Senior Post Fab Module Engineer (MOSFET)

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    "ExternalDescriptionStr": "<p>We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY.&nbsp; This role is critical to our ability to improve device performance and drive best in class trench<strong> MOSFET Technology</strong> as we develop new products and ramp volume manufacturing.&nbsp; &nbsp;Job role requires an Engineer who is ready to step in as a leader withing the Team and who has experience in wafer thinning, ultra-thin wafer handling, backside metallization, and managing stress and thermal effects on thinned wafers.</p>",
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    "CorporateDescriptionStr": "<div>\n <b>onsemi&nbsp;</b><span class=\"ui-provider\">(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.<br></span>\n</div>\n<div>\n <span class=\"ui-provider\"><br></span>\n</div>\n<div>\n <p style=\"margin: 0in\"><b><span style=\"font-weight: normal\">More details about our company benefits can be found here:</span></b></p>\n <p style=\"margin: 0in\"><a href=\"https://www.onsemi.com/careers/career-benefits\" target=\"_blank\" rel=\"nofollow\">https://www.onsemi.com/careers/career-benefits</a></p>\n</div>",
    "ExternalPostedStartDate": "2026-04-29T00:39:25+00:00",
    "ExternalQualificationsStr": "<p><strong>Education / Experience:</strong></p>\n<ul>\n <li>Bachelor’s or higher degrees in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related degree.</li>\n <li>10 years of direct work experience in the semiconductor industry with specific experience in back-end processing of wafers.&nbsp; Including experience with operations such as wafer thinning, Al/Ti/NiV/Ag backside metallization stacks, and managing stress and thermal effects on thinned wafers.</li>\n</ul>\n<p><strong>Skills:</strong></p>\n<ul>\n <li>Strong understanding of semiconductor device physics and back-end wafer processes.&nbsp;</li>\n <li>Proficient in SPC, DOE, and data analysis tools.&nbsp;</li>\n <li>Demonstrated success in yield, throughput, and cost improvement initiatives.</li>\n <li>Proficient with structured problem-solving tools and how to apply them to lead improvement actions that result in positive technology and business outcomes.</li>\n <li>Familiarity with standard metrology, inspection, and failure analysis techniques.</li>\n <li>Ability to own, lead, and drive product development and technology improvement.</li>\n <li>Self-motivated, detail-oriented, and results-driven.</li>\n <li>Strong communication skills, both written and verbal, and a collaborative mindset.</li>\n <li>Ability to work effectively in a team and provide hands-on support and mentorship to other Engineering and Operations staff.</li>\n</ul>\n<p><i><strong><u>Salary:</u></strong></i><span>&nbsp;onsemi is excited to share the base salary range for this position is</span><strong>&nbsp;</strong><span>$127.800 to $217,200 exclusive of fringe benefits or potential bonuses.</span><strong>&nbsp;</strong><span>The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.&nbsp;</span><a href=\"https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf\" target=\"_blank\" rel=\"nofollow\">https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf</a></p>",
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    "ExternalResponsibilitiesStr": "<p><strong>Responsibilities:</strong></p>\n<ul>\n <li>Owns the process roadmap and module technology direction in EFK’s BGBM Post Fab.</li>\n <li>Sets process standards across tools and areas of our line as go-to expert with site-level authority to improve our manufacturability of our MOSFET and IGBT technologies in our Post Fab back-grind, back-metallization line.&nbsp;</li>\n <li>Owner of control plans, PFMEA and risk mitigation plans for thin wafers to enable robust high-volume manufacturing. &nbsp; Includes leading the scaling from development to high volume manufacturing to global replication.</li>\n <li>Evaluate and qualify new materials, processes, and equipment for our Post Fab back-end wafer operations.</li>\n <li>Troubleshoot process issues and implement corrective actions to improve yield and device performance.</li>\n <li>As Tool Owner lead tool matching and variation reduction; own process windows across multiple platforms, and interface directly with suppliers on tool roadmaps.</li>\n <li>Self-manage technical projects and provide technical team leadership to other Engineers in the organization.</li>\n <li>Communicate clear project plans and results to senior management.</li>\n <li>Collaborate with cross-functional teams including R&amp;D, Quality, and Manufacturing to support new product introductions.</li>\n <li>Raise overall backend technical capability and influence engineering culture through the mentorship of multiple engineers in organization.</li>\n <li>Analyze process data and apply statistical methods to drive continuous improvement.</li>\n <li>Ensure compliance with safety and quality standards.</li>\n</ul>",
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