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Signal Integrity Lead Engineer

Kandou · Hyderabad, Telangana, 500081, India · Active · BambooHR

Job facts

FieldValue
CompanyKandou
TitleSignal Integrity Lead Engineer
Normalized title-
Department / teamRnD
LocationHyderabad, Telangana
Work model-
Employment type100%
Salary-
Statusactive
ATS providerBambooHR
Posted / first seen2026-03-16 / 2026-05-30
Changed / last seen2026-05-30 / 2026-06-06

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PageWhat it containsOpen
Company jobsActive postings from Kandou.Open
Company breakdownsRole, location, ATS, and work model facets for this company.Open
ATS provider jobsActive postings observed through BambooHR.Open
Provider filtered searchThe same provider as a filtered job collection.Open
City jobsActive postings in Hyderabad.Open
Department jobsActive postings in RnD.Open
Lifecycle eventsOpen, update, close, and reopen events for this posting.Open
Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyKandou
Source64983dea-9ef1-42d4-b54b-7c4f8f52df83
ATS providerBambooHR

Description

At   Kandou , we are redefining the economics of AI infrastructure. Our mission is to   democratise AI by significantly reducing the Total Cost of Ownership (TCO)   of hardware systems — a critical barrier to scalable adoption. Our proprietary   MIMO-over-copper technology   powers a   high-performance, chiplet-based AI memory fabric   that is both   scalable and energy-efficient . Unlike traditional interconnects, our solution   reduces power consumption significantly   while preserving   high bandwidth and ultra-low latency   — unlocking unprecedented efficiency for AI training and inference at scale. Kandou’s architecture is not just an incremental improvement — it’s a   foundational shift   in how AI hardware is built for the future. We are actively seeking a Senior SI/PI Engineer in Hyderabad or Bangalore. Required Experience: 15+ years of experience in the semiconductor industry, with a focus on topics related to signal and power integrity Strong foundation in electromagnetics and system-level design, including material (package, PCB, board, connector, cable), as well as analog, power, and digital electronics Proven leadership of SI/PI, package, and PCB teams delivering multi-Gbps link solutions. Must be able to articulate one or more significant SI problems that were solved with innovative design of connector, package or cable. Hands-on problem solver with the ability to quickly grasp new concepts and translate them into practical solution Curious, fast learner who thrives in tackling unfamiliar challenges and driving them to completion in real-world systems Collaborative  team player with strong cross-functional communication skills Responsibility: Lead the SI/PI function at Kandou AI, defining methodologies, best practices, and technical direction Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges Work closely with circuit designers to ensure robust SI/PI implementation in silicon Engage with customers and suppliers to define and validate hardware solutions (packages, PCB/backplane layouts, materials, interposers, connectors) for Kandou products Perform and lead theoretical and simulation-based SI analysis of products, channels, test structures, and system implementations Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders Evaluate and benchmark signaling schemes (e.g., Chord signaling, PAM) in terms of SI/PI performance, power, and implementation trade-offs Drive SI/PI and power delivery solutions for packages and evaluation platforms in collaboration with design teams Collaborate with system architects to define and extract channel specifications and requirements Skills Deep understanding of SI/PI design and simulation across abstraction levels, from EM modeling to system-level link behavior Expertise with EM/SI/PI tools and modeling flows, including calibration, correlation, and validation. Sufficient familiarity with lab measurements with VNA, spectrum analyzers and high-speed scopes is expected. Strong intuition for EM simulation trade-offs (accuracy, runtime, model complexity) and their impact on design decisions Experience with channel modeling and extraction for multi-Gbps systems, including end-to-end link considerations Proficiency in Linux-based design environments and scripting (MATLAB, Python) for modeling and automation Solid understanding of signaling schemes and link architectures, including their performance, complexity, and power trade-offs Qualifications: Required: Masters of Engineering in Physics Electronics or Electrical Engineering (equivalent or higher) Desired: PhD in electromagnetics related areas such as physics or Electrical or Electronics engineering If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It! https://www.kandou.ai/

Full job record

Job ID9eba0037d69a253d1dcad10489fcdb5a7f20c34c
Org ID1ae701b9-9418-4842-b2f8-f7bf3d8771b7
Source ID64983dea-9ef1-42d4-b54b-7c4f8f52df83
Board ID64983dea-9ef1-42d4-b54b-7c4f8f52df83
Providerbamboohr
Provider Job Key360
TitleSignal Integrity Lead Engineer
Normalized Title
Statusactive
Activeyes
Location TextHyderabad, Telangana, 500081, India
DepartmentRnD
Team
Employment Type100%
Workplace Type
Remote Policy
Country
RegionTelangana
CityHyderabad
Salary Raw
Salary Min
Salary Max
Salary Currency
Salary Period
Source URLhttps://kandou.bamboohr.com/careers/360
Apply URLhttps://kandou.bamboohr.com/careers/360
First Seen At2026-05-30 05:51:22Z
Last Seen At2026-06-06 10:29:40Z
Last Checked At2026-06-06 10:29:40Z
Last Changed At2026-05-30 05:51:22Z
Inactive At
Source Posted At2026-03-16 00:00:00Z
Source Updated At
Raw Payload Uris3://job-postings-prod-raw-590183727216/raw/provider=bamboohr/board=kandou/date=2026-06-06/2026-06-06T10-29-36-845Z-8365583b94518475f827ee62d62b0c92e91a5b6da549a46e258b1dd7e976ebda.json
Event Fields
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Parsed Structured
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Extensions
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    "description": "<p>At<span> </span><span style=\"font-weight: bold\">Kandou</span>, we are redefining the economics of AI infrastructure. Our mission is to<span> </span><span style=\"font-weight: bold\">democratise AI by significantly reducing the Total Cost of Ownership (TCO)<span> </span></span>of hardware systems — a critical barrier to scalable adoption.</p>\n<p><br></p>\n<p>Our proprietary<span> </span><span style=\"font-weight: bold\">MIMO-over-copper technology<span> </span></span>powers a<span> </span><span style=\"font-weight: bold\">high-performance, chiplet-based AI memory fabric<span> </span></span>that is both<span> </span><span style=\"font-weight: bold\">scalable and energy-efficient</span>. Unlike traditional interconnects, our solution<span> </span><span style=\"font-weight: bold\">reduces power consumption significantly<span> </span></span>while preserving<span> </span><span style=\"font-weight: bold\">high bandwidth and ultra-low latency<span> </span></span>— unlocking unprecedented efficiency for AI training and inference at scale.</p>\n<p>Kandou’s architecture is not just an incremental improvement — it’s a<span> </span><span style=\"font-weight: bold\">foundational shift<span> </span></span>in how AI hardware is built for the future.</p>\n<p><br></p>\n<p><span style=\"color: rgb(34, 34, 34); font-size: 12pt\"><span style=\"font-weight: bold\">We are actively seeking a Senior SI/PI Engineer in Hyderabad or Bangalore.</span></span></p>\n<p><span style=\"color: rgb(34, 34, 34); font-size: 12pt\"><span style=\"font-weight: bold\"><br></span></span><br></p>\n<p><span style=\"color: rgb(34, 34, 34); font-size: 12pt\"><span style=\"font-weight: bold\"><span style=\"color: rgb(56, 49, 47); font-weight: bold\">Required Experience:</span></span></span></p>\n<p><br></p>\n<ul>\n<li>15+ years of experience in the semiconductor industry, with a focus on topics related to signal and power integrity</li>\n</ul>\n<ul>\n<li>Strong foundation in electromagnetics and system-level design, including material (package, PCB, board, connector, cable), as well as analog, power, and digital electronics</li>\n</ul>\n<ul>\n<li>Proven leadership of SI/PI, package, and PCB teams delivering multi-Gbps link solutions. Must be able to articulate one or more significant SI problems that were solved with innovative design of connector, package or cable.</li>\n</ul>\n<ul>\n<li>Hands-on problem solver with the ability to quickly grasp new concepts and translate them into practical solution</li>\n</ul>\n<ul>\n<li>Curious, fast learner who thrives in tackling unfamiliar challenges and driving them to completion in real-world systems</li>\n</ul>\n<ul>\n<li>Collaborative  team player with strong cross-functional communication skills</li>\n</ul>\n<p><br></p>\n<p><span style=\"font-weight: bold\">Responsibility:</span></p>\n<p><span style=\"color: rgb(34, 34, 34); font-size: 12pt\"><br></span></p>\n<ul>\n<li>Lead the SI/PI function at Kandou AI, defining methodologies, best practices, and technical direction</li>\n</ul>\n<ul>\n<li>Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges</li>\n</ul>\n<ul>\n<li>Work closely with circuit designers to ensure robust SI/PI implementation in silicon</li>\n</ul>\n<ul>\n<li>Engage with customers and suppliers to define and validate hardware solutions (packages, PCB/backplane layouts, materials, interposers, connectors) for Kandou products</li>\n</ul>\n<ul>\n<li>Perform and lead theoretical and simulation-based SI analysis of products, channels, test structures, and system implementations</li>\n</ul>\n<ul>\n<li>Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders</li>\n</ul>\n<ul>\n<li>Evaluate and benchmark signaling schemes (e.g., Chord signaling, PAM) in terms of SI/PI performance, power, and implementation trade-offs</li>\n</ul>\n<ul>\n<li>Drive SI/PI and power delivery solutions for packages and evaluation platforms in collaboration with design teams</li>\n</ul>\n<ul>\n<li>Collaborate with system architects to define and extract channel specifications and requirements</li>\n</ul>\n<p><br></p>\n<p><span style=\"font-weight: bold\">Skills</span></p>\n<ul>\n<li>Deep understanding of SI/PI design and simulation across abstraction levels, from EM modeling to system-level link behavior</li>\n</ul>\n<ul>\n<li>Expertise with EM/SI/PI tools and modeling flows, including calibration, correlation, and validation. Sufficient familiarity with lab measurements with VNA, spectrum analyzers and high-speed scopes is expected.</li>\n</ul>\n<ul>\n<li>Strong intuition for EM simulation trade-offs (accuracy, runtime, model complexity) and their impact on design decisions</li>\n</ul>\n<ul>\n<li>Experience with channel modeling and extraction for multi-Gbps systems, including end-to-end link considerations</li>\n</ul>\n<ul>\n<li>Proficiency in Linux-based design environments and scripting (MATLAB, Python) for modeling and automation</li>\n</ul>\n<ul>\n<li>Solid understanding of signaling schemes and link architectures, including their performance, complexity, and power trade-offs</li>\n</ul>\n<p><br><br></p>\n<p><span style=\"font-weight: bold\">Qualifications:</span></p>\n<ul>\n<li>Required: Masters of Engineering in Physics Electronics or Electrical Engineering (equivalent or higher)</li>\n</ul>\n<ul>\n<li>Desired: PhD in electromagnetics related areas such as physics or Electrical or Electronics engineering</li>\n</ul>\n<p><br></p>\n<p><span style=\"font-size: 12pt\">If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!</span></p>\n<p><br></p>\n<p><span style=\"font-size: 12pt\"><a href=\"https://www.kandou.ai/\" target=\"_blank\" rel=\"noopener noreferrer\">https://www.kandou.ai/</a></span></p>",
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