Sr. Packaging Engineer - New Product Introduction

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    "heading": "Sr. Packaging Engineer - New Product Introduction",
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    "description_html": "<div class=\"job_description\">\n\t\t\t\t\t<p><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><strong>About Xanadu:</strong><br>Xanadu&#8217;s mission is to build quantum computers that are useful and available to people everywhere.<br><br>At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before.&#160; What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world&#8217;s most challenging problems and literally change the world. And that is something to be excited about!</span></span></p><p><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><strong>Your role and responsibilities:</strong></span></span><br><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">We are looking for a highly motivated and experienced Senior Packaging Engineer - New Product Introduction (NPI) to join our dedicated engineering team. In this pivotal role, you will lead the successful introduction of new packaging processes and technologies from concept to mass production. This involves collaborating with R&amp;D, design, manufacturing, and supply chain teams across the entire product lifecycle to ensure robust, scalable, and ultra-low-loss packaging solutions. The successful candidate will be working directly with machines as needed throughout the NPI process. Experience using and optimising FiconTEC equipment is required.</span></span></span></span></span></span></span></p><p style=\"line-height:1.38;margin-left:24px;text-indent:-18pt;margin-top:16px;margin-bottom:16px;padding:0pt 0pt 0pt 18pt;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Tasks include:</span></span></span></span></span></span></span></p><ul><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">New Process Development &amp; Implementation:</span></span></span><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\"> Lead the development, validation, and implementation of new packaging processes and equipment, from initial concept through pilot production to high-volume manufacturing.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Process Optimization &amp; Validation:</span></span></span><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\"> Hands-on conduct comprehensive process characterization, optimization, and validation for new packaging lines and equipment.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Equipment Selection &amp; Qualification:</span></span></span><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\"> Research, evaluate, select, and qualify new packaging equipment and materials, staying current with industry trends and advancements.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Troubleshooting &amp; Problem Solving:</span></span></span><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\"> Act as a subject matter expert in hands-on troubleshooting complex packaging process issues during NPI phases and provide ongoing production support.</span></span></span></span></span></span></span></li></ul><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Project Management:</span></span></span><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\"> Manage multiple NPI projects concurrently, ensuring timely delivery and strict adherence to all technical specifications.</span></span></span></span></span></span></span><p style=\"line-height:1.38;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><strong>Basic qualifications and experience:</strong></span></span></p><ul><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Basic understanding of photonic-based on-chip and off-chip systems.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Minimum of 5+ years of progressive experience in packaging engineering, with a strong emphasis on new product introduction (NPI) within a manufacturing environment.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Proven experience with various packaging technologies and equipment; experience with FiconTEC equipment is strictly required.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Excellent analytical and problem-solving skills, with a data-driven approach to decision-making.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Demonstrated ability to manage complex technical projects from conception to completion.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Exceptional communication, presentation, and interpersonal skills, capable of effectively collaborating with diverse teams and stakeholders.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools.</span></span></span></span></span></span></span></li></ul><p style=\"line-height:1.38;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:700;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Preferred qualifications and experience:</span></span></span></span></span></span></span></p><ul><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Strong understanding of photonic-based on-chip and off-chip systems.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Proven experience using advanced die-to-carrier, die-to-die, and die-to-wafer bonding techniques.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Experience with automation and robotics in packaging.</span></span></span></span></span></span></span></li><li style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\"><span style=\"font-variant:normal;white-space:pre-wrap;\"><span style=\"color:#000000;\"><span style=\"font-weight:400;\"><span style=\"font-style:normal;\"><span style=\"text-decoration:none;\">Familiarity with relevant industry standards and regulations.</span></span></span></span></span>&#160;&#160;</span></span></li></ul><div style=\"list-style-type:disc;\"><span style=\"font-family:Arial, Helvetica, sans-serif;\"><span style=\"font-size:14px;\">This is for a new position.&#160;Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 160,000 - 200,000+ CAD. You will also be eligible for equity and benefits.</span></span>",
    "description_text": "About Xanadu:\nXanadu’s mission is to build quantum computers that are useful and available to people everywhere.\nAt Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before.  What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems and literally change the world. And that is something to be excited about!\n Your role and responsibilities:\n We are looking for a highly motivated and experienced Senior Packaging Engineer - New Product Introduction (NPI) to join our dedicated engineering team. In this pivotal role, you will lead the successful introduction of new packaging processes and technologies from concept to mass production. This involves collaborating with R&D, design, manufacturing, and supply chain teams across the entire product lifecycle to ensure robust, scalable, and ultra-low-loss packaging solutions. The successful candidate will be working directly with machines as needed throughout the NPI process. Experience using and optimising FiconTEC equipment is required.\n Tasks include:\n New Process Development & Implementation: Lead the development, validation, and implementation of new packaging processes and equipment, from initial concept through pilot production to high-volume manufacturing.\n Process Optimization & Validation: Hands-on conduct comprehensive process characterization, optimization, and validation for new packaging lines and equipment.\n Equipment Selection & Qualification: Research, evaluate, select, and qualify new packaging equipment and materials, staying current with industry trends and advancements.\n Troubleshooting & Problem Solving: Act as a subject matter expert in hands-on troubleshooting complex packaging process issues during NPI phases and provide ongoing production support.\n Project Management: Manage multiple NPI projects concurrently, ensuring timely delivery and strict adherence to all technical specifications. Basic qualifications and experience:\n Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or a related technical field.\n Basic understanding of photonic-based on-chip and off-chip systems.\n Minimum of 5+ years of progressive experience in packaging engineering, with a strong emphasis on new product introduction (NPI) within a manufacturing environment.\n Proven experience with various packaging technologies and equipment; experience with FiconTEC equipment is strictly required.\n Excellent analytical and problem-solving skills, with a data-driven approach to decision-making.\n Demonstrated ability to manage complex technical projects from conception to completion.\n Exceptional communication, presentation, and interpersonal skills, capable of effectively collaborating with diverse teams and stakeholders.\n Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools.\n Preferred qualifications and experience:\n Strong understanding of photonic-based on-chip and off-chip systems.\n Proven experience using advanced die-to-carrier, die-to-die, and die-to-wafer bonding techniques.\n Experience with automation and robotics in packaging.\n Familiarity with relevant industry standards and regulations.\n This is for a new position. Your base salary will be determined based on your location, experience, and internal benchmarks. The base salary range is 160,000 - 200,000+ CAD. You will also be eligible for equity and benefits.",
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