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HomeCompaniesCareers Rambus Icims ComSenior Package Design Engineer

Senior Package Design Engineer

Careers Rambus Icims Com · San Jose, CA, US · Remote · Deleted · $110,700–$205,700 / week · iCIMS

Job facts

FieldValue
CompanyCareers Rambus Icims Com
TitleSenior Package Design Engineer
Normalized title-
Department / teamSupply Chain & Corporate Operations
LocationSan Jose, CA, United States
Work modelRemote / Remote
Employment typeOTHER
Salary$110,700–$205,700 / week
Statusdeleted
ATS provideriCIMS
Posted / first seen2026-02-25 / 2026-05-31
Changed / last seen2026-06-13 / 2026-06-11

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PageWhat it containsOpen
Company jobsActive postings from Careers Rambus Icims Com.Open
Company breakdownsRole, location, ATS, and work model facets for this company.Open
ATS provider jobsActive postings observed through iCIMS.Open
Provider filtered searchThe same provider as a filtered job collection.Open
City jobsActive postings in San Jose.Open
Department jobsActive postings in Supply Chain & Corporate Operations.Open
Work model jobsActive Remote postings.Open
Lifecycle eventsOpen, update, close, and reopen events for this posting.Open
Original postingCanonical source or apply URL captured from the ATS.Open

Linked records

CompanyCareers Rambus Icims Com
Source5640900c-750a-4bc5-8104-a0345cc43670
ATS provideriCIMS

Description

Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will be working with some of the brightest inventors and engineers in the world developing products that make data faster and safer. This is a full-time position reporting to the Director of Package Engineering. As a Senior Package Design Engineer, you will be responsible for supporting the design and layout of new products from early concept to tape out, focusing primarily on several elements that enable high-yielding, low defectivity production. The Senior Package Design Engineer will have the opportunity to work with multiple package technologies and outsourced suppliers to ensure manufacturing readiness for the Rambus product portfolio. Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work. Responsibilities Drive early chip-package co-design and development of bump and ball map. Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN. Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging) Analyze cost/performance/reliability trade-offs to complete layout of new products and test chips. Interact with OSAT partners and substrate/leadframe suppliers for design reviews and execution. Continuous improvement of package design workflow and unified package design guidelines. Assist with model creation for thermo-mechanical package simulations. Qualifications MS Degree in EE/CE Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD. 5+ years of experience in packaging design and layout, preferably in an advanced silicon node. Proven track record with multiple packaging types where products have gone to volume production. Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals. Knowledge of organic laminate substrate technologies and manufacturing capabilities. Awareness of JEDEC standards and other specifications that may govern package design. Understanding of package material properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc. Excellent communication, initiative, multi-tasking, and time management. Strong commitment and ability to work in cross functional and globally dispersed teams About Rambus Rambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. With over 30 years of semiconductor experience, we are a leading provider of high-performance products and innovations that maximize the bandwidth, capacity and security for AI and other data-intensive workloads. Our world-class team is the foundation of our company, and our innovative spirit drives us to develop the cutting-edge products and technologies essential for tomorrow’s systems. Rambus offers a competitive compensation package including base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program, and gym membership. The US salary range for this full-time position is $110,700 to $205,700. Our salary ranges are determined by role, level and location. The successful candidate’s starting pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. At Rambus, we are committed to fostering a workplace where every individual is respected, supported, and empowered to succeed. We value a range of perspectives and experiences that contribute to innovation and collaboration. Our goal is to ensure that all team members have equitable access to opportunities, resources, and a sense of belonging. We believe that a culture of fairness and inclusion helps us all do our best work. Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, or other applicable legally protected characteristics. Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans during our job application procedures. If you require assistance or an accommodation due to a disability, please feel free to inform us in your application. Rambus does not accept unsolicited resumes from headhunters, recruitment agencies or fee-based recruitment services. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/. #LI-HYBRID #LI-RF1

Full job record

Job ID3241c535d09c43937f9c3c626d8f6e7db1c42156
Org ID9ea4ad8c-8aa6-47c0-b3bf-f1b0dcb07f94
Source ID5640900c-750a-4bc5-8104-a0345cc43670
Board ID5640900c-750a-4bc5-8104-a0345cc43670
Providericims
Provider Job Key22873
TitleSenior Package Design Engineer
Normalized Title
Statusdeleted
Activeno
Location TextSan Jose, CA, US
DepartmentSupply Chain & Corporate Operations
Team
Employment TypeOTHER
Workplace Typeremote
Remote Policyremote
CountryUnited States
RegionCA
CitySan Jose
Salary RawOverview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will be working with some of the brightest inventors and engineers in the world developing products that make data faster and safer. This is a full-time position reporting to the Director of Package Engineering. As a Senior Package Design Engineer, you will be responsible for supporting the design and layout of new products from early concept to tape out, focusing primarily on several elements that enable high-yielding, low defectivity production. The Senior Package Design Engineer will have the opportunity to work with multiple package technologies and outsourced suppliers to ensure manufacturing readiness for the Rambus product portfolio. Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work. Responsibilities Drive early chip-package co-design and development of bump and ball map. Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN. Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging) Analyze cost/performance/reliability trade-offs to complete layout of new products and test chips. Interact with OSAT partners and substrate/leadframe suppliers for design reviews and execution. Continuous improvement of package design workflow and unified package design guidelines. Assist with model creation for thermo-mechanical package simulations. Qualifications MS Degree in EE/CE Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD. 5+ years of experience in packaging design and layout, preferably in an advanced silicon node. Proven track record with multiple packaging types where products have gone to volume production. Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals. Knowledge of organic laminate substrate technologies and manufacturing capabilities. Awareness of JEDEC standards and other specifications that may govern package design. Understanding of package material properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc. Excellent communication, initiative, multi-tasking, and time management. Strong commitment and ability to work in cross functional and globally dispersed teams About Rambus Rambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. With over 30 years of semiconductor experience, we are a leading provider of high-performance products and innovations that maximize the bandwidth, capacity and security for AI and other data-intensive workloads. Our world-class team is the foundation of our company, and our innovative spirit drives us to develop the cutting-edge products and technologies essential for tomorrow’s systems. Rambus offers a competitive compensation package including base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program, and gym membership. The US salary range for this full-time position is $110,700 to $205,700. Our salary ranges are determined by role, level and location. The successful candidate’s starting pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. At Rambus, we are committed to fostering a workplace where every individual is respected, supported, and empowered to succeed. We value a range of perspectives and experiences that contribute to innovation and collaboration. Our goal is to ensure that all team members have equitable access to opportunities, resources, and a sense of belonging. We believe that a culture of fairness and inclusion helps us all do our best work. Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, or other applicable legally protected characteristics. Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans during our job application procedures. If you require assistance or an accommodation due to a disability, please feel free to inform us in your application. Rambus does not accept unsolicited resumes from headhunters, recruitment agencies or fee-based recruitment services. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/. #LI-HYBRID #LI-RF1
Salary Min110,700
Salary Max205,700
Salary CurrencyUSD
Salary Periodweek
Source URLhttps://careers-rambus.icims.com/jobs/22873/senior-package-design-engineer/job
Apply URLhttps://careers-rambus.icims.com/jobs/22873/senior-package-design-engineer/job
First Seen At2026-05-31 18:40:29Z
Last Seen At2026-06-11 08:23:05Z
Last Checked At2026-06-13 08:21:33Z
Last Changed At2026-06-13 08:21:33Z
Inactive At2026-06-13 08:21:33Z
Source Posted At2026-02-25 05:00:00Z
Source Updated At2026-03-20 23:55:01Z
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