid",
  "salary_period": null,
  "workplace_type": "hybrid",
  "salary_currency": null
}
Extensions
{}
Native Structured
{
  "detail": {
    "Id": "33907",
    "Title": "Senior Principal Engineer – High-speed PIC Development",
    "media": [],
    "skills": [],
    "JobType": "Experienced",
    "Category": "Applied R&D",
    "JobGrade": null,
    "JobLevel": null,
    "JobShift": null,
    "WorkDays": null,
    "WorkHours": null,
    "WorkYears": null,
    "Department": null,
    "HotJobFlag": false,
    "StudyLevel": "Doctor’s degree (e.g PhD)",
    "WorkMonths": null,
    "WorkerType": null,
    "GeographyId": 300000000480126,
    "JobFamilyId": 300000009357764,
    "JobFunction": "Digital Hardware",
    "JobSchedule": "Full time",
    "BusinessUnit": null,
    "ContractType": null,
    "Organization": null,
    "TrendingFlag": false,
    "workLocation": [
      {
        "Country": "US",
        "Region1": null,
        "Region2": "California",
        "Region3": null,
        "Building": null,
        "Latitude": "37.4023",
        "Longitude": "-122.00764",
        "LocationId": 300000764022944,
        "PostalCode": "94089-1005",
        "TownOrCity": "Sunnyvale",
        "AddressLine1": "1322 Bordeaux Drive",
        "AddressLine2": null,
        "AddressLine3": null,
        "AddressLine4": null,
        "LocationName": "Infinera Bordeaux Dr"
      }
    ],
    "ContentLocale": "en",
    "HiringManager": null,
    "LegalEmployer": null,
    "RequisitionId": 300001813481227,
    "WorkplaceType": "Hybrid",
    "BusinessUnitId": 300000006664259,
    "OrganizationId": 300000806573105,
    "GeographyNodeId": 100000448855450,
    "JobFunctionCode": "DHA",
    "LegalEmployerId": 300001149319675,
    "PrimaryLocation": "United States",
    "RequisitionType": "Standard (Internal & External)",
    "NumberOfOpenings": null,
    "WorkplaceTypeCode": "ORA_HYBRID",
    "BeFirstToApplyFlag": false,
    "otherWorkLocations": [
      {
        "Country": "JP",
        "Region1": null,
        "Region2": null,
        "Region3": null,
        "Building": null,
        "Latitude": "35.65",
        "Longitude": "139.7333",
        "LocationId": 300000011430147,
        "PostalCode": "106-6141",
        "TownOrCity": "Tokyo",
        "AddressLine1": "6-10-1 Roppongi, Minato-ku",
        "AddressLine2": null,
        "AddressLine3": null,
        "AddressLine4": null,
        "LocationName": "Roppongi Hills Mori Tower",
        "RequisitionWorkLocationId": 300001916799693
      }
    ],
    "secondaryLocations": [],
    "ExternalContactName": null,
    "ShortDescriptionStr": "The Senior Principal Engineer – High-speed PIC Development Engineer will oversee the design, development, and transfer to manufacturing of Nokia's Photonic Integrated Circuits (PIC) products. ",
    "ExternalContactEmail": null,
    "ExternalPostedEndDate": null,
    "OtherRequisitionTitle": null,
    "requisitionFlexFields": [
      {
        "Value": "No",
        "Prompt": "Will NSA/CAPS approval be required? (E.g., accessing a US Customer Network?)",
        "ControlType": "SingleChoiceList",
        "SequenceNumber": 5
      },
      {
        "Value": "Individual contributor",
        "Prompt": "Role Type",
        "ControlType": null,
        "SequenceNumber": 8
      },
      {
        "Value": "Yes",
        "Prompt": "Laptop - support with ordering needed",
        "ControlType": "SingleChoiceList",
        "SequenceNumber": 10
      },
      {
        "Value": "US Salary Range 179200$ - 332800$",
        "Prompt": "Salary Range",
        "ControlType": "TextArea",
        "SequenceNumber": 12
      },
      {
        "Value": "Experienced",
        "Prompt": "Experience level",
        "ControlType": "SingleChoiceList",
        "SequenceNumber": 22
      }
    ],
    "ApplyWhenNotPostedFlag": false,
    "DomesticTravelRequired": null,
    "ExternalDescriptionStr": "<p><span style=\"font-family: Aptos, sans-serif;\"><span style=\"font-size: 11pt; line-height: 107%;\">Technical leadership role focused on the architecture, design, and execution of next-generation optical engines. This individual contributor position combines deep technical expertise in RF and high speed device design with the strategic oversight of PIC development processes and product roadmaps. The candidate will work within the PIC design and engineering team, alongside a group of strong individual contributors, on simulation, data analysis and product development leveraging reliable design concepts. Responsibilities will include guiding the performance verification and optimization of the devices and contributing towards the transfer to manufacturing of PIC products</span></span></p><p>&nbsp;</p><p>NION2026</p>",
    "ObjectVerNumberProfile": null,
    "PrimaryLocationCountry": "US",
    "CorporateDescriptionStr": "<div>\n <b>Advancing connectivity to secure a brighter world.</b>\n</div>\n<div>\n <p><span style=\"box-sizing: border-box;\">Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.&nbsp;</span></p>\n</div>\n<div>\n <a href=\"https://www.nokia.com/careers/life-at-nokia/\" target=\"_blank\" rel=\"nofollow\">Learn more about life at Nokia</a>.\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n <p style=\"\"><b>Our recruitment process</b></p>\n <p style=\"\">We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.</p>\n <p style=\"\">If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.</p>\n <p style=\"\">The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates.&nbsp;<a href=\"https://www.nokia.com/careers/#recruitment-process\" target=\"_blank\" rel=\"nofollow\" style=\"\">Discover more about the recruitment process at Nokia</a>.&nbsp;</p>\n</div>",
    "ExternalPostedStartDate": "2026-04-02T18:21:09+00:00",
    "ExternalQualificationsStr": "<p><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">MS/PhD in engineering, 10+ years’ experience in telecommunications, optoelectronics, or microelectronics development with significant time in management role</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Significant experience with optical component design for performance, especially for InP devices</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Familiarity with InP opto-electronic fabrication, material characterization and epitaxy knowledge experience with product development is highly desired.</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">The Job will require frequent collaborative interaction with fab, epitaxy, test and reliability engineering, packaging, product engineering, and system engineering groups</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Strong leadership and communication and engineering and project management skills</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Experienced in leading a diverse team of strong Individual contributors</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Technical depth to understand concerns and communicate status and resolution to executive leadership team</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Ability to evaluate candidates, mentor and develop the team&nbsp;</span></span></p><p><span data-teams=\"true\">NION2026&nbsp;</span></p>",
    "InternalQualificationsStr": "<p><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">MS/PhD in engineering, 10+ years’ experience in telecommunications, optoelectronics, or microelectronics development with significant time in management role</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Significant experience with optical component design for performance, especially for InP devices</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Familiarity with InP opto-electronic fabrication, material characterization and epitaxy knowledge experience with product development is highly desired.</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">The Job will require frequent collaborative interaction with fab, epitaxy, test and reliability engineering, packaging, product engineering, and system engineering groups</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Strong leadership and communication and engineering and project management skills</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Experienced in leading a diverse team of strong Individual contributors</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Technical depth to understand concerns and communicate status and resolution to executive leadership team</span></span><br><span style=\"background-color:rgb(255,255,255);color:rgb(36,36,36);font-family:Calibri, sans-serif;\"><span style=\"-webkit-text-stroke-width:0px;display:inline !important;float:none;font-size:14.6667px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\">Ability to evaluate candidates, mentor and develop the team&nbsp;</span></span></p><p><span data-teams=\"true\">NION2026&nbsp;</span></p>",
    "OrganizationDescriptionStr": "<div style=\"\">\n Some of our benefits in&nbsp;<a href=\"https://www.nokia.com/careers/our-locations/united-states/\" target=\"_blank\" rel=\"nofollow\" style=\"\">US</a>:\n</div>\n<div style=\"\">\n <ul>\n  <li>Corporate Retirement Savings Plan</li>\n  <li>Health and dental benefits</li>\n  <li>Short-term disability, and long-term disability</li>\n  <li>Life insurance, and AD&amp;D – Company paid 2x base pay</li>\n  <li>Optional or Supplemental life and AD&amp;D insurance (Employee/Spouse/Child)</li>\n  <li>Paid time off for holidays and Vacation</li>\n  <li>Employee Stock Purchase Plan</li>\n  <li>Tuition Assistance Plan</li>\n  <li>Adoption assistance</li>\n  <li>Employee Assistance Program/Work Life Resource Program</li>\n </ul>\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n The above benefits exclude students.\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n <b>Disclaimer for US/Canada</b>\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity.&nbsp;Check the salary ranges in the job info section for this role.\n</div>\n<div style=\"\">\n <br/>\n</div>\n<div style=\"\">\n <b>All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.</b>\n</div>",
    "primaryLocationCoordinates": [
      {
        "Latitude": "39.82844",
        "Longitude": "-98.57939",
        "CountryCode": "US",
        "GeographyId": 300000000480126,
        "GeographyNodeId": 100000448855450
      }
    ],
    "ExternalResponsibilitiesStr": "<ul style=\"list-style-type: disc;\"><li><strong>Technical Lead:</strong>&nbsp;Drive the design and test strategy for high-performance InP based 200Gbaud+ modulators and photodetectors within Nokia’s optical engine portfolio.</li><li><strong>RF Design &amp; Signal Integrity:</strong>&nbsp;Lead RF design for Coherent and IMDD PICs, collaborating closely with assembly teams to optimize signal integrity and mitigate crosstalk.</li><li><strong>Device Physics and Epi Design:</strong>&nbsp;Apply semiconductor physics expertise to optimize device structures, focusing performance metrics (e.g., Vpi, extinction ratio, leakage, and responsivity) to ensure robust fundamental operation.</li><li><strong>Design Methodology:</strong>&nbsp;Establish and execute rigorous PIC design methodologies and fabrication, test processes to ensure scalable, high-quality hardware delivery.</li><li><strong>Test Strategy &amp; Execution:</strong>&nbsp;Partner with test engineering to develop and implement comprehensive test strategies for both R&amp;D development and production environments.</li><li><strong>Fabrication Interface:</strong>&nbsp;Partner with internal teams to define, troubleshoot, and optimize the PIC fabrication process, ensuring alignment between design requirements and process capabilities.</li><li><strong>Technical Problem Solving:</strong>&nbsp;Independently resolve complex organizational and technical bottlenecks to keep development cycles on track.</li><li><strong>Mentorship:</strong>&nbsp;Provide technical guidance and leadership to scale the team’s collective capabilities in support of optical engine development.</li></ul>",
    "InternalResponsibilitiesStr": "<ul style=\"list-style-type: disc;\"><li><strong>Technical Lead:</strong>&nbsp;Drive the design and test strategy for high-performance InP based 200Gbaud+ modulators and photodetectors within Nokia’s optical engine portfolio.</li><li><strong>RF Design &amp; Signal Integrity:</strong>&nbsp;Lead RF design for Coherent and IMDD PICs, collaborating closely with assembly teams to optimize signal integrity and mitigate crosstalk.</li><li><strong>Device Physics and Epi Design:</strong>&nbsp;Apply semiconductor physics expertise to optimize device structures, focusing performance metrics (e.g., Vpi, extinction ratio, leakage, and responsivity) to ensure robust fundamental operation.</li><li><strong>Design Methodology:</strong>&nbsp;Establish and execute rigorous PIC design methodologies and fabrication, test processes to ensure scalable, high-quality hardware delivery.</li><li><strong>Test Strategy &amp; Execution:</strong>&nbsp;Partner with test engineering to develop and implement comprehensive test strategies for both R&amp;D development and production environments.</li><li><strong>Fabrication Interface:</strong>&nbsp;Partner with internal teams to define, troubleshoot, and optimize the PIC fabrication process, ensuring alignment between design requirements and process capabilities.</li><li><strong>Technical Problem Solving:</strong>&nbsp;Independently resolve complex organizational and technical bottlenecks to keep development cycles on track.</li><li><strong>Mentorship:</strong>&nbsp;Provide technical guidance and leadership to scale the team’s collective capabilities in support of optical engine development.</li></ul>",
    "InternationalTravelRequired": null
  },
  "list_job": {
    "Id": "33907",
    "Title": "Senior Principal Engineer – High-speed PIC Development",
    "JobType": null,
    "Distance": 1775088000000,
    "JobShift": null,
    "Language": "US",
    "WorkDays": null,
    "JobFamily": null,
    "Relevancy": 2,
    "WorkHours": null,
    "Department": null,
    "HotJobFlag": false,
    "PostedDate": "2026-04-02",
    "StudyLevel": null,
    "WorkerType": null,
    "GeographyId": 300000000480126,
    "JobFunction": null,
    "JobSchedule": null,
    "BusinessUnit": null,
    "ContractType": null,
    "ManagerLevel": null,
    "Organization": null,
    "TrendingFlag": false,
    "workLocation": [
      {
        "Country": "US",
        "Region1": null,
        "Region2": "California",
        "Region3": null,
        "Building": null,
        "Latitude": 37.4023,
        "Longitude": -122.00764,
        "LocationId": 300000764022944,
        "PostalCode": "94089-1005",
        "TownOrCity": "Sunnyvale",
        "AddressLine1": "1322 Bordeaux Drive",
        "AddressLine2": null,
        "AddressLine3": null,
        "AddressLine4": null,
        "LocationName": "Infinera Bordeaux Dr"
      }
    ],
    "LegalEmployer": null,
    "MediaThumbURL": null,
    "WorkplaceType": "Hybrid",
    "BusinessUnitId": 300000006664259,
    "OrganizationId": 300000806573105,
    "PostingEndDate": null,
    "LegalEmployerId": 300001149319675,
    "PrimaryLocation": "United States",
    "WorkDurationYears": null,
    "WorkplaceTypeCode": "ORA_HYBRID",
    "BeFirstToApplyFlag": false,
    "WorkDurationMonths": null,
    "otherWorkLocations": [
      {
        "Country": "JP",
        "Region1": null,
        "Region2": null,
        "Region3": null,
        "Building": null,
        "Latitude": 35.65,
        "Longitude": 139.7333,
        "LocationId": 300000011430147,
        "PostalCode": "106-6141",
        "TownOrCity": "Tokyo",
        "AddressLine1": "6-10-1 Roppongi, Minato-ku",
        "AddressLine2": null,
        "AddressLine3": null,
        "AddressLine4": null,
        "LocationName": "Roppongi Hills Mori Tower",
        "RequisitionWorkLocationId": 300001916799693
      }
    ],
    "secondaryLocations": [],
    "ShortDescriptionStr": "The Senior Principal Engineer – High-speed PIC Development Engineer will oversee the design, development, and transfer to manufacturing of Nokia's Photonic Integrated Circuits (PIC) products. ",
    "requisitionFlexFields": [],
    "DomesticTravelRequired": null,
    "PrimaryLocationCountry": "US",
    "ExternalQualificationsStr": null,
    "ExternalResponsibilitiesStr": null,
    "InternationalTravelRequired": null
  },
  "detail_meta": {
    "url": "https://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmRestApi/resources/latest/recruitingCEJobRequisitionDetails?expand=all&onlyData=true&finder=ById;Id=%2233907%22,siteNumber=CX_1",
    "http_status": 200,
    "content_type": "application/json",
    "response_bytes": 22555
  },
  "detail_errors": []
}
Get this page with API

Rendered from the bluedoor Job Postings API. Reproduce it:

GET https://api.bluedoor.sh/job-postings/v1/jobs/cf68c63045337a73198b4edbb71cb6c26f77d84d?include=descriptionJSON
GET https://api.bluedoor.sh/job-postings/v1/orgs/0229f528-a584-4e4f-9943-249cfaac294eJSON
GET https://api.bluedoor.sh/job-postings/v1/sources/dbfc4c22-73ba-4fc5-9705-234e3e914c7cJSON
GET https://api.bluedoor.sh/job-postings/v1/jobs/cf68c63045337a73198b4edbb71cb6c26f77d84d/eventsJSON