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HomeCompaniesHctz Fa Us2 Oraclecloud Com Cx 1001SiC Wafer and Package Technology Development Engineer

SiC Wafer and Package Technology Development Engineer

Hctz Fa Us2 Oraclecloud Com Cx 1001 · Scottsdale, AZ, United States; USAZ01 151 ON HDQTRS US8, Scottsdale, AZ, US; USID26 ISS, Nampa, ID, US · Active · Oracle Recruiting Cloud / Fusion HCM

Job facts

FieldValue
CompanyHctz Fa Us2 Oraclecloud Com Cx 1001
TitleSiC Wafer and Package Technology Development Engineer
Normalized title-
Department / teamEngineering
LocationScottsdale, AZ, United States
Work model-
Employment typeFull Time
Salary-
Statusactive
ATS providerOracle Recruiting Cloud / Fusion HCM
Posted / first seen2026-06-03 / 2026-06-04
Changed / last seen2026-06-04 / 2026-06-06

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City jobsActive postings in Scottsdale.Open
Department jobsActive postings in Engineering.Open
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Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyHctz Fa Us2 Oraclecloud Com Cx 1001
Source785c81aa-1b1b-46b0-bafd-ca226d542e7a
ATS providerOracle Recruiting Cloud / Fusion HCM

Description

Description Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi. Responsibilities Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams Understand detailed customer requirements and verify latest technologies meet or exceed all expectations Document findings and process flows to create baseline for new technology platforms Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis. Qualifications Strong communication skills Ability to lead development projects and implement strategies on a global basis Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding Knowledge of materials and material interactions Organization We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [email protected] for assistance. Company onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

Full job record

Job ID6d356bd8eb629436bd9f28d9df5cab531234baf1
Org ID10c648c2-de4b-4b9b-9767-fb19e9d49cc9
Source ID785c81aa-1b1b-46b0-bafd-ca226d542e7a
Board ID785c81aa-1b1b-46b0-bafd-ca226d542e7a
Provideroracle_hcm
Provider Job Key2505611
TitleSiC Wafer and Package Technology Development Engineer
Normalized Title
Statusactive
Activeyes
Location TextScottsdale, AZ, United States; USAZ01 151 ON HDQTRS US8, Scottsdale, AZ, US; USID26 ISS, Nampa, ID, US
DepartmentEngineering
Team
Employment Typefull_time
Workplace Type
Remote Policy
CountryUnited States
RegionAZ
CityScottsdale
Salary RawDescription Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi. Responsibilities Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams Understand detailed customer requirements and verify latest technologies meet or exceed all expectations Document findings and process flows to create baseline for new technology platforms Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis. Qualifications Strong communication skills Ability to lead development projects and implement strategies on a global basis Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding Knowledge of materials and material interactions Organization We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [email protected] for assistance. Company onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits
Salary Min
Salary Max
Salary Currency
Salary Periodmonth
Source URLhttps://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/cx_1001/job/2505611
Apply URLhttps://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/cx_1001/job/2505611
First Seen At2026-06-04 10:50:24Z
Last Seen At2026-06-06 11:27:55Z
Last Checked At2026-06-06 11:27:55Z
Last Changed At2026-06-04 10:50:24Z
Inactive At
Source Posted At2026-06-03 15:14:47Z
Source Updated At
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