(Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d)

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{
  "id": "2612045",
  "name": "(Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d)",
  "office": "Stuttgart",
  "keywords": [],
  "schedule": "full-time",
  "createdAt": "2026-04-23T17:48:53+00:00",
  "seniority": "experienced",
  "department": "PIC DC",
  "occupation": "electrical_and_electronics_engineering",
  "subcompany": null,
  "employmentType": "permanent",
  "jobDescriptions": [
    {
      "name": "Your mission",
      "value": "The future of AI computing builds on light. Q.ANT is building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. Q.ANT’s photonic integrated circuits are at the heart of this technology.<br><br>You will drive the design, development, and optimisation of advanced PIC components - with a particular focus on state-of-the-art fiber-to-chip coupling and photonic packaging - driving solutions from initial concept through layout, fabrication, and production-ready integration.<br><br>As a technical lead for specific PIC components, you will drive innovation across the full photonic integration lifecycle, define design methodologies, and coordinate cross-functional teams from concept to production. Your expertise in fiber-to-chip coupling and packaging will directly distinguish Q.ANT’s photonic solutions and shape the company’s technology roadmap.<br><br>Location: Stuttgart, Germany<br>Type: Permanent employment, full-time<br>Work mode: Onsite with max. 1 day remote work per week<br><br><strong>What You Will Do</strong><ul><li>Drive the development of state-of-the-art fiber-to-chip coupling solutions for industry environments - driving mode matching, loss budget optimisation, and packaging integration from component design through production-ready delivery•     Lead the design, prototyping, and validation of specific photonic chip components - from concept through layout, tape-out coordination, fabrication, and packaging - ensuring all deliverables meet performance specifications and schedule targets</li><li>Implement photonic computing architectures on chip; drive innovation and new technology development in the PIC domain, proposing novel components and integration strategies that feed directly into Q.ANT’s product and technology roadmap</li><li>Coordinate cross-disciplinary engineering projects (design, development, integration, testing) from concept to production - working closely with packaging, test, and foundry teams; collect and consolidate specifications from stakeholders and translate them into circuit definitions</li><li>Mentor junior engineers and technicians; provide technical guidance and ensure effective collaboration across all project phases</li><li>Present complex technical findings and design decisions to both technical peers and executive-level stakeholders with clarity and precision</li></ul>"
    },
    {
      "name": "Your profile",
      "value": "<strong>Required:</strong><ul><li>Strong academic foundation in Photonics, Electrical Engineering, Applied Physics, or a related field (Master’s degree or PhD); equivalent industry experience considered</li><li>3+ years of proven hands-on experience in photonic design, layout, and tape-out coordination</li><li>In-depth expertise in fiber-to-chip coupling interfaces, including mode matching, packaging constraints, and loss budget management</li><li>Advanced proficiency in photonic simulation tools (e.g., Lumerical/Ansys, RSoft, Photon Design Suite, or equivalent) with demonstrated ability to produce design-ready simulation outputs</li><li>Solid practical experience with a PIC-specific layout tool (e.g., Nazca, GDSFactory, or Luceda) and advanced Python skills applied to photonic design workflows - automation, simulation scripting, and data analysis</li><li>Solid grounding in optical device characterization techniques and interpretation of optical/electrical test data</li><li>Proven ability to coordinate cross-functional technical investigations across teams without formal authority and strong communication skills at both technical and executive level</li><li>Proven track record collecting and consolidating specifications from stakeholders and translating them into circuit definitions</li><li>Fluent English; German is beneficial - working language in the team is English</li></ul><strong>Nice to have:</strong><br>None of the following are required - they are genuine bonuses and we do not expect any one candidate to bring all of them:<br><ul><li>First experimental experience with TFLN / LNOI</li><li>Understanding of AI or high-speed optical communication system requirements for PICs</li><li>Knowledge of mixed-signal and photonic/electronic co-packaging challenges</li><li>Experience with foundry collaboration and process transfer to external manufacturing partners</li></ul>"
    },
    {
      "name": "Why us?",
      "value": "<ul><li>Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes, high impact from day one</li><li>Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing</li><li>Own your work from day one: Shape characterization strategies, integration workflows, and roadmap inputs on your own, with direct impact on product success</li><li>Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP</li><li>World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, electronics, and packaging</li><li>Direct access to leadership: Work closely with the company’s founders, including CEO Dr. Michael Förtsch, and the Q.ANT senior leadership team</li><li>Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving</li><li>Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation</li></ul> <br>We are looking for a hands-on senior engineer who gets energized by designing and delivering advanced PIC components, pioneering fiber-to-chip coupling solutions, and directly shaping next-generation photonic technology.<br><br>Ready to push the boundaries of what photonic integrated circuits can do?<br>We are looking forward to receiving your application!<br> <br><em>Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.</em>"
    }
  ],
  "occupationCategory": "engineering",
  "recruitingCategory": "Permanent Employee"
}