Packaging Engineer - Inductor and Power Module

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    "CorporateDescriptionStr": "<div>\n <div>\n  <b>Why TI?</b>\n </div>\n <div>\n  <ul>\n   <li>Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.</li>\n   <li>We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.&nbsp;<a href=\"https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012\" target=\"_blank\" rel=\"nofollow\">Meet the people of TI</a></li>\n   <li>Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.</li>\n  </ul>\n </div>\n <div>\n  <br>\n </div>\n <div>\n  <div></div>\n  <div>\n   <b>About Texas Instruments</b>\n  </div>\n  <div>\n   Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more&nbsp;at&nbsp;<a href=\"https://www.ti.com/\" target=\"_blank\" rel=\"nofollow\">TI.com</a>.\n  </div>\n  <div>\n   <br>\n  </div>\n  <div>\n   <div>\n    Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.\n   </div>\n   <div>\n    <br>\n   </div>\n   <div>\n    If you are interested in this position, please apply to this requisition.\n   </div>\n  </div>\n </div>\n</div>\n<div>\n</div>",
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    "ExternalQualificationsStr": "<p><strong>Minimum requirements:</strong></p><ul><li>MS in Electrical Engineering, Materials Science, or a related field with deep focus on&nbsp;magnetics and power packaging</li><li>10+ years of hands-on experience in power inductor design supporting&nbsp;advanced power topologies, including&nbsp;TLVR &amp; multiphase coupled inductors (upto 20MHz)&nbsp;with a track record of joint development, qualification, and scaling</li><li>Strong fundamentals in the physics of magnetic materials: ex. Stoner-Wohlfarth, Steinmetz models, Ollendorf models for composite materials, etc. &nbsp;</li><li>Experience with Material Characterization (ex; BH analyzer, VSM, SEM, EDX)</li><li>Experience in advanced co-packaged power modules&nbsp;</li><li>Strong IP generation background in magnetics, packaging, or passive integration domains</li></ul><p><strong>Preferred qualifications:</strong></p><ul><li>PhD in Electrical Engineering, Materials Science, or a related field with deep focus on&nbsp;magnetics and power packaging</li><li>System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints</li><li>In depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous &amp; nano crystalline materials)&nbsp;</li><li>Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing.&nbsp; Hands on knowledge of simulation tools and techniques like&nbsp;Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML)&nbsp;</li><li>Understanding of material processing: ceramic, metal powder and composite materials&nbsp;</li><li>Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc.&nbsp;</li><li>Deep insights in magnetic supplier capabilities, roadmaps and emerging research &nbsp;</li></ul>",
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