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Senior Process Engineer

B1D0AE68AD38E442432CFA0419D13913 · PHOENIX, AZ 85021; 9601 N Black Canyon Hwy, PHOENIX, AZ, 85021, USA · Deleted · Paycom ATS

Job facts

FieldValue
CompanyB1D0AE68AD38E442432CFA0419D13913
TitleSenior Process Engineer
Normalized title-
Department / teamManufacturing
LocationPHOENIX, AZ, United States
Work model-
Employment typeFull Time
Salary-
Statusdeleted
ATS providerPaycom ATS
Posted / first seen2026-03-26 / 2026-05-31
Changed / last seen2026-06-03 / 2026-06-01

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Linked records

CompanyB1D0AE68AD38E442432CFA0419D13913
Source8b555684-0b87-4a89-b43c-de8893daa417
ATS providerPaycom ATS

Description

Description Position Summary The Senior Process Engineer will facilitate manufacturing jobs requiring Engineering support in an AS9100-certified PCB assembly environment. This role provides hands-on technical ownership for SMT programming adjustments, screen print process support, traveler/labor plan updates, and X-Ray/AOI processing. The successful candidate applies strong process control discipline to maximize quality and throughput, and supports manufacturing decision-making through data-driven equipment and process adjustments, documentation, and verification & validation (V&V) of changes. The Senior Process Engineer is a hands-on technical leader responsible for designing, implementing, and optimizing PCBA manufacturing processes to improve efficiency, quality, safety, and repeatability. This role is especially focused on maximizing the capability of PCBA assets such as Yamaha SMT equipment, DEK and AVI screen printers, SPI assets, selective soldering and related process tools while driving defect reduction and building stronger technical capability across the team. Key Responsibilities Develop and refine SMT and PCB assembly processes to improve efficiency, reduce cost, and enhance product quality. Utilize the maximum practical capability of Yamaha SMT machines, DEK and AVI screen printers, SPI equipment, reflow ovens, and related internal assets. Optimize solder paste printing, board support, alignment, placement accuracy, reflow profiles, SPI feedback, and inspection effectiveness. Lead defect reduction, yield improvement, and process-capability initiatives using data analysis, SPC, DOE, Lean Manufacturing, Six Sigma, and root-cause methods. Lead process-improvement projects from concept through implementation, including validation, documentation updates, and production readiness. Analyze process data to identify trends, troubleshoot issues, and recommend solutions that improve first-pass yield and reduce rework. Collaborate closely with production, quality, test, maintenance, and engineering teams to integrate new processes and support stable execution from NPI through production. Prepare and maintain process specifications, work instructions, labor plans, profiles, and controlled engineering changes. Provide training, mentorship, and guidance to junior engineers and production staff on process best practices, defect prevention, safety, and disciplined execution; support annual evaluation of junior engineers as needed. Qualifications Required Qualifications Bachelor’s degree in Engineering or related technical field; equivalent relevant PCBA process-engineering experience may be considered; Master’s degree preferred. 15+ years of SMT, PCB assembly, or electronics manufacturing process-engineering experience in a high-accountability environment. Strong hands-on knowledge of stencil printing, SPI, Yamaha SMT equipment, reflow profiling, AOI/X-ray interfaces, tooling, and process troubleshooting. Demonstrated success reducing production defects, improving yield, and mentoring technical and production personnel. Strong communication, project-management, and documentation skills in a controlled manufacturing environment. Preferred Qualifications 15+ years combined experience in AS9100 and other high-reliability electronics manufacturing environments. Working knowledge of IPC-A-610, J-STD-001, RCCA/8D, FMEA, and controlled change practices. Physical Requirements Ability to sit or stand for extended periods and move throughout the manufacturing floor as needed. Must occasionally lift and/or move items up to 35 pounds. Ability to support rotating on-call activity during 2 nd shift and weekend.

Full job record

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Org IDa3dbc8c8-8a66-45c0-8f3b-675423ced95d
Source ID8b555684-0b87-4a89-b43c-de8893daa417
Board ID8b555684-0b87-4a89-b43c-de8893daa417
Providerpaycom
Provider Job Key29070
TitleSenior Process Engineer
Normalized Title
Statusdeleted
Activeno
Location TextPHOENIX, AZ 85021; 9601 N Black Canyon Hwy, PHOENIX, AZ, 85021, USA
DepartmentManufacturing
Team
Employment Typefull_time
Workplace Type
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CountryUnited States
RegionAZ
CityPHOENIX
Salary RawDescription Position Summary The Senior Process Engineer will facilitate manufacturing jobs requiring Engineering support in an AS9100-certified PCB assembly environment. This role provides hands-on technical ownership for SMT programming adjustments, screen print process support, traveler/labor plan updates, and X-Ray/AOI processing. The successful candidate applies strong process control discipline to maximize quality and throughput, and supports manufacturing decision-making through data-driven equipment and process adjustments, documentation, and verification & validation (V&V) of changes. The Senior Process Engineer is a hands-on technical leader responsible for designing, implementing, and optimizing PCBA manufacturing processes to improve efficiency, quality, safety, and repeatability. This role is especially focused on maximizing the capability of PCBA assets such as Yamaha SMT equipment, DEK and AVI screen printers, SPI assets, selective soldering and related process tools while driving defect reduction and building stronger technical capability across the team. Key Responsibilities Develop and refine SMT and PCB assembly processes to improve efficiency, reduce cost, and enhance product quality. Utilize the maximum practical capability of Yamaha SMT machines, DEK and AVI screen printers, SPI equipment, reflow ovens, and related internal assets. Optimize solder paste printing, board support, alignment, placement accuracy, reflow profiles, SPI feedback, and inspection effectiveness. Lead defect reduction, yield improvement, and process-capability initiatives using data analysis, SPC, DOE, Lean Manufacturing, Six Sigma, and root-cause methods. Lead process-improvement projects from concept through implementation, including validation, documentation updates, and production readiness. Analyze process data to identify trends, troubleshoot issues, and recommend solutions that improve first-pass yield and reduce rework. Collaborate closely with production, quality, test, maintenance, and engineering teams to integrate new processes and support stable execution from NPI through production. Prepare and maintain process specifications, work instructions, labor plans, profiles, and controlled engineering changes. Provide training, mentorship, and guidance to junior engineers and production staff on process best practices, defect prevention, safety, and disciplined execution; support annual evaluation of junior engineers as needed. Qualifications Required Qualifications Bachelor’s degree in Engineering or related technical field; equivalent relevant PCBA process-engineering experience may be considered; Master’s degree preferred. 15+ years of SMT, PCB assembly, or electronics manufacturing process-engineering experience in a high-accountability environment. Strong hands-on knowledge of stencil printing, SPI, Yamaha SMT equipment, reflow profiling, AOI/X-ray interfaces, tooling, and process troubleshooting. Demonstrated success reducing production defects, improving yield, and mentoring technical and production personnel. Strong communication, project-management, and documentation skills in a controlled manufacturing environment. Preferred Qualifications 15+ years combined experience in AS9100 and other high-reliability electronics manufacturing environments. Working knowledge of IPC-A-610, J-STD-001, RCCA/8D, FMEA, and controlled change practices. Physical Requirements Ability to sit or stand for extended periods and move throughout the manufacturing floor as needed. Must occasionally lift and/or move items up to 35 pounds. Ability to support rotating on-call activity during 2 nd shift and weekend.
Salary Min
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Source URLhttps://www.paycomonline.net/v4/ats/web.php/jobs/ViewJobDetails?job=29070&clientkey=B1D0AE68AD38E442432CFA0419D13913
Apply URLhttps://www.paycomonline.net/v4/ats/web.php/jobs/ViewJobDetails?job=29070&clientkey=B1D0AE68AD38E442432CFA0419D13913
First Seen At2026-05-31 19:06:14Z
Last Seen At2026-06-01 10:08:46Z
Last Checked At2026-06-03 10:07:37Z
Last Changed At2026-06-03 10:07:37Z
Inactive At2026-06-03 10:07:37Z
Source Posted At2026-03-26 00:00:00Z
Source Updated At
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Rendered from the bluedoor Job Postings API. Reproduce it:

GET https://api.bluedoor.sh/job-postings/v1/jobs/4f4940b51c385e45af55d529cdc0b192394fe201?include=descriptionJSON
GET https://api.bluedoor.sh/job-postings/v1/orgs/a3dbc8c8-8a66-45c0-8f3b-675423ced95dJSON
GET https://api.bluedoor.sh/job-postings/v1/sources/8b555684-0b87-4a89-b43c-de8893daa417JSON
GET https://api.bluedoor.sh/job-postings/v1/jobs/4f4940b51c385e45af55d529cdc0b192394fe201/eventsJSON