Semiconductor SEM / Failure Analysis/ Engineer

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  "Title": "Semiconductor SEM / Failure Analysis/ Engineer",
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  "PostedDate": "2025-02-17T14:24:27.415Z",
  "JobCategoryName": "Miscellaneous",
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  "BriefDescription": "The position will primarily focus SEM inspections and failure analysis (FA) of wafers and samples in support of Micross AIT’s bumping and 3D heterogeneous integration wafer processes.  This may include SEM imaging, EDS analysis, lithographically patterned feature measurements, and/or x-section sample prep and imaging of samples with thin films (metal and/or dielectric), electroplated bumps, through-Si or through glass vias (TSV or TGV), copper redistribution layers (Cu RDL), and patterned photoresist.",
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  "RequisitionNumber": "SEMIC001042"
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