bluedoor data·Job Postings API·bluedoor.sh ↗

Home › Companies › Eridu › Senior Thermal Engineer

Senior Thermal Engineer

Eridu · Saratoga, CA, United States · On Site · Active · Rippling ATS

Job facts

FieldValue
CompanyEridu
TitleSenior Thermal Engineer
Normalized title-
Department / teamSystems Engineering
LocationSaratoga, CA, United States
Work modelOn Site
Employment typeFull Time
Salary-
Statusactive
ATS providerRippling ATS
Posted / first seen2026-03-25 / 2026-05-29
Changed / last seen2026-06-06 / 2026-06-06

Related slices

PageWhat it containsOpen
Company jobsActive postings from Eridu.Open
Company breakdownsRole, location, ATS, and work model facets for this company.Open
ATS provider jobsActive postings observed through Rippling ATS.Open
Provider filtered searchThe same provider as a filtered job collection.Open
City jobsActive postings in Saratoga.Open
Department jobsActive postings in Systems Engineering.Open
Work model jobsActive On Site postings.Open
Lifecycle eventsOpen, update, close, and reopen events for this posting.Open
Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyEridu
Source2e3b3faf-1f18-443b-b03c-ab436c316a6b
ATS providerRippling ATS

Description

company About Eridu Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver Faster AI . Today’s AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innovations across silicon, packaging, software, and systems to deliver an order of magnitude improvement in performance and unlock greater GPU utilization to speed training job completion times and tokens-per-second for more profitable inference. We do this while simultaneously reducing capital and power costs and improving reliability. The company’s solutions and value proposition have been widely validated by leading hyperscalers. Eridu has raised over $200M to date including its most recent, oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (the world’s leading micro-LED company). The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon, packaging, optics, software, and systems. Eridu is working with best-in-class supply chain partners including silicon, packaging and systems. Visit our website eridu.ai to learn more. role About the Role We are seeking an innovative and experienced Senior Liquid Cooling Thermal Engineer, including manifold design and its connectivity, to lead the thermal architecture, analysis, and validation of high-performance computing and communication hardware. This role requires deep expertise in electronics thermal management, system-level integration, and advanced cooling technologies, along with the ability to drive thermal design decisions across silicon, package, module, and system boundaries. The Senior Thermal Engineer will work closely with mechanical, electrical, packaging, and manufacturing teams to ensure thermal solutions meet performance, reliability, and scalability requirements from concept through high-volume production.. Key Responsibilities Thermal Architecture & Design: Define and drive liquid cooling thermal architecture for rack-mounted systems, compute modules, and advanced packages. Establish thermal requirements, budgets, and margins to meet system performance and reliability goals. Thermal Modeling & Simulation: Develop and execute steady-state and transient thermal simulations at die, package (CoWoS, SoW), module, and system levels. Use simulation results to guide design tradeoffs, cooling technology selection, and system integration decisions. Advanced Cooling Solutions: Design and evaluate thermal solutions including cold plates, heat sinks, heat spreaders, manifolds, TIMs, and system airflow. Support innovation in liquid cooling approaches for high-power, high-density electronics. Prototyping & Testing: Define thermal test strategies and instrumentation plans. Execute thermal characterization, power mapping, and correlation of lab data with simulation results. Drive design iterations based on test outcomes. Cross-Functional Collaboration: Partner closely with mechanical, electrical, packaging, and manufacturing engineers to ensure thermal considerations are integrated into system, enclosure, and package designs. Collaborate with external partners (ODMs, OSATs, cooling vendors) as needed. Design for Manufacturability & Risk Mitigation: Apply thermal DFM principles early in the design cycle. Participate in FMEA activities, identify thermal risks, and lead mitigation strategies to address reliability, yield, and manufacturability challenges. Documentation & Communication: Develop comprehensive thermal documentation, including requirements, specifications, simulation reports, test plans, and validation summaries. Present findings and recommendations to technical and non-technical stakeholders. Quality & Reliability Support: Support qualification and reliability testing efforts, including thermal cycling and stress testing, and ensure compliance with relevant industry standards. Minimum Qualifications Bachelor’s or Master’s degree in Mechanical/Thermal Engineering, or a related field 5+ years of experience in liquid cooling thermal engineering for electronics, with a proven track record of bringing products from concept to high-volume production Strong knowledge of heat transfer and thermal management for electronics systems, including package- and system-level cooling Experience with thermal simulation tools such as Icepak, Flotherm, COMSOL, or ANSYS Familiarity with thermal validation, lab instrumentation, and data analysis Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams Preferred Qualifications Ph.D. in Mechanical/Thermal Engineering, or a related field 10+ years of experience in thermal design for high-performance computing, AI, or communication hardware Experience with advanced packaging and high-power-density modules (e.g., multi-die, chiplet-based systems) Experience designing and deploying liquid cooling solutions, including cold plates, manifolds, and CDUs Understanding of thermo-mechanical interactions such as warpage, CTE mismatch, and TIM behavior Experience collaborating with ODMs, OSATs, and manufacturing partners to solve thermal and integration challenges Experience with statistical or data analysis tools such as JMP is a plus Why Join Us? At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers. The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles. Notice to Recruiting Agencies Eridu does not accept unsolicited resumes or candidate profiles from staffing agencies or third-party recruiters. Any candidate submitted to Eridu without prior written authorization from our recruiting team will be considered unsolicited and will become the property of Eridu. Eridu reserves the right to pursue and hire such candidates without any obligation to pay fees. Recruiting agencies are expressly instructed not to contact hiring managers, employees, or executives regarding open positions.

Full job record

Job ID3a60ead2ec65cb70b0d331fe61154eabeb08289b
Org IDd05d9cdc-fa71-444b-b57a-6140fe525606
Source ID2e3b3faf-1f18-443b-b03c-ab436c316a6b
Board ID2e3b3faf-1f18-443b-b03c-ab436c316a6b
Providerrippling
Provider Job Key1123f9e7-cbcb-4051-956e-533c55bb0561
TitleSenior Thermal Engineer
Normalized Title—
Statusactive
Activeyes
Location TextSaratoga, CA, United States
DepartmentSystems Engineering
Team—
Employment Typefull_time
Workplace Typeon_site
Remote Policy—
CountryUnited States
RegionCA
CitySaratoga
Salary Raw—
Salary Min—
Salary Max—
Salary Currency—
Salary Period—
Source URLhttps://ats.rippling.com/eridu-ai/jobs/1123f9e7-cbcb-4051-956e-533c55bb0561
Apply URLhttps://ats.rippling.com/eridu-ai/jobs/1123f9e7-cbcb-4051-956e-533c55bb0561
First Seen At2026-05-29 07:14:02Z
Last Seen At2026-06-06 19:44:35Z
Last Checked At2026-06-06 19:44:35Z
Last Changed At2026-06-06 19:44:35Z
Inactive At—
Source Posted At2026-03-25 00:02:45Z
Source Updated At—
Raw Payload Uris3://job-postings-prod-raw-590183727216/raw/provider=rippling/board=eridu-ai/date=2026-06-06/2026-06-06T19-44-33-762Z-4b761a1811184974f9facfa7bb3d3a7e8696180848a08b199b5b79a934e7d18e.json
Event Fields
{
  "content_hash": "678c49e59de9f4edf76702cd5dc019c508d1a89b4b2504236e9f0bcdec3bae9e",
  "source_hash": "1fff4b40b448f3c6ea987e95336fbcbf81ef5a9f5085ec53d6a27ce840e23ad4",
  "last_changed_at": "2026-06-06T19:44:35.572Z",
  "active_status": "active"
}
Parsed Structured
{
  "language": "en-us",
  "location": {
    "raw": "Saratoga, CA, United States",
    "city": "Saratoga",
    "region": "CA",
    "country": "United States",
    "is_remote": false,
    "confidence": 0.98,
    "workplace_type": "on_site"
  },
  "salary_max": null,
  "salary_min": null,
  "inferred_at": "2026-06-06T19:44:35.571Z",
  "launch_scope": {
    "reason": "english_us_canada",
    "included": true,
    "language": "en-us",
    "location": {
      "raw": "Saratoga, CA, United States",
      "city": "Saratoga",
      "region": "CA",
      "country": "United States",
      "is_remote": false,
      "confidence": 0.98,
      "workplace_type": "on_site"
    },
    "countries": [
      "United States"
    ]
  },
  "remote_policy": null,
  "salary_period": null,
  "workplace_type": "on_site",
  "salary_currency": null
}
Extensions
{}
Native Structured
{
  "list_job": {
    "id": "1123f9e7-cbcb-4051-956e-533c55bb0561",
    "url": "https://ats.rippling.com/eridu-ai/jobs/1123f9e7-cbcb-4051-956e-533c55bb0561",
    "name": "Senior Thermal Engineer ",
    "language": "en-US",
    "locations": [
      {
        "city": "Saratoga",
        "name": "Saratoga, CA",
        "state": "California",
        "country": "United States",
        "stateCode": "CA",
        "countryCode": "US",
        "workplaceType": "ON_SITE"
      }
    ],
    "department": {
      "name": "Systems Engineering"
    }
  },
  "detail_job": {
    "url": "https://ats.rippling.com/eridu-ai/jobs/1123f9e7-cbcb-4051-956e-533c55bb0561",
    "name": "Senior Thermal Engineer ",
    "uuid": "1123f9e7-cbcb-4051-956e-533c55bb0561",
    "board": {
      "logo": {
        "url": "https://secured-assets.ripplingcdn.com/us1/ats/6602cd8c72e7d7408d83a88f/ats_public/4819dea78df74ec490ef4449133be866-sensitive.png?Expires=1780861475&Signature=VZ11HZ9nf2k1jY-CqdxdpYLV-xSm5984stmPxR4uM2ZZwQ3TMU6fjc7ocWpEJpQPjN2~keGfCdClCiOJzsmKL0MqFmnen3PCLvqexFX~7SZ98z3YE3WHnSGFBJ7ulevO6nsh~-L6iUAGCHfai0cNYTdELuo9LRyFBQ8IFrPQROh-2dt1JGxjyRNMDB8PJVfU3FQegEVYYaSO9HA2fUEf856B26BROYWk06Gyj7xrqxkZRp5oHbVCvMvSVYIwcHuyfsH6CoSllc0TNFpl~Dwve4AMBGCzw1h1X1Mqcm-fk3FmDZURfmdb1BQPhYc2qYLFpZ1siaiZD7IiLPWxgKNDFw__&Key-Pair-Id=K2SM3GXN9F9XGM",
        "name": "Eridu_Full Logo.png",
        "type": "image/png"
      },
      "slug": "eridu-ai",
      "title": "Eridu Careers",
      "banner": {
        "url": null,
        "name": "",
        "type": ""
      },
      "boardURL": "https://ats.rippling.com/eridu-ai/jobs",
      "fontType": null,
      "subtitle": null,
      "boardType": "RIPPLING",
      "linkColor": "#000000",
      "buttonColor": "#000000",
      "legalNotice": null,
      "buttonTextColor": null,
      "noOpeningsMessage": null,
      "groupJobsByLocation": false,
      "showBoardLogoOnJobPost": true,
      "showCompanyInfoUnderJobPost": false
    },
    "createdOn": "2026-03-24T17:02:45.258000-07:00",
    "department": {
      "name": "Systems Engineering",
      "base_department": "Systems Engineering",
      "department_tree": [
        "Systems Engineering"
      ]
    },
    "companyName": "Eridu",
    "description": {
      "role": "<meta><h6 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:13pt;font-weight:600;letter-spacing:0.25px;margin-top:8px;margin-bottom:4px;text-align:start;padding-left:0px;\"><span style=\"white-space:pre-wrap;\">About the Role</span></h6><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"white-space:pre-wrap;\">We are seeking an innovative and experienced Senior Liquid Cooling Thermal Engineer, including manifold design and its connectivity, to lead the thermal architecture, analysis, and validation of high-performance computing and communication hardware. This role requires deep expertise in electronics thermal management, system-level integration, and advanced cooling technologies, along with the ability to drive thermal design decisions across silicon, package, module, and system boundaries.</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><br></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"white-space:pre-wrap;\">The Senior Thermal Engineer will work closely with mechanical, electrical, packaging, and manufacturing teams to ensure thermal solutions meet performance, reliability, and scalability requirements from concept through high-volume production..</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;text-align:start;\"><br></p><h6 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:13pt;font-weight:600;letter-spacing:0.25px;margin-top:8px;margin-bottom:4px;text-align:start;padding-left:0px;\"><span style=\"white-space:pre-wrap;\">Key Responsibilities</span></h6><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Thermal Architecture &amp; Design:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Define and drive liquid cooling thermal architecture for rack-mounted systems, compute modules, and advanced packages. Establish thermal requirements, budgets, and margins to meet system performance and reliability goals.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Thermal Modeling &amp; Simulation:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Develop and execute steady-state and transient thermal simulations at die, package (CoWoS, SoW), module, and system levels. Use simulation results to guide design tradeoffs, cooling technology selection, and system integration decisions.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Advanced Cooling Solutions:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Design and evaluate thermal solutions including cold plates, heat sinks, heat spreaders, manifolds, TIMs, and system airflow. Support innovation in liquid cooling approaches for high-power, high-density electronics.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Prototyping &amp; Testing:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Define thermal test strategies and instrumentation plans. Execute thermal characterization, power mapping, and correlation of lab data with simulation results. Drive design iterations based on test outcomes.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Cross-Functional Collaboration:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Partner closely with mechanical, electrical, packaging, and manufacturing engineers to ensure thermal considerations are integrated into system, enclosure, and package designs. Collaborate with external partners (ODMs, OSATs, cooling vendors) as needed.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Design for Manufacturability &amp; Risk Mitigation:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Apply thermal DFM principles early in the design cycle. Participate in FMEA activities, identify thermal risks, and lead mitigation strategies to address reliability, yield, and manufacturability challenges.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Documentation &amp; Communication:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Develop comprehensive thermal documentation, including requirements, specifications, simulation reports, test plans, and validation summaries. Present findings and recommendations to technical and non-technical stakeholders.</span></li></ul></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Quality &amp; Reliability Support:</span></li><li style=\"font-size:11pt;list-style:none;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><ul data-pattern=\"discCircleSquare\" data-depth=\"2\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin-left:0px;margin-right:0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:circle;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Support qualification and reliability testing efforts, including thermal cycling and stress testing, and ensure compliance with relevant industry standards.</span></li></ul></li></ul><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><br></p><h6 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:13pt;font-weight:600;letter-spacing:0.25px;margin-top:8px;margin-bottom:4px;text-align:start;padding-left:0px;\"><span style=\"white-space:pre-wrap;\">Minimum Qualifications</span></h6><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Bachelor’s or Master’s degree in Mechanical/Thermal Engineering, or a related field</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">5+ years of experience in liquid cooling thermal engineering for electronics, with a proven track record of bringing products from concept to high-volume production</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Strong knowledge of heat transfer and thermal management for electronics systems, including package- and system-level cooling</span><span style=\"font-size:7pt;white-space:pre-wrap;\"> </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Experience with thermal simulation tools such as Icepak, Flotherm, COMSOL, or ANSYS</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Familiarity with thermal validation, lab instrumentation, and data analysis</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;\"><span style=\"white-space:pre-wrap;\">Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams</span></li></ul><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;text-align:start;\"><br></p><h6 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:13pt;font-weight:600;letter-spacing:0.25px;margin-top:8px;margin-bottom:4px;text-align:start;padding-left:0px;\"><span style=\"white-space:pre-wrap;\">Preferred Qualifications</span></h6><ul data-pattern=\"discCircleSquare\" data-depth=\"1\" style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;margin:8px 0px;line-height:1.6;padding:0px 0px 0px 32px;list-style-type:disc;\"><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">Ph.D. in Mechanical/Thermal Engineering, or a related field </span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">10+ years of experience in thermal design for high-performance computing, AI, or communication hardware</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">Experience with advanced packaging and high-power-density modules (e.g., multi-die, chiplet-based systems)</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">Experience designing and deploying liquid cooling solutions, including cold plates, manifolds, and CDUs</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">Understanding of thermo-mechanical interactions such as warpage, CTE mismatch, and TIM behavior</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">Experience collaborating with ODMs, OSATs, and manufacturing partners to solve thermal and integration challenges</span></li><li style=\"font-size:11pt;margin:3px 0px;letter-spacing:0.25px;line-height:1.6;text-align:start;\"><span style=\"white-space:pre-wrap;\">Experience with statistical or data analysis tools such as JMP is a plus </span></li></ul><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;text-align:start;\"><br></p><h5 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:15pt;font-weight:600;letter-spacing:0px;margin-top:10px;margin-bottom:4px;padding-left:0px;\"><b><strong style=\"white-space:pre-wrap;\">Why Join Us?</strong></b></h5><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"color:black;font-size:11pt;white-space:pre-wrap;\">At Eridu, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI infrastructure solutions, transforming the performance of AI data centers.&nbsp;</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"color:black;font-size:11pt;white-space:pre-wrap;\">&nbsp;</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"color:black;font-size:11pt;white-space:pre-wrap;\">The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.&nbsp;</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">&nbsp;</span></p><h6 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:13pt;font-weight:600;letter-spacing:0.25px;margin-top:8px;margin-bottom:4px;padding-left:0px;\"><b><strong style=\"white-space:pre-wrap;\">Notice to Recruiting Agencies</strong></b></h6><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Eridu does not accept unsolicited resumes or candidate profiles from staffing agencies or third-party recruiters. Any candidate submitted to Eridu without prior written authorization from our recruiting team will be considered unsolicited and will become the property of Eridu. Eridu reserves the right to pursue and hire such candidates without any obligation to pay fees. Recruiting agencies are expressly instructed not to contact hiring managers, employees, or executives regarding open positions.</span></p>",
      "company": "<meta><h1 style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;line-height:1.6;font-size:18pt;font-weight:600;letter-spacing:1px;margin-top:24px;margin-bottom:4px;padding-left:0px;\"><b><strong style=\"color:black;white-space:pre-wrap;\">About Eridu </strong></b></h1><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver </span><i><em style=\"font-size:11pt;white-space:pre-wrap;\">Faster AI</em></i><span style=\"font-size:11pt;white-space:pre-wrap;\">. Today’s AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innovations across silicon, packaging, software, and systems to deliver an order of magnitude improvement in performance and unlock greater GPU utilization to speed training job completion times and tokens-per-second for more profitable inference. We do this while simultaneously reducing capital and power costs and improving reliability.</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">&nbsp;</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">The company’s solutions and value proposition have been widely validated by leading hyperscalers.</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">&nbsp;</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Eridu has raised over $200M to date including its most recent, oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (the world’s leading micro-LED company). The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon, packaging, optics, software, and systems. Eridu is working with best-in-class supply chain partners including silicon, packaging and systems.</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">&nbsp;</span></p><p style=\"font-family:&quot;Basel Grotesk&quot;,Arial,sans-serif;font-size:11pt;font-weight:400;line-height:1.6;letter-spacing:0.25px;margin:4px 0px;padding:0px;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">Visit our website </span><a href=\"http://eridu.ai\" target=\"_blank\" class=\"css-173makr-linkStyle\" style=\"color:rgb(30,74,169);cursor:pointer;\"><span style=\"font-size:11pt;white-space:pre-wrap;\">eridu.ai</span></a><span style=\"font-size:11pt;white-space:pre-wrap;\"> to learn more.</span></p>"
    },
    "workLocations": [
      "Saratoga, CA"
    ],
    "employmentType": {
      "id": "Salaried, full-time",
      "label": "SALARIED_FT"
    },
    "payRangeDetails": [],
    "activeJobApplication": {
      "basicQuestions": [
        {
          "oid": "first_name",
          "title": "First name",
          "required": true,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "last_name",
          "title": "Last name",
          "required": true,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "email",
          "title": "Email",
          "required": true,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "current_company",
          "title": "Current company",
          "required": true,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "phone_number",
          "title": "Phone number",
          "required": true,
          "fieldType": "PHONE_NUMBER"
        },
        {
          "oid": "location",
          "title": "Location (city only)",
          "required": true,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "linkedin_link",
          "title": "LinkedIn link",
          "required": true,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "website_link",
          "title": "Website link",
          "required": false,
          "fieldType": "SHORT_ANSWER"
        },
        {
          "oid": "resume",
          "title": "Resume",
          "required": true,
          "fieldType": "FILE"
        },
        {
          "oid": "cover_letter",
          "title": "Cover letter",
          "required": false,
          "fieldType": "FILE"
        }
      ],
      "customQuestions": {
        "fields": [
          {
            "oid": "first_name",
            "title": "First name",
            "required": true,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "last_name",
            "title": "Last name",
            "required": true,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "email",
            "title": "Email",
            "required": true,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "current_company",
            "title": "Current company",
            "required": true,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "phone_number",
            "title": "Phone number",
            "required": true,
            "fieldData": {},
            "fieldType": "PHONE_NUMBER"
          },
          {
            "oid": "location",
            "title": "Location (city only)",
            "required": true,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "linkedin_link",
            "title": "LinkedIn link",
            "required": true,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "website_link",
            "title": "Website link",
            "required": false,
            "fieldData": {},
            "fieldType": "SHORT_ANSWER"
          },
          {
            "oid": "resume",
            "title": "Resume",
            "required": true,
            "fieldData": {},
            "fieldType": "FILE"
          },
          {
            "oid": "cover_letter",
            "title": "Cover letter",
            "required": false,
            "fieldData": {},
            "fieldType": "FILE"
          }
        ]
      },
      "additionalQuestions": null
    },
    "hasAIEvaluationsEnabled": true,
    "eeocQuestionnaireEnabled": true,
    "applicationConfirmationTemplate": "66170c04267c15f732be1cf5",
    "eeocQuestionnaireEnabledForJobPost": true
  },
  "detail_meta": {
    "url": "https://ats.rippling.com/api/v2/board/eridu-ai/jobs/1123f9e7-cbcb-4051-956e-533c55bb0561",
    "http_status": 200,
    "content_type": "application/json",
    "response_bytes": 24294
  },
  "detail_errors": []
}
Get this page with API

Rendered from the bluedoor Job Postings API. Reproduce it:

GET https://api.bluedoor.sh/job-postings/v1/jobs/3a60ead2ec65cb70b0d331fe61154eabeb08289b?include=descriptionJSON
GET https://api.bluedoor.sh/job-postings/v1/orgs/d05d9cdc-fa71-444b-b57a-6140fe525606JSON
GET https://api.bluedoor.sh/job-postings/v1/sources/2e3b3faf-1f18-443b-b03c-ab436c316a6bJSON
GET https://api.bluedoor.sh/job-postings/v1/jobs/3a60ead2ec65cb70b0d331fe61154eabeb08289b/eventsJSON

Docs · Get an API key