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HomeCompaniesDdf923b7 C798 4af2 9f4e 9a2afc104011 19000101 000001Field Application Engineer - PCB

Field Application Engineer - PCB

Ddf923b7 C798 4af2 9f4e 9a2afc104011 19000101 000001 · Austin, TX, US, Austin, TX · Deleted · ADP Workforce Now Recruiting

Job facts

FieldValue
CompanyDdf923b7 C798 4af2 9f4e 9a2afc104011 19000101 000001
TitleField Application Engineer - PCB
Normalized title-
Department / team-
LocationAustin, TX, United States
Work model-
Employment typeFull Time
Salary-
Statusdeleted
ATS providerADP Workforce Now Recruiting
Posted / first seen2025-12-12 / 2026-05-31
Changed / last seen2026-06-03 / 2026-06-01

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Linked records

CompanyDdf923b7 C798 4af2 9f4e 9a2afc104011 19000101 000001
Source7b0a43e2-3ec9-4aef-bc6e-30e7b54d8a03
ATS providerADP Workforce Now Recruiting

Description

Foxconn E BG Job Description Job Title: Field Application Engineer - PCB FSLA Status (Exempt or Non-exempt): Exempt Location (City, State): Austin, TX Reports To: Senior Assistant Manager Direct Reports (Yes, No): No Company Overview: Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 200 campuses across 24 countries. In the US, Foxconn employs 6,500 across 40 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas and California. As of 2023, Foxconn ranks 32 nd among the Fortune Global 500 and reported a revenue of approximately USD $213 billion in 2024. The company’s diverse product offerings span four major segments: smart consumer electronics, cloud and networking solutions, computing and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together these initiatives position the company as a leader for innovation in the 21st century. Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious productions methods. Job Summary: The primary function of the Field Application Engineer - PCB is to provide technical support for customer design and engineering teams, support integration and application of the company’s products in customer environments. This role acts as a bridge between R&D and client-facing functions to support successful PCB design, deployment, and ongoing performance. Duties and Responsibilities: Provide application and product-level support to clients Collaborate with customer engineering teams on integration, debugging, and performance optimization. Translate client technical requirements to internal R&D teams. Deliver technical training, product demos, and documentation to customers. Conduct failure analysis (FA) and root-cause investigation and recommend solutions. Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing). Optimize testing processes and create reliable automated test programs. Collaborate cross-functionally with R&D, manufacturing, and quality teams to ensure products meet engineering specifications and customer expectations. Create field reports, support documentation, and provide feedback for continuous improvement. Leverage extensive personal experience in PCB design and material science to become a trusted partner for our customers. Stay updated on PCB technology trends and industry developments; propose recommendations to support product improvement and innovation. Perform other duties as assigned. Education: Bachelor’s degree in Electronic Engineering or related field. Experience: 3-5 years of experience in in PCB design, manufacturing, or testing. Additional work experience should be related to the electronics industry, with a total of approximately 8 years of professional experience. Familiarity with: Electronic Components PCB fundamentals: stack-up / bring-up / FR4 / Rogers / TH / micro-via / HASL / ENIG High-Speed Signals / PI / EMC Manufacturing and Assembly: SMT / BGA / reflow profile / AOI / X-ray PCB-related tools: AutoCAD / Polar / SI9000 / Genesis / InFlow. Experience with Minitab and DOE methodologies is preferred. Proficient in Excel for data analysis. Other Requirements: Excellent communication and problem-solving skills, with the ability to collaborate effectively with customers and internal teams. Willingness to travel to customer sites to provide technical support. Ability to travel to Asia. (China, Vietnam) English and Mandarin speaking preferred. EEOC Statement Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.

Full job record

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First Seen At2026-05-31 18:38:45Z
Last Seen At2026-06-01 08:44:40Z
Last Checked At2026-06-03 08:47:05Z
Last Changed At2026-06-03 08:47:05Z
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Source Posted At2025-12-12 15:42:00Z
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    "requisitionDescription": "<div><div><div><div><div><div><div><div><div><div><div><div><p><br></p><p style='margin-top:0in;margin-right:0in;margin-bottom:0in;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;text-align:center;border:none;padding:0in;' data-pasted=\"true\"><strong><span style='font-size:19px;line-height:107%;font-family:\"Arial\",sans-serif;'>Foxconn E BG Job Description</span></strong></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Job Title: </span></strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Field Application Engineer - PCB</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>FSLA Status (Exempt or Non-exempt): </span></strong><span style='font-size:11px;font-family:\"Arial\",sans-serif;'>Exempt</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Location (City, State): </span></strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Austin, TX<strong>&nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp;</strong></span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Reports To: </span></strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Senior Assistant Manager<strong>&nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp;&nbsp;</strong></span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:1.5in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;text-indent:-1.5in;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Direct Reports (Yes, No):</span></strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>&nbsp;No</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:1.5in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;text-indent:-1.5in;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Company Overview:</span></strong></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;text-align:justify;'><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world&rsquo;s largest electronics manufacturer and leading provider of technological solutions with a network of over 200 campuses across 24 countries. In the US, Foxconn employs 6,500 across 40 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas and California. As of 2023, Foxconn ranks 32<sup>nd</sup> among the Fortune Global 500 and reported a revenue of approximately USD $213 billion in 2024.</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;line-height:115%;'><span style='font-size:11px;line-height:115%;font-family:\"Arial\",sans-serif;'>The company&rsquo;s diverse product offerings span four major segments: smart consumer electronics, cloud and networking solutions, computing and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together these initiatives position the company as a leader for innovation in the 21st century. &nbsp;</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;line-height:115%;'><span style='font-size:11px;line-height:115%;font-family:\"Arial\",sans-serif;'>Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious productions methods.&nbsp;</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:1.5in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;text-indent:-1.5in;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Job Summary:</span></strong></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>The primary function of the Field Application Engineer - PCB is to provide technical support for customer design and engineering teams, support integration and application of the company&rsquo;s products in customer environments. This role acts as a bridge between R&amp;D and client-facing functions to support successful PCB design, deployment, and ongoing performance.</span></p><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Duties and Responsibilities:</span></strong></p><div style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><ul style=\"margin-bottom:0in;list-style-type: disc;\"><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Provide application and product-level support to clients</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Collaborate with customer engineering teams on integration, debugging, and performance optimization.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Translate client technical requirements to internal R&amp;D teams.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Deliver technical training, product demos, and documentation to customers.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Conduct failure analysis (FA) and root-cause investigation and recommend solutions.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing).</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Optimize testing processes and create reliable automated test programs.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Collaborate cross-functionally with R&amp;D, manufacturing, and quality teams to ensure products meet engineering specifications and customer expectations.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Create field reports, support documentation, and provide feedback for continuous improvement.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Leverage extensive personal experience in PCB design and material science to become a trusted partner for our customers.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Stay updated on PCB technology trends and industry developments; propose recommendations to support product improvement and innovation.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Perform other duties as assigned.</span></li></ul></div><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Education:</span></strong></p><div style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><ul style=\"margin-bottom:0in;list-style-type: disc;\"><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Bachelor&rsquo;s degree in Electronic Engineering or related field.</span></li></ul></div><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>Experience:</span></strong></p><div style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><ul style=\"margin-bottom:0in;list-style-type: disc;\"><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>3-5 years of experience in</span> <span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>in PCB design, manufacturing, or testing.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Additional work experience should be related to the electronics industry, with a total of approximately 8 years of professional experience.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Familiarity with:</span><ol style=\"margin-bottom: 0in;list-style-type: circle;\"><li style=\"margin-top: 0in;margin-right: 0in;margin-bottom: 8pt;font-size:15px;font-family: Calibri, sans-serif;\"><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Electronic Components</span></li><li style=\"margin-top: 0in;margin-right: 0in;margin-bottom: 8pt;font-size:15px;font-family: Calibri, sans-serif;\"><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>PCB fundamentals: stack-up / bring-up / FR4 / Rogers / TH / micro-via / HASL&nbsp;</span><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>/ ENIG</span></li><li style=\"margin-top: 0in;margin-right: 0in;margin-bottom: 8pt;font-size:15px;font-family: Calibri, sans-serif;\"><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>High-Speed Signals / PI / EMC</span></li><li style=\"margin-top: 0in;margin-right: 0in;margin-bottom: 8pt;font-size:15px;font-family: Calibri, sans-serif;\"><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Manufacturing and Assembly: SMT / BGA / reflow profile / AOI / X-ray</span></li><li style=\"margin-top: 0in;margin-right: 0in;margin-bottom: 8pt;font-size:15px;font-family: Calibri, sans-serif;\"><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>PCB-related tools: AutoCAD / Polar / SI9000 / Genesis / InFlow.</span></li></ol></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Experience with Minitab and DOE methodologies is preferred.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Proficient in Excel for data analysis.</span></li></ul></div><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;font-family:\"Arial\",sans-serif;'>Other Requirements:</span></strong></p><div style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><ul style=\"margin-bottom:0in;list-style-type: disc;\"><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Excellent communication and problem-solving skills, with the ability to collaborate effectively with customers and internal teams.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Willingness to travel to customer sites to provide technical support.</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>Ability to travel to Asia. (China, Vietnam)&nbsp;</span></li><li style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><span style='line-height:107%;font-family:\"Arial\",sans-serif;font-size:11px;'>English and Mandarin speaking preferred.</span></li></ul></div><p style='margin-top:0in;margin-right:0in;margin-bottom:8.0pt;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;'><strong><span style='font-size:11px;line-height:107%;font-family:\"Arial\",sans-serif;'>EEOC Statement</span></strong></p><p style='margin-top:12.0pt;margin-right:0in;margin-bottom:.2in;margin-left:0in;font-size:11.0pt;font-family:\"Calibri\",sans-serif;text-align:justify;'><em><span style='font-size:11px;font-family:\"Arial\",sans-serif;'>Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.</span></em></p><p><br></p></div></div></div></div></div></div></div></div></div></div></div></div>\n",
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