Home › Companies › Nexthopai › Thermal Engineer
Thermal Engineer
Nexthopai · Santa Clara, California, 95054, United States · Active · BambooHR
Job facts
| Field | Value |
|---|---|
| Company | Nexthopai |
| Title | Thermal Engineer |
| Normalized title | - |
| Department / team | - |
| Location | Santa Clara, United States |
| Work model | - |
| Employment type | Full Time |
| Salary | - |
| Status | active |
| ATS provider | BambooHR |
| Posted / first seen | 2025-05-14 / 2026-05-30 |
| Changed / last seen | 2026-05-30 / 2026-06-06 |
Related slices
| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from Nexthopai. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through BambooHR. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in Santa Clara. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | Nexthopai |
| Source | 399b7da1-e24c-4310-b0ba-91dbe0aa422d |
| ATS provider | BambooHR |
Description
Nexthop Systems Inc. is on the lookout for a passionate and innovative thermal engineer to spearhead the design and implementation of advanced thermal management systems. This role is critical in ensuring the efficient performance of high-power next-generation networking systems tailored for cutting-edge AI infrastructures.
What You’ll Do
Design and develop thermal solutions, including heatsinks, cold plates, liquid cooling loops, and other innovative cooling systems.
Lead and execute thermal modeling and simulations using industry-standard tools to optimize performance.
Conduct thorough thermal testing and validation to ensure designs meet rigorous operational requirements.
Collaborate closely with cross-functional teams to integrate thermal designs seamlessly into broader system architectures.
Build and manage strong technical relationships with suppliers, ensuring high-quality thermal solutions.
Proactively troubleshoot and resolve thermal challenges to maintain system reliability.
Stay ahead of the curve by keeping up with emerging technologies, trends, and industry standards in thermal engineering.
What You Bring Technical Expertise
A degree in Mechanical Engineering or a related field, with emphasis in heat transfer (B.S. required, M.S. preferred).
10+ years of experience in thermal design; 5+ years of experience designing thermal components and systems for data center network equipment, preferred.
Proficiency in thermal modeling tools such as Flotherm, Flotherm-XT, and/or IcePak.
Experience and deep working knowledge of data center air cooling technologies, practices, and strategies:
Vapor chambers, heat pipes, and other phase change devices
Various heat sink types and design parameters
High performance fans and their selection/operating parameters
Thermal interface materials and their selection/design parameters
Environmental requirements
Rack mounted ITE design constraints
Experience with designing liquid cooling components/loops desired, but not required.
Deep knowledge of heat transfer principles and their application in real-world scenarios.
Soft Skills
Strong problem-solving skills, with the ability to tackle complex thermal challenges.
Excellent collaboration and communication skills, to work effectively with diverse teams and suppliers.
A proactive mindset with a passion for staying current on advancements in thermal technologies and AI infrastructure needs.
Why Join Nexthop Systems?
At Nexthop, you’ll work at the forefront of innovation, designing thermal solutions that empower the AI systems driving tomorrow’s breakthroughs. Your contributions will directly impact how AI and networking systems perform, ensuring they meet the demands of a rapidly evolving industry.
**Are you ready to take the lead in thermal engineering for next-generation AI infrastructure?** Apply now and shape the future with us!
Full job record
| Job ID | 49bc2d12dfdb4b66f86184e5818a25bb0c26d2fa |
| Org ID | cc0f4ca2-d311-416e-877c-d8fba375b705 |
| Source ID | 399b7da1-e24c-4310-b0ba-91dbe0aa422d |
| Board ID | 399b7da1-e24c-4310-b0ba-91dbe0aa422d |
| Provider | bamboohr |
| Provider Job Key | 35 |
| Title | Thermal Engineer |
| Normalized Title | — |
| Status | active |
| Active | yes |
| Location Text | Santa Clara, California, 95054, United States |
| Department | — |
| Team | — |
| Employment Type | full_time |
| Workplace Type | — |
| Remote Policy | — |
| Country | United States |
| Region | — |
| City | Santa Clara |
| Salary Raw | — |
| Salary Min | — |
| Salary Max | — |
| Salary Currency | — |
| Salary Period | — |
| Source URL | https://nexthopai.bamboohr.com/careers/35 |
| Apply URL | https://nexthopai.bamboohr.com/careers/35 |
| First Seen At | 2026-05-30 05:46:09Z |
| Last Seen At | 2026-06-06 10:28:27Z |
| Last Checked At | 2026-06-06 10:28:27Z |
| Last Changed At | 2026-05-30 05:46:09Z |
| Inactive At | — |
| Source Posted At | 2025-05-14 00:00:00Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=bamboohr/board=nexthopai/date=2026-06-06/2026-06-06T10-28-24-903Z-29eef66850260931195060698118d9fc80bfe1c620d624675f1fe07814a7a577.json |
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"description": "<p><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Nexthop Systems Inc. is on the lookout for a passionate and innovative thermal engineer to spearhead the design and implementation of advanced thermal management systems. 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font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Collaborate closely with cross-functional teams to integrate thermal designs seamlessly into broader system architectures. </span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Build and manage strong technical relationships with suppliers, ensuring high-quality thermal solutions. </span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Proactively troubleshoot and resolve thermal challenges to maintain system reliability. </span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Stay ahead of the curve by keeping up with emerging technologies, trends, and industry standards in thermal engineering. </span></li>\n</ul>\n<p><br></p>\n<p><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 20pt; text-decoration: none;\">What You Bring</span> <span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 16pt; text-decoration: none;\">Technical Expertise</span></p>\n<ul>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">A degree in Mechanical Engineering or a related field, with emphasis in heat transfer (B.S. required, M.S. preferred). </span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">10+ years of experience in thermal design; 5+ years of experience designing thermal components and systems for data center network equipment, preferred. </span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Proficiency in thermal modeling tools such as Flotherm, Flotherm-XT, and/or IcePak.</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Experience and deep working knowledge of data center air cooling technologies, practices, and strategies: </span>\n<ul>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Vapor chambers, heat pipes, and other phase change devices</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Various heat sink types and design parameters</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">High performance fans and their selection/operating parameters</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Thermal interface materials and their selection/design parameters</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Environmental requirements</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Rack mounted ITE design constraints</span></li>\n</ul>\n</li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Experience with designing liquid cooling components/loops desired, but not required.</span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Deep knowledge of heat transfer principles and their application in real-world scenarios. </span></li>\n</ul>\n<p><br></p>\n<p><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 16pt; text-decoration: none;\">Soft Skills</span></p>\n<ul>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Strong problem-solving skills, with the ability to tackle complex thermal challenges. </span></li>\n<li><span style=\"color: #000000; font-family: Arial,sans-serif; font-size: 11pt; text-decoration: none;\">Excellent collaboration and communication skills, to work effectively with diverse teams and suppliers. </span></li>\n<li><span style=\"color: #000000; 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