Home › Companies › B1D0AE68AD38E442432CFA0419D13913 › Process Engineer
Process Engineer
B1D0AE68AD38E442432CFA0419D13913 · PHOENIX, AZ 85021; 9601 N Black Canyon Hwy, PHOENIX, AZ, 85021, USA · Active · Paycom ATS
Job facts
| Field | Value |
|---|---|
| Company | B1D0AE68AD38E442432CFA0419D13913 |
| Title | Process Engineer |
| Normalized title | - |
| Department / team | Engineering |
| Location | PHOENIX, AZ, United States |
| Work model | - |
| Employment type | Full Time |
| Salary | - |
| Status | active |
| ATS provider | Paycom ATS |
| Posted / first seen | 2026-06-01 / 2026-06-02 |
| Changed / last seen | 2026-06-02 / 2026-06-06 |
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| Page | What it contains | Open |
|---|---|---|
| Company jobs | Active postings from B1D0AE68AD38E442432CFA0419D13913. | Open |
| Company breakdowns | Role, location, ATS, and work model facets for this company. | Open |
| ATS provider jobs | Active postings observed through Paycom ATS. | Open |
| Provider filtered search | The same provider as a filtered job collection. | Open |
| City jobs | Active postings in PHOENIX. | Open |
| Department jobs | Active postings in Engineering. | Open |
| Lifecycle events | Open, update, close, and reopen events for this posting. | Open |
| Original posting | Canonical source or apply URL captured from the ATS. | Open |
Linked records
| Company | B1D0AE68AD38E442432CFA0419D13913 |
| Source | 8b555684-0b87-4a89-b43c-de8893daa417 |
| ATS provider | Paycom ATS |
Description
Description
The Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high-mix PCB assembly environment. This role supports SMT, reflow, AOI/X-ray, selective solder, hand solder, mechanical assembly, and NPI builds by ensuring processes are stable, repeatable, documented, and capable of delivering high yields with minimal rework.
This is a hands-on, floor-focused engineering role—Titan expects the Process Engineer to be visible on the production line, solving issues in real time, tightening process controls, and owning yield performance and escape reduction within their area.
Key Responsibilities
Process Development & Optimization
Develop, refine, and sustain manufacturing processes for SMT, reflow, selective solder, wave, hand solder, mechanical assembly, and conformal coating.
Build stable process windows, define critical parameters, and enforce discipline around their use.
Optimize equipment setup, changeover, programming, and material flow to improve throughput and reduce labor hours.
Perform DOE, capability studies, and data-driven problem-solving to identify improvement opportunities.
SMT & AOI Engineering Support
Create, modify, and maintain SMT programs (pick/place, fiducials, feeders, offsets).
Develop accurate stencil aperture designs and drive proper stencil ordering.
Profile ovens and maintain reflow parameters to meet solder quality requirements.
Create and maintain AOI programs with correct calls, tolerances, and defect libraries.
Support X-ray inspection criteria and programming.
NPI Readiness & DFM
Participate in early design reviews; identify DFM issues and alternatives.
Validate BOMs, AVL requirements, tooling, fixtures, and build documentation before release.
Drive complete NPI packages—routing, travelers, process sheets, reflow profiles, tooling—and support first-article builds.
Quality, Yield, & Escape Reduction
Investigate chronic defects, scrap patterns, and rework trends; implement permanent corrective actions.
Support Quality on 8D, 5-Why, and root-cause activities.
Work cross-functionally with Quality, Production, and Engineering to resolve issues quickly.
Ensure parameters and documentation match AS9100 requirements—no undocumented shop-floor changes.
Documentation & Training
Maintain accurate, controlled work instructions, setup guides, reflow profiles, SMT build sheets, and AOI specs.
Train technicians, operators, and production staff on new processes and updates.
Ensure all process documentation remains synchronized with current revision levels.
Equipment & Tooling Support
Support preventive maintenance standards for process equipment.
Assist in identifying and justifying capital equipment improvements.
Design or source tooling, fixtures, and work aids as needed.
Qualifications
Required Experience
2–5+ years of process engineering experience in PCB assembly or electronics manufacturing.
Hands-on SMT, reflow profiling, AOI programming, or selective solder experience.
Strong understanding of soldering fundamentals, IPC-A-610, J-STD-001, and general electronics manufacturing practices.
Ability to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets.
Proficiency with data analysis, SPC, and problem-solving tools.
Preferred Experience
High-mix, low/medium-volume PCB assembly environment.
Aerospace/defense manufacturing or AS9100 familiarity.
Experience with DOE, capability studies, or statistical analysis tools.
Experience with fixture/tooling design (3D CAD skills a plus).
ERP experience (Cetec preferred).
Key Competencies / Behaviors
Floor-first mentality: Visible, responsive, and deeply engaged with production.
Technical depth: Understands why processes work—not just how.
Data-driven: Uses measured evidence to drive decisions and validate improvements.
Documentation discipline: No undocumented changes or tribal knowledge workflows.
Urgency: Moves fast when quality or production flow is at risk.
Problem-solving depth: Fixes root causes—doesn’t patch symptoms.
Clear communicator: Direct, concise, and factual in updates and escalations.
Ownership mindset: Treats yield and escapes as personal responsibilities.
Physical & Work Environment Requirements
Extensive time on the production floor in SMT, soldering, and assembly areas.
Occasional lifting of tooling, fixtures, or equipment components (~25 lbs).
Work in ESD-controlled environments with relevant PPE.
Full job record
| Job ID | 414e1686fc44b3c5a64ef6b844e7981925f7b41b |
| Org ID | a3dbc8c8-8a66-45c0-8f3b-675423ced95d |
| Source ID | 8b555684-0b87-4a89-b43c-de8893daa417 |
| Board ID | 8b555684-0b87-4a89-b43c-de8893daa417 |
| Provider | paycom |
| Provider Job Key | 42376 |
| Title | Process Engineer |
| Normalized Title | — |
| Status | active |
| Active | yes |
| Location Text | PHOENIX, AZ 85021; 9601 N Black Canyon Hwy, PHOENIX, AZ, 85021, USA |
| Department | Engineering |
| Team | — |
| Employment Type | full_time |
| Workplace Type | — |
| Remote Policy | — |
| Country | United States |
| Region | AZ |
| City | PHOENIX |
| Salary Raw | Description The Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high-mix PCB assembly environment. This role supports SMT, reflow, AOI/X-ray, selective solder, hand solder, mechanical assembly, and NPI builds by ensuring processes are stable, repeatable, documented, and capable of delivering high yields with minimal rework. This is a hands-on, floor-focused engineering role—Titan expects the Process Engineer to be visible on the production line, solving issues in real time, tightening process controls, and owning yield performance and escape reduction within their area. Key Responsibilities Process Development & Optimization Develop, refine, and sustain manufacturing processes for SMT, reflow, selective solder, wave, hand solder, mechanical assembly, and conformal coating. Build stable process windows, define critical parameters, and enforce discipline around their use. Optimize equipment setup, changeover, programming, and material flow to improve throughput and reduce labor hours. Perform DOE, capability studies, and data-driven problem-solving to identify improvement opportunities. SMT & AOI Engineering Support Create, modify, and maintain SMT programs (pick/place, fiducials, feeders, offsets). Develop accurate stencil aperture designs and drive proper stencil ordering. Profile ovens and maintain reflow parameters to meet solder quality requirements. Create and maintain AOI programs with correct calls, tolerances, and defect libraries. Support X-ray inspection criteria and programming. NPI Readiness & DFM Participate in early design reviews; identify DFM issues and alternatives. Validate BOMs, AVL requirements, tooling, fixtures, and build documentation before release. Drive complete NPI packages—routing, travelers, process sheets, reflow profiles, tooling—and support first-article builds. Quality, Yield, & Escape Reduction Investigate chronic defects, scrap patterns, and rework trends; implement permanent corrective actions. Support Quality on 8D, 5-Why, and root-cause activities. Work cross-functionally with Quality, Production, and Engineering to resolve issues quickly. Ensure parameters and documentation match AS9100 requirements—no undocumented shop-floor changes. Documentation & Training Maintain accurate, controlled work instructions, setup guides, reflow profiles, SMT build sheets, and AOI specs. Train technicians, operators, and production staff on new processes and updates. Ensure all process documentation remains synchronized with current revision levels. Equipment & Tooling Support Support preventive maintenance standards for process equipment. Assist in identifying and justifying capital equipment improvements. Design or source tooling, fixtures, and work aids as needed. Qualifications Required Experience 2–5+ years of process engineering experience in PCB assembly or electronics manufacturing. Hands-on SMT, reflow profiling, AOI programming, or selective solder experience. Strong understanding of soldering fundamentals, IPC-A-610, J-STD-001, and general electronics manufacturing practices. Ability to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets. Proficiency with data analysis, SPC, and problem-solving tools. Preferred Experience High-mix, low/medium-volume PCB assembly environment. Aerospace/defense manufacturing or AS9100 familiarity. Experience with DOE, capability studies, or statistical analysis tools. Experience with fixture/tooling design (3D CAD skills a plus). ERP experience (Cetec preferred). Key Competencies / Behaviors Floor-first mentality: Visible, responsive, and deeply engaged with production. Technical depth: Understands why processes work—not just how. Data-driven: Uses measured evidence to drive decisions and validate improvements. Documentation discipline: No undocumented changes or tribal knowledge workflows. Urgency: Moves fast when quality or production flow is at risk. Problem-solving depth: Fixes root causes—doesn’t patch symptoms. Clear communicator: Direct, concise, and factual in updates and escalations. Ownership mindset: Treats yield and escapes as personal responsibilities. Physical & Work Environment Requirements Extensive time on the production floor in SMT, soldering, and assembly areas. Occasional lifting of tooling, fixtures, or equipment components (~25 lbs). Work in ESD-controlled environments with relevant PPE. |
| Salary Min | — |
| Salary Max | — |
| Salary Currency | — |
| Salary Period | — |
| Source URL | https://www.paycomonline.net/v4/ats/web.php/jobs/ViewJobDetails?job=42376&clientkey=B1D0AE68AD38E442432CFA0419D13913 |
| Apply URL | https://www.paycomonline.net/v4/ats/web.php/jobs/ViewJobDetails?job=42376&clientkey=B1D0AE68AD38E442432CFA0419D13913 |
| First Seen At | 2026-06-02 10:07:55Z |
| Last Seen At | 2026-06-06 09:53:21Z |
| Last Checked At | 2026-06-06 09:53:21Z |
| Last Changed At | 2026-06-02 10:07:55Z |
| Inactive At | — |
| Source Posted At | 2026-06-01 00:00:00Z |
| Source Updated At | — |
| Raw Payload Uri | s3://job-postings-prod-raw-590183727216/raw/provider=paycom/board=B1D0AE68AD38E442432CFA0419D13913/date=2026-06-06/2026-06-06T09-53-20-206Z-afae523f9f6b8029867efedf60f1bc918e4bb4c5a162d6674d5bb8970827ad7d.json |
Event Fields
{
"content_hash": "0126b117bf95b103167cfba3ad2362546c9ff490575406031c8824ee3e93e8ef",
"source_hash": "6acf4a96cdae8416502b141c1998da31f5fed43f56bc519da241c92f132e1909",
"last_changed_at": "2026-06-02T10:07:55.622Z",
"active_status": "active"
}Parsed Structured
{
"language": "en",
"location": {
"raw": "PHOENIX, AZ 85021; 9601 N Black Canyon Hwy, PHOENIX, AZ, 85021, USA",
"city": "PHOENIX",
"region": "AZ",
"country": "United States",
"is_remote": false,
"confidence": 0.8
},
"salary_max": null,
"salary_min": null,
"inferred_at": "2026-06-06T09:53:21.719Z",
"launch_scope": {
"reason": "english_us_canada",
"included": true,
"language": "en",
"location": {
"raw": "PHOENIX, AZ 85021; 9601 N Black Canyon Hwy, PHOENIX, AZ, 85021, USA",
"city": "PHOENIX",
"region": "AZ",
"country": "United States",
"is_remote": false,
"confidence": 0.8
},
"countries": [
"United States"
]
},
"remote_policy": null,
"salary_period": null,
"workplace_type": null,
"salary_currency": null
}Extensions
{}Native Structured
{
"detail": {
"city": "PHOENIX",
"jobId": 42376,
"level": "",
"endDate": "",
"legalId": 89,
"isHotJob": false,
"jobShift": "Day",
"jobTitle": "Process Engineer",
"location": "PHOENIX, AZ 85021",
"startDate": "",
"clientCode": "18L89",
"remoteType": "",
"description": "<p>The Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high-mix PCB assembly environment. This role supports SMT, reflow, AOI/X-ray, selective solder, hand solder, mechanical assembly, and NPI builds by ensuring processes are stable, repeatable, documented, and capable of delivering high yields with minimal rework.</p>\n\n<p>This is a <strong>hands-on, floor-focused</strong> engineering role—Titan expects the Process Engineer to be visible on the production line, solving issues in real time, tightening process controls, and owning yield performance and escape reduction within their area.</p>\n\n<h1><strong>Key Responsibilities</strong></h1>\n\n<h2><strong>Process Development & Optimization</strong></h2>\n\n<ul>\n\t<li>\n\t<p>Develop, refine, and sustain manufacturing processes for SMT, reflow, selective solder, wave, hand solder, mechanical assembly, and conformal coating.</p>\n\t</li>\n\t<li>\n\t<p>Build stable process windows, define critical parameters, and enforce discipline around their use.</p>\n\t</li>\n\t<li>\n\t<p>Optimize equipment setup, changeover, programming, and material flow to improve throughput and reduce labor hours.</p>\n\t</li>\n\t<li>\n\t<p>Perform DOE, capability studies, and data-driven problem-solving to identify improvement opportunities.</p>\n\t</li>\n</ul>\n\n<h2><strong>SMT & AOI Engineering Support</strong></h2>\n\n<ul>\n\t<li>\n\t<p>Create, modify, and maintain SMT programs (pick/place, fiducials, feeders, offsets).</p>\n\t</li>\n\t<li>\n\t<p>Develop accurate stencil aperture designs and drive proper stencil ordering.</p>\n\t</li>\n\t<li>\n\t<p>Profile ovens and maintain reflow parameters to meet solder quality requirements.</p>\n\t</li>\n\t<li>\n\t<p>Create and maintain AOI programs with correct calls, tolerances, and defect libraries.</p>\n\t</li>\n\t<li>\n\t<p>Support X-ray inspection criteria and programming.</p>\n\t</li>\n</ul>\n\n<h2><strong>NPI Readiness & DFM</strong></h2>\n\n<ul>\n\t<li>\n\t<p>Participate in early design reviews; identify DFM issues and alternatives.</p>\n\t</li>\n\t<li>\n\t<p>Validate BOMs, AVL requirements, tooling, fixtures, and build documentation before release.</p>\n\t</li>\n\t<li>\n\t<p>Drive complete NPI packages—routing, travelers, process sheets, reflow profiles, tooling—and support first-article builds.</p>\n\t</li>\n</ul>\n\n<h2><strong>Quality, Yield, & Escape Reduction</strong></h2>\n\n<ul>\n\t<li>\n\t<p>Investigate chronic defects, scrap patterns, and rework trends; implement permanent corrective actions.</p>\n\t</li>\n\t<li>\n\t<p>Support Quality on 8D, 5-Why, and root-cause activities.</p>\n\t</li>\n\t<li>\n\t<p>Work cross-functionally with Quality, Production, and Engineering to resolve issues quickly.</p>\n\t</li>\n\t<li>\n\t<p>Ensure parameters and documentation match AS9100 requirements—no undocumented shop-floor changes.</p>\n\t</li>\n</ul>\n\n<h2><strong>Documentation & Training</strong></h2>\n\n<ul>\n\t<li>\n\t<p>Maintain accurate, controlled work instructions, setup guides, reflow profiles, SMT build sheets, and AOI specs.</p>\n\t</li>\n\t<li>\n\t<p>Train technicians, operators, and production staff on new processes and updates.</p>\n\t</li>\n\t<li>\n\t<p>Ensure all process documentation remains synchronized with current revision levels.</p>\n\t</li>\n</ul>\n\n<h2><strong>Equipment & Tooling Support</strong></h2>\n\n<ul>\n\t<li>\n\t<p>Support preventive maintenance standards for process equipment.</p>\n\t</li>\n\t<li>\n\t<p>Assist in identifying and justifying capital equipment improvements.</p>\n\t</li>\n\t<li>\n\t<p>Design or source tooling, fixtures, and work aids as needed.</p>\n\t</li>\n</ul>",
"jobCategory": "Engineering",
"salaryRange": "",
"socialMedia": {
"xLink": {
"text": "Titan%2520Circuits%2520Job%2520Opportunity%2520Process%2520Engineer"
},
"emailLink": {
"subject": "Titan%20Circuits%20Job%20Opportunity%20Process%20Engineer",
"summary": "The%20Process%20Engineer%20is%20responsible%20for%20developing%2C%20improving%2C%20and%20sustaining%20manufacturing%20processes%20across%20Titan%20Circuits%E2%80%99%20high-mix%20PCB%20assembly%20environment.%20This%20role%20supports%20SMT%2C%20reflow%2C%20AOI%2FX-ray%2C%20selective%20solder%2C%20hand%20solder%2C%20mechanical%20assembly%2C%20and%20NPI%20builds%20by%20ensuring%20processes%20are%20stable%2C%20repeatable%2C%20documented%2C%20and%20capable%20of%20delivering%20high%20yields%20with%20minimal%20rework.%0A%0AThis%20is%20a%20hands-on%2C%20floor-focused%20engineering%20role%E2%80%94Titan%20expects%20the%20Process%20Engineer%20to%20be%20visible%20on%20the%20production%20line%2C%20solving%20issues%20in%20real%20time%2C%20tightening%20process%20controls%2C%20and%20owning%20yield%20performance%20and%20escape%20reduction%20within%20their%20area.%0A%0AKey%20Responsibilities%0A%0AProcess%20Development%20%26%20Optimization%0A%0A%0A%09%0A%09Develop%2C%20refine%2C%20and%20sustain%20manufacturing%20processes%20for%20SMT%2C%20reflow%2C%20selective%20solder%2C%20wave%2C%20hand%20solder%2C%20mechanical%20assembly%2C%20and%20conformal%20coating.%0A%09%0A%09%0A%09Build%20stable%20process%20windows%2C%20define%20critical%20parameters%2C%20and%20enforce%20discipline%20around%20their%20use.%0A%09%0A%09%0A%09Optimize%20equipment%20setup%2C%20changeover%2C%20programming%2C%20and..."
},
"facebookLink": {
"redirectUri": "",
"facebookAppId": "773759036043100"
},
"linkedInLink": {}
},
"isQuickApply": false,
"positionType": "Full Time",
"countryPaidIn": "",
"googleJobJson": "{\"@context\":\"https://schema.org/\",\"@type\":\"JobPosting\",\"title\":\"Process Engineer\",\"identifier\":\"J18L8942376\",\"url\":\"https://www.paycomonline.net/v4/ats/web.php/portal/B1D0AE68AD38E442432CFA0419D13913/jobs/42376\",\"image\":\"https://www.paycomonline.net/v4/ats/web.php/application/style/logo?clientkey=B1D0AE68AD38E442432CFA0419D13913\",\"datePosted\":\"2026-06-01\",\"description\":\"Job DetailsJob Location: PHOENIX, AZ 85021Position Type: Full TimeJob Shift: DayJob Category: EngineeringThe Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high-mix PCB assembly environment. This role supports SMT, reflow, AOI/X-ray, selective solder, hand solder, mechanical assembly, and NPI builds by ensuring processes are stable, repeatable, documented, and capable of delivering high yields with minimal rework.\\n\\nThis is a hands-on, floor-focused engineering role—Titan expects the Process Engineer to be visible on the production line, solving issues in real time, tightening process controls, and owning yield performance and escape reduction within their area.\\n\\nKey Responsibilities\\n\\nProcess Development & Optimization\\n\\n\\n\\t\\n\\tDevelop, refine, and sustain manufacturing processes for SMT, reflow, selective solder, wave, hand solder, mechanical assembly, and conformal coating.\\n\\t\\n\\t\\n\\tBuild stable process windows, define critical parameters, and enforce discipline around their use.\\n\\t\\n\\t\\n\\tOptimize equipment setup, changeover, programming, and material flow to improve throughput and reduce labor hours.\\n\\t\\n\\t\\n\\tPerform DOE, capability studies, and data-driven problem-solving to identify improvement opportunities.\\n\\t\\n\\n\\nSMT & AOI Engineering Support\\n\\n\\n\\t\\n\\tCreate, modify, and maintain SMT programs (pick/place, fiducials, feeders, offsets).\\n\\t\\n\\t\\n\\tDevelop accurate stencil aperture designs and drive proper stencil ordering.\\n\\t\\n\\t\\n\\tProfile ovens and maintain reflow parameters to meet solder quality requirements.\\n\\t\\n\\t\\n\\tCreate and maintain AOI programs with correct calls, tolerances, and defect libraries.\\n\\t\\n\\t\\n\\tSupport X-ray inspection criteria and programming.\\n\\t\\n\\n\\nNPI Readiness & DFM\\n\\n\\n\\t\\n\\tParticipate in early design reviews; identify DFM issues and alternatives.\\n\\t\\n\\t\\n\\tValidate BOMs, AVL requirements, tooling, fixtures, and build documentation before release.\\n\\t\\n\\t\\n\\tDrive complete NPI packages—routing, travelers, process sheets, reflow profiles, tooling—and support first-article builds.\\n\\t\\n\\n\\nQuality, Yield, & Escape Reduction\\n\\n\\n\\t\\n\\tInvestigate chronic defects, scrap patterns, and rework trends; implement permanent corrective actions.\\n\\t\\n\\t\\n\\tSupport Quality on 8D, 5-Why, and root-cause activities.\\n\\t\\n\\t\\n\\tWork cross-functionally with Quality, Production, and Engineering to resolve issues quickly.\\n\\t\\n\\t\\n\\tEnsure parameters and documentation match AS9100 requirements—no undocumented shop-floor changes.\\n\\t\\n\\n\\nDocumentation & Training\\n\\n\\n\\t\\n\\tMaintain accurate, controlled work instructions, setup guides, reflow profiles, SMT build sheets, and AOI specs.\\n\\t\\n\\t\\n\\tTrain technicians, operators, and production staff on new processes and updates.\\n\\t\\n\\t\\n\\tEnsure all process documentation remains synchronized with current revision levels.\\n\\t\\n\\n\\nEquipment & Tooling Support\\n\\n\\n\\t\\n\\tSupport preventive maintenance standards for process equipment.\\n\\t\\n\\t\\n\\tAssist in identifying and justifying capital equipment improvements.\\n\\t\\n\\t\\n\\tDesign or source tooling, fixtures, and work aids as needed.\\n\\t\\nQualificationsRequired Experience\\n\\n\\n\\t\\n\\t2–5+ years of process engineering experience in PCB assembly or electronics manufacturing.\\n\\t\\n\\t\\n\\tHands-on SMT, reflow profiling, AOI programming, or selective solder experience.\\n\\t\\n\\t\\n\\tStrong understanding of soldering fundamentals, IPC-A-610, J-STD-001, and general electronics manufacturing practices.\\n\\t\\n\\t\\n\\tAbility to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets.\\n\\t\\n\\t\\n\\tProficiency with data analysis, SPC, and problem-solving tools.\\n\\t\\n\\n\\nPreferred Experience\\n\\n\\n\\t\\n\\tHigh-mix, low/medium-volume PCB assembly environment.\\n\\t\\n\\t\\n\\tAerospace/defense manufacturing or AS9100 familiarity.\\n\\t\\n\\t\\n\\tExperience with DOE, capability studies, or statistical analysis tools.\\n\\t\\n\\t\\n\\tExperience with fixture/tooling design (3D CAD skills a plus).\\n\\t\\n\\t\\n\\tERP experience (Cetec preferred).\\n\\t\\n\\n\\nKey Competencies / Behaviors\\n\\n\\n\\t\\n\\tFloor-first mentality: Visible, responsive, and deeply engaged with production.\\n\\t\\n\\t\\n\\tTechnical depth: Understands why processes work—not just how.\\n\\t\\n\\t\\n\\tData-driven: Uses measured evidence to drive decisions and validate improvements.\\n\\t\\n\\t\\n\\tDocumentation discipline: No undocumented changes or tribal knowledge workflows.\\n\\t\\n\\t\\n\\tUrgency: Moves fast when quality or production flow is at risk.\\n\\t\\n\\t\\n\\tProblem-solving depth: Fixes root causes—doesn’t patch symptoms.\\n\\t\\n\\t\\n\\tClear communicator: Direct, concise, and factual in updates and escalations.\\n\\t\\n\\t\\n\\tOwnership mindset: Treats yield and escapes as personal responsibilities.\\n\\t\\n\\n\\nPhysical & Work Environment Requirements\\n\\n\\n\\t\\n\\tExtensive time on the production floor in SMT, soldering, and assembly areas.\\n\\t\\n\\t\\n\\tOccasional lifting of tooling, fixtures, or equipment components (~25 lbs).\\n\\t\\n\\t\\n\\tWork in ESD-controlled environments with relevant PPE.\\n\\t\\n\",\"responsibilities\":\"The Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high-mix PCB assembly environment. This role supports SMT, reflow, AOI/X-ray, selective solder, hand solder, mechanical assembly, and NPI builds by ensuring processes are stable, repeatable, documented, and capable of delivering high yields with minimal rework.\\n\\nThis is a hands-on, floor-focused engineering role—Titan expects the Process Engineer to be visible on the production line, solving issues in real time, tightening process controls, and owning yield performance and escape reduction within their area.\\n\\nKey Responsibilities\\n\\nProcess Development & Optimization\\n\\n\\n\\t\\n\\tDevelop, refine, and sustain manufacturing processes for SMT, reflow, selective solder, wave, hand solder, mechanical assembly, and conformal coating.\\n\\t\\n\\t\\n\\tBuild stable process windows, define critical parameters, and enforce discipline around their use.\\n\\t\\n\\t\\n\\tOptimize equipment setup, changeover, programming, and material flow to improve throughput and reduce labor hours.\\n\\t\\n\\t\\n\\tPerform DOE, capability studies, and data-driven problem-solving to identify improvement opportunities.\\n\\t\\n\\n\\nSMT & AOI Engineering Support\\n\\n\\n\\t\\n\\tCreate, modify, and maintain SMT programs (pick/place, fiducials, feeders, offsets).\\n\\t\\n\\t\\n\\tDevelop accurate stencil aperture designs and drive proper stencil ordering.\\n\\t\\n\\t\\n\\tProfile ovens and maintain reflow parameters to meet solder quality requirements.\\n\\t\\n\\t\\n\\tCreate and maintain AOI programs with correct calls, tolerances, and defect libraries.\\n\\t\\n\\t\\n\\tSupport X-ray inspection criteria and programming.\\n\\t\\n\\n\\nNPI Readiness & DFM\\n\\n\\n\\t\\n\\tParticipate in early design reviews; identify DFM issues and alternatives.\\n\\t\\n\\t\\n\\tValidate BOMs, AVL requirements, tooling, fixtures, and build documentation before release.\\n\\t\\n\\t\\n\\tDrive complete NPI packages—routing, travelers, process sheets, reflow profiles, tooling—and support first-article builds.\\n\\t\\n\\n\\nQuality, Yield, & Escape Reduction\\n\\n\\n\\t\\n\\tInvestigate chronic defects, scrap patterns, and rework trends; implement permanent corrective actions.\\n\\t\\n\\t\\n\\tSupport Quality on 8D, 5-Why, and root-cause activities.\\n\\t\\n\\t\\n\\tWork cross-functionally with Quality, Production, and Engineering to resolve issues quickly.\\n\\t\\n\\t\\n\\tEnsure parameters and documentation match AS9100 requirements—no undocumented shop-floor changes.\\n\\t\\n\\n\\nDocumentation & Training\\n\\n\\n\\t\\n\\tMaintain accurate, controlled work instructions, setup guides, reflow profiles, SMT build sheets, and AOI specs.\\n\\t\\n\\t\\n\\tTrain technicians, operators, and production staff on new processes and updates.\\n\\t\\n\\t\\n\\tEnsure all process documentation remains synchronized with current revision levels.\\n\\t\\n\\n\\nEquipment & Tooling Support\\n\\n\\n\\t\\n\\tSupport preventive maintenance standards for process equipment.\\n\\t\\n\\t\\n\\tAssist in identifying and justifying capital equipment improvements.\\n\\t\\n\\t\\n\\tDesign or source tooling, fixtures, and work aids as needed.\\n\\t\\n\",\"employmentType\":\"FULL_TIME\",\"hiringOrganization\":{\"@type\":\"Organization\",\"name\":\"Titan Circuits\",\"logo\":\"https://www.paycomonline.net/v4/ats/web.php/application/style/logo?clientkey=B1D0AE68AD38E442432CFA0419D13913\"},\"jobLocation\":{\"@type\":\"Place\",\"address\":{\"streetAddress\":\"9601 N Black Canyon Hwy\",\"addressLocality\":\"PHOENIX\",\"addressRegion\":\"AZ\",\"postalCode\":85021,\"addressCountry\":\"USA\"}},\"qualifications\":\"Required Experience\\n\\n\\n\\t\\n\\t2–5+ years of process engineering experience in PCB assembly or electronics manufacturing.\\n\\t\\n\\t\\n\\tHands-on SMT, reflow profiling, AOI programming, or selective solder experience.\\n\\t\\n\\t\\n\\tStrong understanding of soldering fundamentals, IPC-A-610, J-STD-001, and general electronics manufacturing practices.\\n\\t\\n\\t\\n\\tAbility to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets.\\n\\t\\n\\t\\n\\tProficiency with data analysis, SPC, and problem-solving tools.\\n\\t\\n\\n\\nPreferred Experience\\n\\n\\n\\t\\n\\tHigh-mix, low/medium-volume PCB assembly environment.\\n\\t\\n\\t\\n\\tAerospace/defense manufacturing or AS9100 familiarity.\\n\\t\\n\\t\\n\\tExperience with DOE, capability studies, or statistical analysis tools.\\n\\t\\n\\t\\n\\tExperience with fixture/tooling design (3D CAD skills a plus).\\n\\t\\n\\t\\n\\tERP experience (Cetec preferred).\\n\\t\\n\\n\\nKey Competencies / Behaviors\\n\\n\\n\\t\\n\\tFloor-first mentality: Visible, responsive, and deeply engaged with production.\\n\\t\\n\\t\\n\\tTechnical depth: Understands why processes work—not just how.\\n\\t\\n\\t\\n\\tData-driven: Uses measured evidence to drive decisions and validate improvements.\\n\\t\\n\\t\\n\\tDocumentation discipline: No undocumented changes or tribal knowledge workflows.\\n\\t\\n\\t\\n\\tUrgency: Moves fast when quality or production flow is at risk.\\n\\t\\n\\t\\n\\tProblem-solving depth: Fixes root causes—doesn’t patch symptoms.\\n\\t\\n\\t\\n\\tClear communicator: Direct, concise, and factual in updates and escalations.\\n\\t\\n\\t\\n\\tOwnership mindset: Treats yield and escapes as personal responsibilities.\\n\\t\\n\\n\\nPhysical & Work Environment Requirements\\n\\n\\n\\t\\n\\tExtensive time on the production floor in SMT, soldering, and assembly areas.\\n\\t\\n\\t\\n\\tOccasional lifting of tooling, fixtures, or equipment components (~25 lbs).\\n\\t\\n\\t\\n\\tWork in ESD-controlled environments with relevant PPE.\\n\\t\\n\",\"experienceRequirements\":\"Required Experience\\n\\n\\n\\t\\n\\t2–5+ years of process engineering experience in PCB assembly or electronics manufacturing.\\n\\t\\n\\t\\n\\tHands-on SMT, reflow profiling, AOI programming, or selective solder experience.\\n\\t\\n\\t\\n\\tStrong understanding of soldering fundamentals, IPC-A-610, J-STD-001, and general electronics manufacturing practices.\\n\\t\\n\\t\\n\\tAbility to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets.\\n\\t\\n\\t\\n\\tProficiency with data analysis, SPC, and problem-solving tools.\\n\\t\\n\\n\\nPreferred Experience\\n\\n\\n\\t\\n\\tHigh-mix, low/medium-volume PCB assembly environment.\\n\\t\\n\\t\\n\\tAerospace/defense manufacturing or AS9100 familiarity.\\n\\t\\n\\t\\n\\tExperience with DOE, capability studies, or statistical analysis tools.\\n\\t\\n\\t\\n\\tExperience with fixture/tooling design (3D CAD skills a plus).\\n\\t\\n\\t\\n\\tERP experience (Cetec preferred).\\n\\t\\n\\n\\nKey Competencies / Behaviors\\n\\n\\n\\t\\n\\tFloor-first mentality: Visible, responsive, and deeply engaged with production.\\n\\t\\n\\t\\n\\tTechnical depth: Understands why processes work—not just how.\\n\\t\\n\\t\\n\\tData-driven: Uses measured evidence to drive decisions and validate improvements.\\n\\t\\n\\t\\n\\tDocumentation discipline: No undocumented changes or tribal knowledge workflows.\\n\\t\\n\\t\\n\\tUrgency: Moves fast when quality or production flow is at risk.\\n\\t\\n\\t\\n\\tProblem-solving depth: Fixes root causes—doesn’t patch symptoms.\\n\\t\\n\\t\\n\\tClear communicator: Direct, concise, and factual in updates and escalations.\\n\\t\\n\\t\\n\\tOwnership mindset: Treats yield and escapes as personal responsibilities.\\n\\t\\n\\n\\nPhysical & Work Environment Requirements\\n\\n\\n\\t\\n\\tExtensive time on the production floor in SMT, soldering, and assembly areas.\\n\\t\\n\\t\\n\\tOccasional lifting of tooling, fixtures, or equipment components (~25 lbs).\\n\\t\\n\\t\\n\\tWork in ESD-controlled environments with relevant PPE.\\n\\t\\n\",\"industry\":\"Engineering\",\"validThrough\":\"-0001-11-30\",\"workHours\":\"Day\"}",
"applyAvailable": true,
"educationLevel": "",
"qualifications": "<h1><strong>Required Experience</strong></h1>\n\n<ul>\n\t<li>\n\t<p>2–5+ years of process engineering experience in PCB assembly or electronics manufacturing.</p>\n\t</li>\n\t<li>\n\t<p>Hands-on SMT, reflow profiling, AOI programming, or selective solder experience.</p>\n\t</li>\n\t<li>\n\t<p>Strong understanding of soldering fundamentals, IPC-A-610, J-STD-001, and general electronics manufacturing practices.</p>\n\t</li>\n\t<li>\n\t<p>Ability to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets.</p>\n\t</li>\n\t<li>\n\t<p>Proficiency with data analysis, SPC, and problem-solving tools.</p>\n\t</li>\n</ul>\n\n<h1><strong>Preferred Experience</strong></h1>\n\n<ul>\n\t<li>\n\t<p>High-mix, low/medium-volume PCB assembly environment.</p>\n\t</li>\n\t<li>\n\t<p>Aerospace/defense manufacturing or AS9100 familiarity.</p>\n\t</li>\n\t<li>\n\t<p>Experience with DOE, capability studies, or statistical analysis tools.</p>\n\t</li>\n\t<li>\n\t<p>Experience with fixture/tooling design (3D CAD skills a plus).</p>\n\t</li>\n\t<li>\n\t<p>ERP experience (Cetec preferred).</p>\n\t</li>\n</ul>\n\n<h1><strong>Key Competencies / Behaviors</strong></h1>\n\n<ul>\n\t<li>\n\t<p><strong>Floor-first mentality:</strong> Visible, responsive, and deeply engaged with production.</p>\n\t</li>\n\t<li>\n\t<p><strong>Technical depth:</strong> Understands why processes work—not just how.</p>\n\t</li>\n\t<li>\n\t<p><strong>Data-driven:</strong> Uses measured evidence to drive decisions and validate improvements.</p>\n\t</li>\n\t<li>\n\t<p><strong>Documentation discipline:</strong> No undocumented changes or tribal knowledge workflows.</p>\n\t</li>\n\t<li>\n\t<p><strong>Urgency:</strong> Moves fast when quality or production flow is at risk.</p>\n\t</li>\n\t<li>\n\t<p><strong>Problem-solving depth:</strong> Fixes root causes—doesn’t patch symptoms.</p>\n\t</li>\n\t<li>\n\t<p><strong>Clear communicator:</strong> Direct, concise, and factual in updates and escalations.</p>\n\t</li>\n\t<li>\n\t<p><strong>Ownership mindset:</strong> Treats yield and escapes as personal responsibilities.</p>\n\t</li>\n</ul>\n\n<h1><strong>Physical & Work Environment Requirements</strong></h1>\n\n<ul>\n\t<li>\n\t<p>Extensive time on the production floor in SMT, soldering, and assembly areas.</p>\n\t</li>\n\t<li>\n\t<p>Occasional lifting of tooling, fixtures, or equipment components (~25 lbs).</p>\n\t</li>\n\t<li>\n\t<p>Work in ESD-controlled environments with relevant PPE.</p>\n\t</li>\n</ul>",
"descriptionTitle": "Description",
"travelPercentage": "",
"jobYoutubeVideoId": "",
"legalRevisionDate": {
"date": "2025-09-10T17:27:44.000Z",
"timezone": "America/Chicago",
"timezone_type": 3
},
"secondaryLocations": [],
"primaryPhoneCountry": "US",
"primaryPhoneEnabled": true,
"qualificationsTitle": "Qualifications",
"primaryPhoneRequired": false,
"primaryPhoneNumberDoesNotExist": false
},
"preview": {
"jobId": 42376,
"isHotJob": false,
"jobTitle": "Process Engineer",
"postedOn": "",
"locations": "PHOENIX, AZ 85021",
"remoteType": "",
"description": "The Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high-mix PCB assembly env...",
"positionType": "Full Time"
},
"detail_meta": {
"url": "https://portal-applicant-tracking.us-cent.paycomonline.net/api/ats/job-postings/42376",
"http_status": 200,
"content_type": "application/json",
"response_bytes": 25857
},
"detail_errors": []
}Get this page with API
Rendered from the bluedoor Job Postings API. Reproduce it:
GET https://api.bluedoor.sh/job-postings/v1/jobs/414e1686fc44b3c5a64ef6b844e7981925f7b41b?include=descriptionJSONGET https://api.bluedoor.sh/job-postings/v1/orgs/a3dbc8c8-8a66-45c0-8f3b-675423ced95dJSONGET https://api.bluedoor.sh/job-postings/v1/sources/8b555684-0b87-4a89-b43c-de8893daa417JSONGET https://api.bluedoor.sh/job-postings/v1/jobs/414e1686fc44b3c5a64ef6b844e7981925f7b41b/eventsJSON