Board Thermal Simulation Engineer

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{
  "lists": [
    {
      "text": "Key Responsibilities:",
      "content": "<ul style=\"margin-top: 0in; margin-bottom: 3.0pt;\">\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Perform component-level thermal analysis including junction temperature calculation, hot-spot identification, and heat-path evaluation.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Develop thermal models using analytical methods and simulation tools for steady-state and transient conditions.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Evaluate and recommend cooling strategies (conduction, convection, radiation, heat spreading) for avionics boards.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Assess temperature effects on component aging, reliability, and derating requirements.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Analyze thermomechanical degradation risks including CTE mismatch, solder fatigue, and connector stress.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Perform system-level thermal budgeting and define thermal interface requirements across subsystems.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Evaluate environmental thermal loads from orbit-induced temperature swings and operational heat dissipation.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Select materials based on thermal conductivity, expansion properties, and long-term reliability.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Validate thermal models with empirical measurements and test data from EM and QM builds.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Collaborate with electrical, mechanical, and reliability engineers for integrated thermal solutions.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Document thermal requirements, design guidelines, and analysis results.</li>\n</ul>"
    },
    {
      "text": "Required Qualifications:",
      "content": "\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Bachelor’s or Master’s degree in Mechanical Engineering, Aerospace Engineering, or related field.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">3+ years of experience in thermal analysis for electronics, preferably in aerospace or space applications.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Proficiency with thermal simulation tools (Ansys IcePak, FloTHERM, or equivalent).</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Strong understanding of heat transfer fundamentals (conduction, convection, radiation).</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Experience with component derating for thermal environments.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Ability to create and validate thermal models against test data.</li>\n"
    },
    {
      "text": "Preferred Qualifications:",
      "content": "<ul style=\"margin-top: 0in; margin-bottom: 3.0pt;\">\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Experience with satellite or spacecraft thermal analysis and orbital thermal environments.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Background in thermal cycling test planning and correlation of simulation to test results.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Familiarity with Ansys IcePak specifically.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Experience with system-level thermal budgets and interface management.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Knowledge of PCB material properties and their thermal behavior.</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Understanding of reliability implications of thermal stress on electronics.</li>\n</ul>"
    },
    {
      "text": "Tools & Technologies: ",
      "content": "<ul style=\"margin-top: 0in; margin-bottom: 3.0pt;\">\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">Ansys IcePak (or equivalent thermal simulation tool)</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">MATLAB or Python for analytical modeling</li>\n<li style=\"margin: 0in 0in 3pt 0px; font-size: 11pt; font-family: Arial, sans-serif;\">CAD tools for geometry import and model setup</li>\n</ul>"
    }
  ],
  "country": "US",
  "createdAt": 1775164928614,
  "updatedAt": null,
  "categories": {
    "team": "Engineering & Operations",
    "location": "Saratoga, CA",
    "commitment": "Full-Time",
    "department": "E-Space US",
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