Senior PCB Layout Engineer

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place! E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems. We’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life. The Senior PCB Layout Engineer is responsible for leading the physical implementation of complex, high-performance printed circuit boards from concept through production. This role requires deep expertise in multi-layer, high-speed, RF, and mixed-signal PCB layout, strong ownership of stackup and via architecture decisions, and direct engagement with PCB fabrication and assembly partners to ensure manufacturability, reliability, and cost efficiency. This is a full time, exempt position, based out of our Saratoga office.  The target base pay for this position is $150,000 - $200,000 annually.  The total compensation packaged will be determined by various factors such as your relevant job-related knowledge, skills, and experience. We are redefining how satellites are designed, manufactured and used—so we’re looking for candidates with passion, deep knowledge and direct experience on LEO satellite component development, design and in-orbit activities. If that’s your experience – then we’ll be immediately wow-ed. E-Space is not currently able to provide employment sponsorship for candidates who do not hold work authorization for the location of this role. Why E-Space is right for you: As a member of our team, you will play a crucial role in driving our success.  Our team members have a strong sense of dedication and responsibility; this includes a strong commitment to our mission to create an entirely new suite of global capabilities to improve lives, business efficiencies and build a smarter planet. This means that there will be times when extra hours, including nights and weekends, may be needed to meet critical deadlines and mission goals.  In return, we offer a dynamic work environment with opportunities for professional growth and development and the chance to make a meaningful impact in a high-growth industry. We want you to make the most of your journey at E-Space. That’s why we support and invest in the physical, emotional and financial well-being of our team members and their families. Some of what you can expect when working at E-Space: • An opportunity to really make a difference • Sustainability at our core • Fair and honest workplace • Innovative thinking is encouraged • Competitive salaries • Continuous learning and development • Health and wellness care options • Financial solutions for the future • Optional legal services (US only) • Paid holidays • Paid time off What you will do Technical Leadership · Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry · Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling) · Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability Advanced PCB Design & Layout · Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance · Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals · Design robust power distribution networks and grounding structures · Apply advanced shielding and isolation techniques for EMI/EMC control Fabrication & Assembly Interface · Lead DFM/DFA reviews with PCB fabrication and assembly partners · Resolve complex DFM issues related to: o HDI structures and sequential lamination o Via consolidation, backdrilling, and drill count reduction o Stackup optimization for yield and cost · Optimize designs for manufacturability, reliability, and volume production Cross-Functional Collaboration · Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle · Support board bring-up, debug, ECOs, and production transitions · Mentor and technically guide junior PCB layout engineers Documentation & Process Ownership · Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++) · Establish, maintain, and enforce PCB layout standards and best practices · Drive continuous improvement in layout quality, DFM compliance, and cost efficiency What you bring to this role 10+ years of hands-on PCB layout experience delivering complex designs from concept to production Expert-level proficiency in PCB layout tools such as Altium Designer, Cadence Allegro Deep understanding of: Controlled-impedance routing and signal integrity fundamentals Power integrity, grounding, and EMI/EMC best practices PCB materials, stackups, and fabrication processes HDI PCB design, advanced via structures, and manufacturing constraints Experience with: High-speed interfaces (PCIe, Ethernet, DDR, JESD, SERDES) RF and mixed-signal PCB layouts Aerospace, data center, or high-reliability hardware designs Bonus points for the following Bachelor’s degree in electrical engineering, Computer Engineering, or a related field (Master’s degree is a plus). Familiarity with advanced PCB fabrication technologies such as mSAP (Modified Semi-Additive Process) and SLP (Substrate-Like PCB), including fine-line routing, small via structures, and associated DFM constraints Working knowledge of Signal and power integrity simulation tools and DFM analysis workflows

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    {
      "text": "What you will do",
      "content": "\n<li><strong>Technical Leadership</strong></li>\n\n<div>· Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry</div>\n<div>· Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling)</div>\n<div>· Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability</div>\n<div><strong>Advanced PCB Design &amp; Layout</strong></div>\n<div>· Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance</div>\n<div>· Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals</div>\n<div>· Design robust power distribution networks and grounding structures</div>\n<div>· Apply advanced shielding and isolation techniques for EMI/EMC control</div>\n<div><strong>Fabrication &amp; Assembly Interface</strong></div>\n<div>· Lead DFM/DFA reviews with PCB fabrication and assembly partners</div>\n<div>· Resolve complex DFM issues related to:</div>\n<div>o HDI structures and sequential lamination</div>\n<div>o Via consolidation, backdrilling, and drill count reduction</div>\n<div>o Stackup optimization for yield and cost</div>\n<div>· Optimize designs for manufacturability, reliability, and volume production</div>\n<div><strong>Cross-Functional Collaboration</strong></div>\n<div>· Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle</div>\n<div>· Support board bring-up, debug, ECOs, and production transitions</div>\n<div>· Mentor and technically guide junior PCB layout engineers</div>\n<div><strong>Documentation &amp; Process Ownership</strong></div>\n<div>· Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++)</div>\n<div>· Establish, maintain, and enforce PCB layout standards and best practices</div>\n<div>· Drive continuous improvement in layout quality, DFM compliance, and cost efficiency</div>\n<div>&nbsp;</div>"
    },
    {
      "text": "What you bring to this role",
      "content": "\n<li>10+ years of hands-on PCB layout experience delivering complex designs from concept to production</li>\n<li>Expert-level proficiency in PCB layout tools such as Altium Designer, Cadence Allegro</li>\n<li><strong>Deep understanding of:</strong></li>\n<li>Controlled-impedance routing and signal integrity fundamentals</li>\n<li>Power integrity, grounding, and EMI/EMC best practices</li>\n<li>PCB materials, stackups, and fabrication processes</li>\n<li>HDI PCB design, advanced via structures, and manufacturing constraints</li>\n<li><strong>Experience with:</strong></li>\n<li>High-speed interfaces (PCIe, Ethernet, DDR, JESD, SERDES)</li>\n<li>RF and mixed-signal PCB layouts</li>\n<li>Aerospace, data center, or high-reliability hardware designs</li>\n"
    },
    {
      "text": "Bonus points for the following ",
      "content": "\n<li>Bachelor’s degree in electrical engineering, Computer Engineering, or a related field (Master’s degree is a plus).</li>\n<li>Familiarity with advanced PCB fabrication technologies such as mSAP (Modified Semi-Additive Process) and SLP (Substrate-Like PCB), including fine-line routing, small via structures, and associated DFM constraints</li>\n<li>Working knowledge of Signal and power integrity simulation tools and DFM analysis workflows</li>\n"
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