Home › Companies › Renesaselectronics › Sr Staff Package Design Engineer
Sr Staff Package Design Engineer
Renesaselectronics · Tempe, Arizona, United States · Hybrid · Deleted · SmartRecruiters
Job facts
| Field | Value |
|---|---|
| Company | Renesaselectronics |
| Title | Sr Staff Package Design Engineer |
| Normalized title | - |
| Department / team | Manufacturing |
| Location | Tempe, AZ, United States |
| Work model | Hybrid / Hybrid |
| Employment type | Full Time |
| Salary | - |
| Status | deleted |
| ATS provider | SmartRecruiters |
| Posted / first seen | 2026-04-23 / 2026-05-31 |
| Changed / last seen | 2026-06-18 / 2026-06-16 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from Renesaselectronics. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through SmartRecruiters. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in Tempe. | Open |
| Department jobs | Active postings in Manufacturing. | Open |
| Work model jobs | Active Hybrid postings. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | Renesaselectronics |
| Source | 39f58afe-87d4-4c84-b37a-4d3a26e8dbfe |
| ATS provider | SmartRecruiters |
Description
We are currently searching for a Sr. Staff Package Design Engineer.
RESPONSIBILITIES :
Design and develop hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging working with hermetic package suppliers NTK, Kyocera, Shinko.
Familiarity with Mil Std 883, 38535, 750 specifications
Define package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability Power Applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay).
Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
Work with OSAT (Outsourced Semiconductor Assembly & Test)/Palm Bay to run DOE to optimize processes and establish process specs.
Work with Product groups and Reliability team, qualify new packages and processes within the required schedule from Product Engineer/Program manager.
Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages.
Participate in packaging roadmap development & focus on execution.
Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. 5-12 years of relevant experience in package development emphasizing hermetic/ceramic /metal and RAD tolerant / class P plastic package. Preferred understanding of semiconductor hermetic\plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SPC(Statistical Process Control) and statistical analysis a plus. Strong interpersonal and communication skills. Strong analytical and presentation skills.
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’
At Renesas, you can:
Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us .
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement .
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.
Full job record
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| Board ID | 39f58afe-87d4-4c84-b37a-4d3a26e8dbfe |
| Provider | smartrecruiters |
| Provider Job Key | 744000122506949 |
| Title | Sr Staff Package Design Engineer |
| Normalized Title | — |
| Status | deleted |
| Active | no |
| Location Text | Tempe, Arizona, United States |
| Department | Manufacturing |
| Team | — |
| Employment Type | full_time |
| Workplace Type | hybrid |
| Remote Policy | hybrid |
| Country | United States |
| Region | AZ |
| City | Tempe |
| Salary Raw | We are currently searching for a Sr. Staff Package Design Engineer. RESPONSIBILITIES : Design and develop hermetic/ceramic/metal and RAD (radiation) tolerant / class P plastic package and interconnect methods for Renesas’s packaging needs in the areas of Commercial Space/ Aerospace, High Reliability power device packaging working with hermetic package suppliers NTK, Kyocera, Shinko. Familiarity with Mil Std 883, 38535, 750 specifications Define package technologies tooling & qualification for Commercial Space/ Aerospace, High Reliability Power Applications. Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test) or in-house assembly site (Palm Bay). Work with Renesas product designers to develop detailed package drawings for hermetic and plastic packages using AutoCAD. Work with OSAT (Outsourced Semiconductor Assembly & Test)/Palm Bay to run DOE to optimize processes and establish process specs. Work with Product groups and Reliability team, qualify new packages and processes within the required schedule from Product Engineer/Program manager. Develop and maintain technical expertise on advances and innovations in hermetic/ceramic/ metal and RAD tolerant / class P plastic packages. Participate in packaging roadmap development & focus on execution. Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. 5-12 years of relevant experience in package development emphasizing hermetic/ceramic /metal and RAD tolerant / class P plastic package. Preferred understanding of semiconductor hermetic\plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SPC(Statistical Process Control) and statistical analysis a plus. Strong interpersonal and communication skills. Strong analytical and presentation skills. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Shape Your Future with Us . Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas. We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning. |
| Salary Min | — |
| Salary Max | — |
| Salary Currency | — |
| Salary Period | day |
| Source URL | https://jobs.smartrecruiters.com/RenesasElectronics/744000122506949-sr-staff-package-design-engineer |
| Apply URL | https://jobs.smartrecruiters.com/RenesasElectronics/744000122506949-sr-staff-package-design-engineer?oga=true |
| First Seen At | 2026-05-31 17:36:37Z |
| Last Seen At | 2026-06-16 11:47:23Z |
| Last Checked At | 2026-06-18 10:43:48Z |
| Last Changed At | 2026-06-18 10:43:48Z |
| Inactive At | 2026-06-18 10:43:48Z |
| Source Posted At | 2026-04-23 16:42:01Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=smartrecruiters/board=renesaselectronics/date=2026-06-16/2026-06-16T11-47-02-525Z-35513c1900c050a69f916d1920ae7ea4fdaa6027dec174b5e0060c4d5e443b5c.json |
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