Back Grind/Back Metal Post Fab Engineer

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    "ExternalDescriptionStr": "<p><strong>onsemi</strong>&nbsp;is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development on new CMOS, BCD, Image Sensor, and other new/novel technologies.&nbsp; This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.&nbsp;</p>",
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    "CorporateDescriptionStr": "<div>\n <b>onsemi&nbsp;</b><span class=\"ui-provider\">(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.<br></span>\n</div>\n<div>\n <span class=\"ui-provider\"><br></span>\n</div>\n<div>\n <p style=\"margin: 0in\"><b><span style=\"font-weight: normal\">More details about our company benefits can be found here:</span></b></p>\n <p style=\"margin: 0in\"><a href=\"https://www.onsemi.com/careers/career-benefits\" target=\"_blank\" rel=\"nofollow\">https://www.onsemi.com/careers/career-benefits</a></p>\n</div>",
    "ExternalPostedStartDate": "2026-05-07T21:06:36+00:00",
    "ExternalQualificationsStr": "<p><strong>Required Qualifications:</strong>&nbsp;</p>\n<ul>\n <li>Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and yield improvement.</li>\n <li>Education:&nbsp; BS in Engineering or Material Science, MS or PhD preferred &nbsp;</li>\n <li>Experience: 6-10 years or more relevant experience in semiconductor manufacturing integration and technology development.&nbsp;</li>\n <li>Proven experience and a deep knowledge and understanding of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL, etc.</li>\n <li>Proven experience and a deep knowledge and understanding of power semiconductors, CMOS, and BCD integration is preferred.&nbsp;</li>\n <li>Assembly processing and advanced module construction are positive.</li>\n <li>Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Excensio, Spotfire, JMP, Minitab, etc.</li>\n <li>Knowledge and proven experience with DOE, 6-sigma, Lean, models-based problem solving, 5S, 8D, SPC, DOE, FMEA&nbsp;</li>\n <li>Ability to influence and lead decisions on capital equipment to enhance new technology capabilities and execution.</li>\n <li>Knowledge of assembly and package interconnect processes preferred.</li>\n <li>Experience using predictive thermo-mechanical simulations is preferred.</li>\n <li>Language Fluency – Fluent in English Language, written &amp; verbal&nbsp;</li>\n</ul>\n<p><i><strong><u>Salary:</u></strong></i>&nbsp;onsemi is excited to share the base salary range for this position is<strong>&nbsp;</strong>$114.000 to $193,700 exclusive of fringe benefits or potential bonuses.<strong>&nbsp;</strong>The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.&nbsp;<a href=\"https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf\" target=\"_blank\" rel=\"nofollow\">https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf</a></p>",
    "InternalQualificationsStr": "<p><strong>Required Qualifications:</strong>&nbsp;</p>\n<ul>\n <li>Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and yield improvement.</li>\n <li>Education:&nbsp; BS in Engineering or Material Science, MS or PhD preferred &nbsp;</li>\n <li>Experience: 6-10 years or more relevant experience in semiconductor manufacturing integration and technology development.&nbsp;</li>\n <li>Proven experience and a deep knowledge and understanding of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL, etc.</li>\n <li>Proven experience and a deep knowledge and understanding of power semiconductors, CMOS, and BCD integration is preferred.&nbsp;</li>\n <li>Assembly processing and advanced module construction are positive.</li>\n <li>Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Excensio, Spotfire, JMP, Minitab, etc.</li>\n <li>Knowledge and proven experience with DOE, 6-sigma, Lean, models-based problem solving, 5S, 8D, SPC, DOE, FMEA&nbsp;</li>\n <li>Ability to influence and lead decisions on capital equipment to enhance new technology capabilities and execution.</li>\n <li>Knowledge of assembly and package interconnect processes preferred.</li>\n <li>Experience using predictive thermo-mechanical simulations is preferred.</li>\n <li>Language Fluency – Fluent in English Language, written &amp; verbal&nbsp;</li>\n</ul>\n<p><i><strong><u>Salary:</u></strong></i>&nbsp;onsemi is excited to share the base salary range for this position is<strong>&nbsp;</strong>$114.000 to $193,700 exclusive of fringe benefits or potential bonuses.<strong>&nbsp;</strong>The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.&nbsp;<a href=\"https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf\" target=\"_blank\" rel=\"nofollow\">https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf</a></p>",
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