Home › Companies › Lyte AI › Packaging and Assembly lead
Packaging and Assembly lead
Lyte AI · Sunnyvale, CA, United States · On Site · Active · $100,000–$200,000 / year · Rippling ATS
Job facts
| Field | Value |
|---|---|
| Company | Lyte AI |
| Title | Packaging and Assembly lead |
| Normalized title | - |
| Department / team | Operations |
| Location | Sunnyvale, CA, United States |
| Work model | On Site |
| Employment type | Full Time |
| Salary | $100,000–$200,000 / year |
| Status | active |
| ATS provider | Rippling ATS |
| Posted / first seen | 2026-01-04 / 2026-05-29 |
| Changed / last seen | 2026-06-06 / 2026-06-06 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from Lyte AI. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through Rippling ATS. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in Sunnyvale. | Open |
| Department jobs | Active postings in Operations. | Open |
| Work model jobs | Active On Site postings. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | Lyte AI |
| Source | f4afde55-a55c-4387-8736-a15d6734cb06 |
| ATS provider | Rippling ATS |
Description
company
About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
role
About the role
We are seeking an experienced process lead/Manager in the field of optical sensor device packaging and contract manufacture with a degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics or a related field. Describe the role and team the candidate will be joining What you'll do
Lead NPI process team involving wafer, device packaging, PCBA assembly process improvement and optimization for yield improvement through material selection optimization, process refinement, or specs opening through DOE for corner case studies. Communicate with the RnD team to understand the design targets, existing specs, and existing process flow, process maturity, and its related yield for each process step. Lead the tradeoff between the design and process. Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture. Lead process integration check to ensure the upstream process will not affect the downstream process yield. Act as the technical program manager for operation process team. Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase. Develop and maintain packaging and component specifications as well as inventory tracking. Audit/regularly visit our contract Manufacturers and suppliers then provide reports. Write technical reports and present results to internal and external stakeholders. Build and grow the Operation Process Team worldwide. Write technical SOW. Drive Cp, Cpk, and yield improvement. Required Qualifications
Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience. Experience with process integration for process flow design and continue process improvement. Former experience of microelectronic and optical devices packaging is a must. Project management capability/experience is a must. Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important. Experience with FMEA, failure analysis, and 8D report. Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must. Fast learner is a must. Good work ethics is a must Capable of keeping company confidential information and IP is a must. Preferred Qualifications
Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable. Familiar with data analysis software such as JMPs is a plus. Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus. Experience with PCBA process is highly desirable. Understanding Silicon Photonics is a plus. Experience in IIIV wafer process, bar level process, and CoC packaging is a plus. Supplier quality management experience is a plus. Knowledge of Lidar and relevant technologies is a plus. Former experience of writing technical SoW is a plus. Familiar with ECN, PCN and documentation are highly desirable. Benefits
Competitive salary and equity Comprehensive medical, dental, and vision coverage 401(k) retirement plan Flexible vacation and time-off policy Collaborative, fast-paced, and inclusive work environment Opportunity to work on cutting-edge technologies with a highly cross-functional team
Full job record
| Job ID | 6040ca67d7a99ee3da13d13c05f77ffd5e8c0a7b |
| Org ID | 3c5bf59d-998c-4877-a152-62bdeba1ec4a |
| Source ID | f4afde55-a55c-4387-8736-a15d6734cb06 |
| Board ID | f4afde55-a55c-4387-8736-a15d6734cb06 |
| Provider | rippling |
| Provider Job Key | 29ad1382-434b-489f-a0a1-29ea9e92ae35 |
| Title | Packaging and Assembly lead |
| Normalized Title | — |
| Status | active |
| Active | yes |
| Location Text | Sunnyvale, CA, United States |
| Department | Operations |
| Team | — |
| Employment Type | full_time |
| Workplace Type | on_site |
| Remote Policy | — |
| Country | United States |
| Region | CA |
| City | Sunnyvale |
| Salary Raw | USD 100000-200000 YEAR |
| Salary Min | 100,000 |
| Salary Max | 200,000 |
| Salary Currency | USD |
| Salary Period | year |
| Source URL | https://ats.rippling.com/lyte/jobs/29ad1382-434b-489f-a0a1-29ea9e92ae35 |
| Apply URL | https://ats.rippling.com/lyte/jobs/29ad1382-434b-489f-a0a1-29ea9e92ae35 |
| First Seen At | 2026-05-29 07:16:45Z |
| Last Seen At | 2026-06-06 08:47:06Z |
| Last Checked At | 2026-06-06 08:47:06Z |
| Last Changed At | 2026-06-06 08:47:06Z |
| Inactive At | — |
| Source Posted At | 2026-01-04 00:50:12Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=rippling/board=lyte/date=2026-06-06/2026-06-06T08-47-04-305Z-aa42d0b01651f1dcaf7eacf14e444fb6b6112aea26f954b521d00a5d2a81ac5d.json |
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targets, existing specs, and existing process flow, process maturity, and its related yield for each process step.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Lead the tradeoff between the design and process.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Lead process integration check to ensure the upstream process will not affect the downstream process yield.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Act as the technical program manager for operation process team.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Develop and maintain packaging and component specifications as well as inventory tracking.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Audit/regularly visit our contract Manufacturers and suppliers then provide reports.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Write technical reports and present results to internal and external stakeholders.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Build and grow the Operation Process Team worldwide.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Write technical SOW.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Drive Cp, Cpk, and yield improvement.</span></li></ul><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:18pt;white-space:pre-wrap;\">Required Qualifications</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience with process integration for process flow design and continue process improvement.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Former experience of microelectronic and optical devices packaging is a must.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Project management capability/experience is a must.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience with FMEA, failure analysis, and 8D report.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Fast learner is a must.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Good work ethics is a must</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Capable of keeping company confidential information and IP is a must.</span></li></ul><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:18pt;white-space:pre-wrap;\">Preferred Qualifications</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable. </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Familiar with data analysis software such as JMPs is a plus.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus. </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience with PCBA process is highly desirable.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Understanding Silicon Photonics is a plus.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience in IIIV wafer process, bar level process, and CoC packaging is a plus. </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Supplier quality management experience is a plus.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Knowledge of Lidar and relevant technologies is a plus.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Former experience of writing technical SoW is a plus.</span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Familiar with ECN, PCN and documentation are highly desirable.</span></li></ul><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;text-align:left;\"><b><strong style=\"font-size:18pt;white-space:pre-wrap;\">Benefits</strong></b></p><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:left;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Competitive salary and equity </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:left;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Comprehensive medical, dental, and vision coverage </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:left;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">401(k) retirement plan </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:left;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Flexible vacation and time-off policy </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:left;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Collaborative, fast-paced, and inclusive work environment </span></li><li style=\"font-size:12pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:left;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Opportunity to work on cutting-edge technologies with a highly cross-functional team </span></li></ul>",
"company": "<meta><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><b><strong style=\"font-size:18pt;white-space:pre-wrap;\">About Lyte</strong></b></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:12pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit </span><a href=\"http://www.lyte.ai\" target=\"_blank\" class=\"css-173makr-linkStyle\" style=\"color:rgb(30,74,169);cursor:pointer;\"><span style=\"font-size:12pt;white-space:pre-wrap;\">www.lyte.ai</span></a></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:12pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><br></p><p style=\"font-family:"Basel Grotesk",Arial,sans-serif;font-size:12pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;text-align:center;\"><b><strong style=\"font-size:13pt;white-space:pre-wrap;\">If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!</strong></b></p>"
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}Get this page with API
Rendered from the bluedoor Job Postings API. Reproduce it:
GET https://api.bluedoor.sh/job-postings/v1/jobs/6040ca67d7a99ee3da13d13c05f77ffd5e8c0a7b?include=descriptionJSONGET https://api.bluedoor.sh/job-postings/v1/orgs/3c5bf59d-998c-4877-a152-62bdeba1ec4aJSONGET https://api.bluedoor.sh/job-postings/v1/sources/f4afde55-a55c-4387-8736-a15d6734cb06JSONGET https://api.bluedoor.sh/job-postings/v1/jobs/6040ca67d7a99ee3da13d13c05f77ffd5e8c0a7b/eventsJSON