Home › Companies › Kandou › Firmware Engineer Lead
Firmware Engineer Lead
Kandou · Hyderabad, Telangana, 500081, India · Active · BambooHR
Job facts
| Field | Value |
|---|---|
| Company | Kandou |
| Title | Firmware Engineer Lead |
| Normalized title | - |
| Department / team | Engineering |
| Location | Hyderabad, Telangana |
| Work model | - |
| Employment type | 100% |
| Salary | - |
| Status | active |
| ATS provider | BambooHR |
| Posted / first seen | 2026-03-02 / 2026-05-30 |
| Changed / last seen | 2026-05-30 / 2026-06-19 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from Kandou. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through BambooHR. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in Hyderabad. | Open |
| Department jobs | Active postings in Engineering. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | Kandou |
| Source | 64983dea-9ef1-42d4-b54b-7c4f8f52df83 |
| ATS provider | BambooHR |
Description
At Kandou , we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient . Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Firmware Engineer Lead, based in Pune.
Required Experience:
Experience developing embedded firmware for PCIe products.
High level of proficiency in C (preferred) or C++, including development of C-based SDKs.
High level of proficiency in Python for automating pre-processors/post-processors.
Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.
Hands-on experience with Server, Storage, and/or Networking equipment (e.g. Network Switches).
Familiarity with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces
Direct experience working on products with high-speed interfaces common in Data Center equipment: PCI- Express (Gen-3 and above), 100/400G Ethernet, Infiniband, NVMe, etc
Preferred Experience:
Experience developing firmware to execute in on-chip microcontrollers as well as C-language SDKs to execute on system management controllers (e.g. BMC)
Experience with industry forums and collaboration workgroups such as OCP and OpenBMC
Experience with storage or SSD firmware, including NVMe, PCIe, CXL or flash management concepts.
Hands-on experience with simulation or virtual platform–based development (e.g., VDK, QEMU, or similar)
Qualifications:
Strong academic and technical background in electrical engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.
Minimum 12+ years’ (Lead/Architect) experience supporting or developing complex SoC/silicon products for Server, Storage, and/or Networking applications
Experience developing firmware to execute in on-chip microcontrollers as well as C-language software development kits (SDKs) to execute on system management controllers (e.g. BMC).
Experience working with logic designers to architect and verify HW-SW interfaces on complex SoCs.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Full job record
| Job ID | 974743e6e293408dfb98b1443c69e3071e633393 |
| Org ID | 1ae701b9-9418-4842-b2f8-f7bf3d8771b7 |
| Source ID | 64983dea-9ef1-42d4-b54b-7c4f8f52df83 |
| Board ID | 64983dea-9ef1-42d4-b54b-7c4f8f52df83 |
| Provider | bamboohr |
| Provider Job Key | 355 |
| Title | Firmware Engineer Lead |
| Normalized Title | — |
| Status | active |
| Active | yes |
| Location Text | Hyderabad, Telangana, 500081, India |
| Department | Engineering |
| Team | — |
| Employment Type | 100% |
| Workplace Type | — |
| Remote Policy | — |
| Country | — |
| Region | Telangana |
| City | Hyderabad |
| Salary Raw | — |
| Salary Min | — |
| Salary Max | — |
| Salary Currency | — |
| Salary Period | — |
| Source URL | https://kandou.bamboohr.com/careers/355 |
| Apply URL | https://kandou.bamboohr.com/careers/355 |
| First Seen At | 2026-05-30 05:51:22Z |
| Last Seen At | 2026-06-19 10:33:29Z |
| Last Checked At | 2026-06-19 10:33:29Z |
| Last Changed At | 2026-05-30 05:51:22Z |
| Inactive At | — |
| Source Posted At | 2026-03-02 00:00:00Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=bamboohr/board=kandou/date=2026-06-19/2026-06-19T10-33-25-116Z-7e1226b9288b001225ee481d431f3ce5a3fa2460f8729ecf449d9806a4744b01.json |
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"description": "<p>At <span style=\"font-weight: bold\">Kandou</span>, we are redefining the economics of AI infrastructure. Our mission is to <span style=\"font-weight: bold\">democratise AI by significantly reducing the Total Cost of Ownership (TCO) </span>of hardware systems — a critical barrier to scalable adoption.</p>\n<p><br></p>\n<p>Our proprietary <span style=\"font-weight: bold\">MIMO-over-copper technology </span>powers a <span style=\"font-weight: bold\">high-performance, chiplet-based AI memory fabric </span>that is both <span style=\"font-weight: bold\">scalable and energy-efficient</span>. Unlike traditional interconnects, our solution <span style=\"font-weight: bold\">reduces power consumption significantly </span>while preserving <span style=\"font-weight: bold\">high bandwidth and ultra-low latency </span>— unlocking unprecedented efficiency for AI training and inference at scale.</p>\n<p><br></p>\n<p>Kandou’s architecture is not just an incremental improvement — it’s a <span style=\"font-weight: bold\">foundational shift </span>in how AI hardware is built for the future.</p>\n<p><br></p>\n<p><span style=\"color: rgb(34, 34, 34); font-family: Inter, sans-serif; font-size: 12pt\"><span style=\"font-weight: bold\">We are actively seeking a Firmware Engineer Lead, based in Pune.</span></span></p>\n<p><span style=\"color: rgb(34, 34, 34); font-family: Inter, sans-serif; font-size: 12pt\"> </span></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 12pt; font-weight: bold\">Required Experience:</span></p>\n<ul>\n<li>Experience developing embedded firmware for PCIe products.</li>\n<li>High level of proficiency in C (preferred) or C++, including development of C-based SDKs.</li>\n<li>High level of proficiency in Python for automating pre-processors/post-processors.</li>\n<li>Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.</li>\n<li>Hands-on experience with Server, Storage, and/or Networking equipment (e.g. Network Switches).</li>\n<li>Familiarity with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces</li>\n<li>Direct experience working on products with high-speed interfaces common in Data Center equipment: PCI- Express (Gen-3 and above), 100/400G Ethernet, Infiniband, NVMe, etc<br></li>\n</ul>\n<p><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 12pt; font-weight: bold\">Preferred Experience:</span></p>\n<ul>\n<li>Experience developing firmware to execute in on-chip microcontrollers as well as C-language SDKs to execute on system management controllers (e.g. BMC)</li>\n<li>Experience with industry forums and collaboration workgroups such as OCP and OpenBMC</li>\n<li>Experience with storage or SSD firmware, including NVMe, PCIe, CXL or flash management concepts.</li>\n<li>Hands-on experience with simulation or virtual platform–based development (e.g., VDK, QEMU, or similar)</li>\n</ul>\n<p><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 12pt; font-weight: bold\">Qualifications:</span></p>\n<ul>\n<li>Strong academic and technical background in electrical engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.</li>\n<li>Minimum 12+ years’ (Lead/Architect) experience supporting or developing complex SoC/silicon products for Server, Storage, and/or Networking applications</li>\n<li>Experience developing firmware to execute in on-chip microcontrollers as well as C-language software development kits (SDKs) to execute on system management controllers (e.g. BMC).</li>\n<li>Experience working with logic designers to architect and verify HW-SW interfaces on complex SoCs.</li>\n</ul>\n<p><br></p>\n<ul></ul>\n<p><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 12pt\">If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!</span></p>\n<p><br></p>\n<p><span style=\"font-family: Inter, sans-serif; font-size: 12pt\"><a href=\"https://www.kandou.ai/\" target=\"_blank\" rel=\"noopener noreferrer\">https://www.kandou.ai/</a></span></p>",
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