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Materials Scientist II
D-Wave Quantum Inc. · Hybrid (Burnaby, British Columbia, CA), Burnaby, BC, Canada · Hybrid · Active · Rippling ATS
Job facts
| Field | Value |
|---|---|
| Company | D-Wave Quantum Inc. |
| Title | Materials Scientist II |
| Normalized title | - |
| Department / team | Processor Development |
| Location | Burnaby, BC, Canada |
| Work model | Hybrid / Hybrid |
| Employment type | Full Time |
| Salary | - |
| Status | active |
| ATS provider | Rippling ATS |
| Posted / first seen | 2026-04-17 / 2026-05-29 |
| Changed / last seen | 2026-06-06 / 2026-06-06 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from D-Wave Quantum Inc.. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through Rippling ATS. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in Burnaby. | Open |
| Department jobs | Active postings in Processor Development. | Open |
| Work model jobs | Active Hybrid postings. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | D-Wave Quantum Inc. |
| Source | daca1064-4942-49f3-be33-fae6f6581a21 |
| ATS provider | Rippling ATS |
Description
company
D-Wave (NYSE: QBTS) , D-Wave is a leader in the development and delivery of quantum computing systems, software, and services. We are the world’s first commercial supplier of quantum computers, and the only company building both annealing and gate-model quantum computers. Our mission is to help customers realize the value of quantum, today. Our quantum computers — the world’s largest — feature QPUs with sub-second response times and can be deployed on-premises or accessed through our quantum cloud service, which offers 99.9% availability and uptime. More than 100 organizations trust D-Wave with their toughest computational challenges. With over 200 million problems submitted to our quantum systems to date, our customers apply our technology to address use cases spanning optimization, artificial intelligence, research and more. Learn more about realizing the value of quantum computing today and how we’re shaping the quantum-driven industrial and societal advancements of tomorrow: www.dwavequantum.com .
You can read more about our company and our innovations in the pages of The Wall Street Journal, Time Magazine, Fast Company, MIT Technology Review, Forbes, Inc. Magazine, Wired and across many whitepapers.
At D-Wave, we’re helping customers realize the value of quantum computing today and are shaping the quantum-driven industrial and societal advancements of tomorrow.
role
About the role
D-Wave is seeking a creative, energetic, and self-motivated Materials Scientist to join our Processor Development (PD) team. The PD team is composed of experienced and talented superconducting designers, fabrication engineers, software developers and scientists who work together to create the processors at the heart of our quantum computer and are constantly pushing the boundaries of the technology of the future.
In this challenging and exciting position, you will work with a multi-disciplinary team and regularly communicate and collaborate with other processor development scientists, device designers, engineers, cryogenic experts and applications developers. You will perform failure analysis of superconducting chips made in CMOS fabrication facilities, characterize materials using advanced characterization techniques and cross-functionally support technical teams with materials-related issues such as chip packaging. Your work will support the development of new materials and fabrication stacks for superconducting quantum computing.
What you'll do
Failure Analysis of superconducting chips made in CMOS fabrication facilities using transmission electron microscopy (TEM) and focused ion beam scanning electron microscopy (FIB-SEM) Determine the best analysis technique to answer specific questions during failure analysis and materials development, including techniques like Raman, IR, XPS, EDS, EELS, XRD, AES, AFM, and others Analyze/interpret data generated by materials characterization methods, using standard materials science knowledge of fields like crystallography, atomic-level material structure, materials defects, and imaging artifacts Collaborate with device physicists and fabrication engineers to understand fabrication and material defects and how they affect circuit behavior, including designing and carrying out experiments Regularly and clearly document experimental results for the broader processor development team Conduct analysis of new materials systems, Design of Experiment output materials, and new fabrication stacks. Use literature and modeling to inform and guide development of new materials Coordinate and organize of packaging sample preparation and tracking, and troubleshoot packaging and materials-related issues as they arise Communicate and collaborate with other internal teams at D-Wave including marketing, intellectual property, applications development and engineering About You
Ph.D. or M.Sc. in materials science, chemistry, physics or a related science or engineering discipline, Strong hands-on experience with FIB-SEM and energy-dispersive Xray spectroscopy (EDS) Strong critical thinking and technical problem-solving skills Skill in independent research and evidence of deep understanding in materials science An ability to come up to speed in new technical topics quickly and effectively Some experience using software to model or fit data A collaborative mindset and a demonstrated ability to work effectively on an interdisciplinary team, on a wide variety of problems Excellent communication and organizational skills, including experience with summarizing experimental results for a broad audience Ability to adapt to shifting priorities in a time-sensitive environment Bonus points for
Background in TEM, XRD, XPS, FTIR Experience in failure analysis of microelectronics Experience with noise models and characterization A D-Waver's DNA
We look at the future and say “why not”; we see possibilities where others see problems or routines. We show the way ahead and are committed to achieving ambitious goals. We practice straight talk and listen generously to each other with empathy. We value different opinions and points of views. We ensure that we connect outside as well as inside to learn from others and inspire each other. We hold ourselves accountable for delivering results. We make decisions & take responsibility so that we can act & support each other. As leaders we motivate & engage our teams to undertake beyond what they originally thought possible, by developing our teams & creating the conditions for people to grow and empower themselves through enabling & coaching. Our Compensation Philosophy is Simple but Powerful:
We believe providing D-Wavers with company ownership, competitive pay, and a range of meaningful benefits is the start of creating a culture where people want to give the best they’ve got — not because they’re simply making money, but because they’ve fallen in love with our vision, mission, values, and team.
During the interview process, your Recruiter will review our total rewards (base, equity, bonus, perks, benefit, culture) offerings. The final offer is determined by your proficiencies within this level.
Inclusion:
We celebrate diverse perspectives to drive innovation in our pursuit. Our employees range from distinguished domain experts with decades of experience in their respective fields, to bright and motivated graduates eager to make their mark. Our diverse and innovative team will make you feel appreciated, supported and empower your career growth at D-Wave.
The Fine Print:
No 3rd party candidates will be accepted
It is D-Wave Systems Inc. policy to provide equal employment opportunity (EEO) to all persons regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, genetic information, physical or mental disability, protected veteran status, or any other characteristic protected by federal, state/provincial, local law.
The base pay range for this role is:
82,909 - 124,364 CAD per year (Burnaby)
Full job record
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| Org ID | a6171bd5-3b6b-46ca-a46b-60005a2b9e0f |
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| Provider Job Key | 60465fd9-f129-482a-9ed1-68be57b066ee |
| Title | Materials Scientist II |
| Normalized Title | — |
| Status | active |
| Active | yes |
| Location Text | Hybrid (Burnaby, British Columbia, CA), Burnaby, BC, Canada |
| Department | Processor Development |
| Team | — |
| Employment Type | full_time |
| Workplace Type | hybrid |
| Remote Policy | hybrid |
| Country | Canada |
| Region | BC |
| City | Burnaby |
| Salary Raw | — |
| Salary Min | — |
| Salary Max | — |
| Salary Currency | — |
| Salary Period | — |
| Source URL | https://ats.rippling.com/d-wave-quantum/jobs/60465fd9-f129-482a-9ed1-68be57b066ee |
| Apply URL | https://ats.rippling.com/d-wave-quantum/jobs/60465fd9-f129-482a-9ed1-68be57b066ee |
| First Seen At | 2026-05-29 07:17:30Z |
| Last Seen At | 2026-06-06 08:45:13Z |
| Last Checked At | 2026-06-06 08:45:13Z |
| Last Changed At | 2026-06-06 08:45:13Z |
| Inactive At | — |
| Source Posted At | 2026-04-17 19:37:13Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=rippling/board=d-wave-quantum/date=2026-06-06/2026-06-06T08-45-10-745Z-645d34830dd17136c4255dadb0f9b779c6f25884c617f4b8faf54f9b80bf233b.json |
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"role": "<meta><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11.25pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:15pt;white-space:pre-wrap;\">About the role</strong></b></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">D-Wave is seeking a creative, energetic, and self-motivated Materials Scientist to join our Processor Development (PD) team. The PD team is composed of experienced and talented superconducting designers, fabrication engineers, software developers and scientists who work together to create the processors at the heart of our quantum computer and are constantly pushing the boundaries of the technology of the future. </span></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><br></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">In this challenging and exciting position, you will work with a multi-disciplinary team and regularly communicate and collaborate with other processor development scientists, device designers, engineers, cryogenic experts and applications developers. You will perform failure analysis of superconducting chips made in CMOS fabrication facilities, characterize materials using advanced characterization techniques and cross-functionally support technical teams with materials-related issues such as chip packaging. Your work will support the development of new materials and fabrication stacks for superconducting quantum computing. </span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;text-align:left;\"><br></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11.25pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:15pt;white-space:pre-wrap;\">What you'll do</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Failure Analysis of superconducting chips made in CMOS fabrication facilities using</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">transmission electron microscopy (TEM) and focused ion beam scanning electron microscopy</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">(FIB-SEM)</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Determine</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">the best analysis technique to answer specific</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">questions during</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">failure analysis and</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">materials development, including</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">techniques like</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">Raman,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">IR,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">XPS,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">EDS, EELS, XRD, AES,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">AFM,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and others</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Analyze/interpret data generated by materials characterization methods, using</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">standard materials science</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">knowledge of</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">fields like</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">crystallography, atomic-level material</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">structure,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">materials</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">defects,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">imaging artifacts</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Collaborate with device physicists and fabrication engineers to understand fabrication and material defects and how they affect circuit behavior, including designing and carrying out experiments</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Regularly and clearly document experimental results for the broader processor development team</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Conduct analysis of new materials systems, Design of Experiment output materials, and new fabrication stacks.</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">Use</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">literature and modeling to inform and guide development of new materials</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Coordinate</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">organize</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">of</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">packaging</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">sample preparation</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">tracking,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">troubleshoot</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">packaging and materials-related issues</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">as they arise</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Communicate</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and collaborate with other internal teams at D-Wave including marketing, intellectual property, applications</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">development</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">and engineering</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li></ul><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11.25pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:15pt;white-space:pre-wrap;\">About You</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Ph.D. or M.Sc. in</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">materials science, chemistry,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">physics or a related</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">science or engineering</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span><span style=\"font-size:11pt;white-space:pre-wrap;\">discipline,</span><span style=\"font-size:11pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 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Our employees range from distinguished domain experts with decades of experience in their respective fields, to bright and motivated graduates eager to make their mark. 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"url": "https://ats.rippling.com/api/v2/board/d-wave-quantum/jobs/60465fd9-f129-482a-9ed1-68be57b066ee",
"http_status": 200,
"content_type": "application/json",
"response_bytes": 35531
},
"detail_errors": []
}Get this page with API
Rendered from the bluedoor Job Postings API. Reproduce it:
GET https://api.bluedoor.sh/job-postings/v1/jobs/6352683df6afe68f775cf705e9ab9cb0b3c82903?include=descriptionJSONGET https://api.bluedoor.sh/job-postings/v1/orgs/a6171bd5-3b6b-46ca-a46b-60005a2b9e0fJSONGET https://api.bluedoor.sh/job-postings/v1/sources/daca1064-4942-49f3-be33-fae6f6581a21JSONGET https://api.bluedoor.sh/job-postings/v1/jobs/6352683df6afe68f775cf705e9ab9cb0b3c82903/eventsJSON