Sr. HW Engineer (System)

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    "url": "https://recruiting.paylocity.com/recruiting/jobs/Details/3559891/TELIT-IOT-SOLUTIONS-INC/Sr-HW-Engineer-System",
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    "description_html": "<p><strong>Job Summary</strong></p><p>HW Engineer reports within the hardware development function, contributing to the full product lifecycle of 5G and IoT modules—from schematics design to mass production. The role demands expertise in LGA pad and M.2 type layout, high-speed interface design, and PDN simulation, supporting projects for major telecom under strict quality and schedule constraints. Collaboration with partner companies and cross-functional teams is essential, offering growth opportunities in system integration and next-generation wireless technologies.</p><p><br></p><p><strong>Objectives &amp; Responsibilities</strong></p><ul><li>Design circuit layouts for 5G and IoT modules and provide technical support throughout the entire product lifecycle.</li><li>Optimize power integrity and layout performance through PDN (Power Delivery Network) simulations.</li><li>Develop hardware platforms including LGA pad and M.2 type layouts and high-speed interfaces such as USB, PCIe, and LPDDR.</li><li>Validate reliability through ESD, thermal, and humidity testing, and establish board-level test plans for mass production.</li><li>Analyze circuit failures and root causes during product development and propose improvement measures.</li><li>Collaborate closely with external partners and internal teams on global projects.</li><li>Document test scenarios and design specifications systematically to build technical assets.</li><li>Grow technical expertise and leadership through hands-on experience with platforms such as Qualcomm, NXP, and Realtek.</li></ul><p><br></p>",
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    "requirements_html": "<ul><li>BS in Electronic Engineering (or equivalent).</li><li>8+ years of hands-on experience in circuit design for 5G and IoT modules, covering the full product lifecycle from schematic to mass production.</li><li>Fluent in English, both verbal and written.</li><li>Proficiency in PDN (Power Delivery Network) simulation and power integrity optimization.</li><li>Skilled in high-speed interface design (USB, PCIe, LPDDR, Ethernet, etc.).</li><li>Experience with LGA pad and M.2 type layout.</li><li>Practical experience with Qualcomm chipsets and familiarity with NXP and Realtek ICs.</li><li>Proven ability to conduct reliability testing (ESD, thermal, humidity), develop board-level test plans, and perform failure analysis for mass production readiness</li></ul><p><br></p><p><strong>Preferred Qualifications</strong></p><ul><li>Hands-on experience in minimizing electromagnetic interference (EMI) in high-speed interface and RF-integrated products is highly valuable for ensuring product reliability and certification readiness</li><li>Familiarity with multiple circuit design platforms enhances flexibility when collaborating with diverse clients or partners</li><li>Understanding and experience in handling international compliance and certification processes is a strong asset for global product deployment</li><li>Insight into mechanical constraints trade-offs is beneficial when designing compact modules with integrated RF components</li></ul>",
    "requirements_text": "BS in Electronic Engineering (or equivalent).\n 8+ years of hands-on experience in circuit design for 5G and IoT modules, covering the full product lifecycle from schematic to mass production.\n Fluent in English, both verbal and written.\n Proficiency in PDN (Power Delivery Network) simulation and power integrity optimization.\n Skilled in high-speed interface design (USB, PCIe, LPDDR, Ethernet, etc.).\n Experience with LGA pad and M.2 type layout.\n Practical experience with Qualcomm chipsets and familiarity with NXP and Realtek ICs.\n Proven ability to conduct reliability testing (ESD, thermal, humidity), develop board-level test plans, and perform failure analysis for mass production readiness\n Preferred Qualifications\n Hands-on experience in minimizing electromagnetic interference (EMI) in high-speed interface and RF-integrated products is highly valuable for ensuring product reliability and certification readiness\n Familiarity with multiple circuit design platforms enhances flexibility when collaborating with diverse clients or partners\n Understanding and experience in handling international compliance and certification processes is a strong asset for global product deployment\n Insight into mechanical constraints trade-offs is beneficial when designing compact modules with integrated RF components"
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